Effect of high-temperature glass frit bonding process on performance of polysilicon strain gauges

2012 ◽  
Vol 7 (9) ◽  
pp. 932-935 ◽  
Author(s):  
Yongdae Kim ◽  
Sejin Kwon
Keyword(s):  
High Temperature ◽  
Glass Frit ◽  
Bonding Process ◽  
Strain Gauges

TLP Bonding Technologies for Micro Joining and 3D Packaging

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 001221-001252 ◽  
Author(s):  
Kei Murayama ◽  
Mitsuhiro Aizawa ◽  
Mitsutoshi Higashi
Keyword(s):  
High Temperature ◽  
Melting Point ◽  
Low Temperature ◽  
Wafer Bonding ◽  
Bonding Process ◽  
Tlp Bonding ◽  
Hermetic Sealing ◽  
Low Temperature Bonding ◽  
Free Material ◽  
Bonding Technique

The bonding technique for High density Flip Chip(F.C.) packages requires a low temperature and a low stress process to have high reliability of the micro joining ,especially that for sensor MEMS packages requires hermetic sealing so as to ensure their performance. The Transient Liquid Phase (TLP) bonding, that is a kind of diffusion bonding is a technique that connects the low melting point material such as Indium to the higher melting point metal such as Gold by the isothermal solidification and high-melting-point intermetallic compounds are formed. Therefore, it is a unique joining technique that can achieve not only the low temperature bonding and also the high temperature reliability. The Gold-Indium TLP bonding technique can join parts at 180 degree C and after bonding the melting point of the junction is shifted to more than 495 degree C, therefore itfs possible to apply the low temperature bonding lower than the general use as a lead free material such as a SAC and raise the melting point more than AuSn solder which is used for the high temperature reliability usage. Therefore, the heat stress caused by bonding process can be expected to be lowered. We examined wafer bonding and F.C bonding plus annealing technique by using electroplated Indium and Gold as a joint material. We confirmed that the shear strength obtained at the F.C. bonding plus anneal technique was equal with that of the wafer bonding process. Moreover, it was confirmed to ensure sufficient hermetic sealing in silicon cavity packages that had been bonded at 180 degree C. And the difference of the thermal stress that affect to the device by the bonding process was confirmed. In this paper, we report on various possible application of the TLP bonding.

Apparent strains in unmounted strain gauges at high temperature

Strain ◽  
1991 ◽  
Vol 27 (3) ◽  
pp. 95-103
Author(s):  
A Francis ◽  
K Haynes
Keyword(s):  
High Temperature ◽  
Strain Gauges

scholarly journals Advances in Thin Film Sensor Technologies for Engine Applications

1997 ◽  
Author(s):  
Jih-Fen Lei ◽  
Lisa C. Martin ◽  
Herbert A. Will
Keyword(s):  
Thin Film ◽  
High Temperature ◽  
High Speed ◽  
Ceramic Matrix Composites ◽  
Surface Strain ◽  
Research Center ◽  
Strain Gauges ◽  
Nasa Lewis Research ◽  
Film Sensor ◽  
Thin Film Sensor

Advanced thin film sensor techniques that can provide accurate surface strain and temperature measurements are being developed at NASA Lewis Research Center. These sensors are needed to provide minimally intrusive characterization of advanced materials (such as ceramics and composites) and structures (such as components for Space Shuttle Main Engine, High Speed Civil Transport, Advanced Subsonic Transports and General Aviation Aircraft) in hostile, high-temperature environments, and for validation of design codes. This paper presents two advanced thin film sensor technologies: strain gauges and thermocouples. These sensors are sputter deposited directly onto the test articles and are only a few micrometers thick; the surface of the test article is not structurally altered and there is minimal disturbance of the gas flow over the surface. The strain gauges are palladium-13% chromium based and the thermocouples are platinum-13% rhodium vs. platinum. The fabrication techniques of these thin film sensors in a class 1000 cleanroom at the NASA Lewis Research Center are described. Their demonstration on a variety of engine materials, including superalloys, ceramics and advanced ceramic matrix composites, in several hostile, high-temperature test environments are discussed.

Alloys for high temperature strain gauges

1963 ◽  
Vol 14 (4) ◽  
pp. 225-225
Author(s):  
K E Easterling
Keyword(s):  
High Temperature ◽  
Strain Gauges ◽  
Temperature Strain

Glass Frit Wafer Bonding - Sealed Cavity Pressure in Relation to Bonding Process Parameters

2016 ◽  
Vol 75 (9) ◽  
pp. 255-264 ◽  
Author(s):  
R. Knechtel ◽  
S. Dempwolf ◽  
H. Klingner
Keyword(s):  
Process Parameters ◽  
Wafer Bonding ◽  
Glass Frit ◽  
Bonding Process ◽  
Cavity Pressure

The Bondabilities of Various Metals Using Ag Metallo-Organic Nanoparticles and These Bonding Mechanisms

2005 ◽  
Author(s):  
Shinji Kobayashi ◽  
Eiichi Ide ◽  
Shinji Angata ◽  
Akio Hirose ◽  
Kojiro F. Kobayashi
Keyword(s):  
Free Energy ◽  
Shear Strength ◽  
High Temperature ◽  
Oxide Film ◽  
Standard Free Energy ◽  
Bonding Process ◽  
Oxide Formation ◽  
Cross Sectional ◽  
Organic Nanoparticles ◽  
Bonding Mechanisms

A novel bonding process using Ag metallo-organic nanoparticles has been proposed. This process is applicable to the alternative to the current high temperature solders, such as Pb-10Sn or Pb-20Sn. In this paper, Al, Ti, Ni, Cu, Ag and Au disc joints were made using the Ag metallo-organic nanoparticles in order to investigate the bondability of the various metals. These joints were evaluated based on the measurement of the shear strength, and the observation of the fracture surfaces and the cross-sectional microstructures. The shear strength of various metal joints increased in the following order: Al, Ti, Ni, Cu, Ag and Au joints. This corresponds to the order of the standard free energy value of the oxide formation for each metal. This result suggests that the carbon atoms generated by the decomposition of the organic shell of the Ag metallo-organic nanoparticles may play a role in deoxidizing the oxide film on the metal surface.

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