OS1112 Size Effect of Fatigue Slip Band Formation in Micron-/Submicron-scale Gold Single Crystal

2014 ◽  
Vol 2014 (0) ◽  
pp. _OS1112-1_-_OS1112-3_
Author(s):  
Takashi SUMIGAWA ◽  
Ryosuke SHIOHARA ◽  
Takayuki KITAMURA
Keyword(s):  
Size Effect ◽  
Single Crystal ◽  
Slip Band ◽  
Band Formation ◽  
Submicron Scale

Size effect in the low-field Hall coefficient of single-crystal copper films

1985 ◽  
Vol 61 (3-4) ◽  
pp. 281-289 ◽  
Author(s):  
I. Sakamoto ◽  
M. Fukuhara ◽  
Y. Koide ◽  
K. Yonemitsu
Keyword(s):  
Size Effect ◽  
Single Crystal ◽  
Hall Coefficient ◽  
Copper Films ◽  
Single Crystal Copper ◽  
Low Field

The mechanism of work-hardening and slip-band formation

1957 ◽  
Vol 242 (1229) ◽  
pp. 147-159 ◽  
Keyword(s):  
Single Crystals ◽  
Slip Band ◽  
Work Hardening ◽  
Stage I ◽  
Polycrystalline Materials ◽  
Temperature Dependent ◽  
Band Formation ◽  
Slip Bands ◽  
Three Stages ◽  
The Difference

A summary is given of some present ideas on the mechanism of work-hardening of single crystals and polycrystalline materials. In particular, the difference is stressed between the three stages of hardening: stage I, or easy glide; stage II, the region of rapid hardening accompanied by short slip lines; and stage III, the region of slow or parabolic hardening which is temperature-dependent and in which long slip bands are formed.

Nanoindentation size effect in single-crystal nanoparticles and thin films: A comparative experimental and simulation study

2011 ◽  
Vol 59 (6) ◽  
pp. 2309-2321 ◽  
Author(s):  
Dan Mordehai ◽  
Michael Kazakevich ◽  
David J. Srolovitz ◽  
Eugen Rabkin
Keyword(s):  
Thin Films ◽  
Size Effect ◽  
Single Crystal ◽  
Simulation Study

scholarly journals Size Effect on Mechanical Properties and Deformation Behavior of Pure Copper Wires Considering Free Surface Grains

Materials ◽  
2020 ◽  
Vol 13 (20) ◽  
pp. 4563
Author(s):  
Yu Hou ◽  
Xujun Mi ◽  
Haofeng Xie ◽  
Wenjing Zhang ◽  
Guojie Huang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Grain Size ◽  
Free Surface ◽  
Size Effect ◽  
Single Crystal ◽  
Deformation Behavior ◽  
Pure Copper ◽  
Critical Value ◽  
Wire Diameter ◽  
Surface Model

The size (grain size and specimen size) effect makes traditional macroscopic forming technology unsuitable for a microscopic forming process. In order to investigate the size effect on mechanical properties and deformation behavior, pure copper wires (diameters range from 50 μm to 500 μm) were annealed at different temperatures to obtain different grain sizes. The results show that a decrease in wire diameter leads to a reduction in tensile strength, and this change is pronounced for large grains. The elongation of the material is in linear correlation to size factor D/d (diameter/grain size), i.e., at the same wire diameter, more grains in the section bring better plasticity. This phenomenon is in relationship with the ratio of free surface grains. A surface model combined with the theory of single crystal and polycrystal is established, based on the relationship between specimen/grain size and tensile property. The simulated results show that the flow stress in micro-scale is in the middle of the single crystal model (lower critical value) and the polycrystalline model (upper critical value). Moreover, the simulation results of the hybrid model calculations presented in this paper are in good agreement with the experimental results.

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