Distribution of Stress and Strain of Semiconductor Devices in Three Dimensional Flip Chip Structures

2004 ◽  
Vol 2004 (0) ◽  
pp. 263-264
Author(s):  
Nobuki Ueta ◽  
Hideo Miura
Keyword(s):  
Flip Chip ◽  
Semiconductor Devices ◽  
Three Dimensional ◽  
Stress And Strain ◽  
Distribution Of Stress

The Non-Newtonian Fluid in the Collision

2014 ◽  
Vol 538 ◽  
pp. 72-75
Author(s):  
Lei Hou ◽  
Jun Jie Zhao ◽  
Lin Qiu
Keyword(s):  
High Performance ◽  
Plastic Material ◽  
Three Dimensional ◽  
Strain Curve ◽  
Step Length ◽  
Stress And Strain ◽  
Equation Analysis ◽  
Elastic Plastic Material ◽  
Discrete Finite Element ◽  
Distribution Of Stress

This paper studies elastic-plastic material deformation in terms of Cauchy and PTT. It gives certain convergence to the equation analysis in the discrete finite element method; it reaches o (h2+Δt) under the certain step length. Then we carry on Three-dimensional numerical simulation by the high performance software LS-DYNA and the distribution of stress and strain curve is observed.

scholarly journals Dynamic Response of the Skull with Sinuses under Blunt Frontal Impact: A Three-Dimensional Computational Study

2015 ◽  
Vol 2015 ◽  
pp. 1-11 ◽  
Author(s):  
Xuewei Song ◽  
Botao Zhao ◽  
Cong Wang ◽  
Nan Wang
Keyword(s):  
Computational Study ◽  
Three Dimensional ◽  
Region Of Interest ◽  
Local Area ◽  
Local Effect ◽  
Impact Response ◽  
Stress And Strain ◽  
Frontal Impact ◽  
Facial Bones ◽  
Distribution Of Stress

The objective of this study is to analyze the biomechanical effects of sinuses in the skull on the facial impact response. Two models were built, where one had sinuses and the other had none. The models were verified using cadaver test data, including impacts to frontal bone, zygomatic bone, and maxillae. In the maxilla and zygoma impact, sinuses were found to have no significant effect on the global distribution of stress or stiffness of facial bones, and the influence was limited in local area. In forehead impact, the sinuses significantly affected the distribution of stress and strain in the skull due to its location in facial bones. The result shows that if the sinus is far away from the location of impact, its effect on the overall response of skull could be ignored. In addition, the distance between the region of interest and sinuses is another important parameter when studying the local effect of sinuses.

scholarly journals Analysis of the dependence of stresses and deformations on the surfaces of shoe soles of different thicknesses and materials

2021 ◽  
Vol 273 ◽  
pp. 05001
Author(s):  
Olesya Golubeva ◽  
Alina Pogorelova
Keyword(s):  
Three Dimensional ◽  
Stress And Strain ◽  
Medium Density ◽  
Suitable Material ◽  
Two Component ◽  
Shoe Soles ◽  
Three Dimensional Models ◽  
Materials Used ◽  
Distribution Of Stress ◽  
Shape And Size

For this study, three-dimensional models of the soles of work shoes of different thicknesses and consisting of different materials were created. These models were analyzed to obtain the distribution of stress and strain on their surfaces. To build the model, we used experimental data on the shape and size of the sole, as well as the properties of specific materials used in the manufacture of soles for work shoes used in agriculture. The goal was to determine the most suitable material, that is, which of the materials has the most suitable characteristics for the sole, has the best wear resistance when used in agriculture. We noticed a significant reduction in deformations on the surface of the sole with an increase in the thickness of the sole, as well as when using two-component casting of the sole from a combination of materials: low-density EVA and flexible PU, medium-density EVA and soft PVC. This indicates their advantages and maximum suitability.

Influence of Extrusion Ratio on Forming of Thick-Walled Tube

2011 ◽  
Vol 217-218 ◽  
pp. 952-957
Author(s):  
Jian Zhang ◽  
Jian Hua Song ◽  
Xiao Lan Wang ◽  
Xue Qin Jin ◽  
Zhi Hua Wang
Keyword(s):  
Large Diameter ◽  
Three Dimensional ◽  
Extrusion Process ◽  
Extrusion Ratio ◽  
Stress And Strain ◽  
The Finite Element Method ◽  
Three Dimensional Modeling ◽  
Dimensional Modeling ◽  
Modeling Software ◽  
Distribution Of Stress

Employed DEFORM software to simulate vertical extrusion of large diameter thick-walled pipe, by using the Finite Element Method in the three-dimensional modeling software Pro/E of the CAD platform. Analyze the law of blank flow in extrusion process, distribution of stress and strain, and the influence of different extrusion ratio on deformation of thick-walled tube comparatively.

Study on Stress and Strain of Anchorage Using Finite Element Method

2013 ◽  
Vol 325-326 ◽  
pp. 1314-1317
Author(s):  
Cong Sheng Chen ◽  
Ping He ◽  
Cheng Yong Wang ◽  
Xue Hui Chen ◽  
Lei Huang ◽  
...  
Keyword(s):  
Finite Element ◽  
Strain Distribution ◽  
Maximum Stress ◽  
Mechanical Response ◽  
Three Dimensional ◽  
Integrated Modeling ◽  
Stress And Strain ◽  
Steel Strand ◽  
Prestressed State ◽  
Stress And Strain Distribution

Three-dimensional integrated modeling method and the numerical simulation of elastoplastic finite element are adopted in the paper. The mechanical response of the five holes anchorage is analyzed in certain prestressed state. The stress and strain distribution information of the anchor ring, clip and steel strand is obtained respectively, and the structure safety is discussed by investigating on the maximum stress and strain.

Three-Dimensional Elasticity Solution of a Composite Beam

1967 ◽  
Vol 1 (2) ◽  
pp. 122-135 ◽  
Author(s):  
Staley F. Adams ◽  
M. Maiti ◽  
Richard E. Mark
Keyword(s):  
Three Dimensional ◽  
Solid Wood ◽  
Theory Of Elasticity ◽  
Orthotropic Materials ◽  
Stress And Strain ◽  
Cantilever Beams ◽  
Dimensional Theory ◽  
Reinforced Plastics ◽  
Three Dimensional Elasticity ◽  
Moduli Of Elasticity

This investigation was undertaken to develop a rigorous mathe matical solution of stress and strain for a composite pole con sisting of a reinforced plastics jacket laminated on a solid wood core. The wood and plastics are treated as orthotropic materials. The problem of bending of such poles as cantilever beams has been determined by the application of the principles of three- dimensional theory of elasticity. Values of all components of the stress tensor in cylindrical coordinates are given for the core and jacket. Exact values for the stresses have been obtained from computer results, using the basic elastic constants—Poisson's ratios, moduli of elasticity and moduli of rigidity—for each ma terial. A comparison of the numerical results of the exact solu tion with strength of materials solutions has been completed.

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

2011 ◽  
Author(s):  
Kohta Nakahira ◽  
Hironori Tago ◽  
Fumiaki Endo ◽  
Ken Suzuki ◽  
Hideo Miura
Keyword(s):  
Mechanical Properties ◽  
Residual Stress ◽  
Thermal Deformation ◽  
Flip Chip ◽  
Flexural Rigidity ◽  
Three Dimensional ◽  
Strain Gauges ◽  
Copper Interconnection ◽  
Induced Stress ◽  
Alignment Structure

Since the thickness of the stacked silicon chips in 3D integration has been thinned to less than 100 μm, the local thermal deformation of the chips has increased drastically because of the decrease of the flexural rigidity of the thinned chips. The clear periodic thermal deformation and thus, the thermal residual stress distribution appears in the stacked chips due to the periodic alignment of metallic bumps, and they deteriorate the reliability of products. In this paper, the dominant structural factors of the local residual stress in a silicon chip are discussed quantitatively based on the results of a three-dimensional finite element analysis and the measurement of the local residual stress in a chip using stress sensor chips. The piezoresistive strain gauges were embedded in the sensor chips. The length of each gauge was 2 μm, and an unit cell consisted of 4 gauges with different crystallographic directions. This alignment of strain gauges enables to measure the tensor component of three-dimensional stress fields separately. Test flip chip substrates were made by silicon chip on which the area-arrayed tin/copper bumps were electroplated. The width of a bump was fixed at 200 μm, and the bump pitch was varied from 400 μm to 1000 μm. The thickness of the copper layer was about 40 μm and that of tin layer was about 10 μm. This tin layer was used for the rigid joint formation by alloying with copper interconnection formed on a stress sensing chip. The measured amplitude of the residual stress increased from about 30 MPa to 250 MPa depending on the combination of materials such as bump, underfill, and interconnections. It was confirmed that both the material constant of underfill and the alignment structure of fine bumps are the dominant factors of the local deformation and stress of a silicon chip mounted on area-arrayed metallic bumps. It was also confirmed experimentally that both the hound’s-tooth alignment between a TSV (Through Silicon Via) and a bump and control of mechanical properties of electroplated copper thin films used for the TSV and bump is indispensable in order to minimize the packaging-induced stress in the three-dimensionally mounted chips. This test chip is very effective for evaluating the packaging-process induced stress in 3D stacked chips quantitatively.

Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

2000 ◽  
Vol 122 (4) ◽  
pp. 301-305 ◽  
Author(s):  
A. Q. Xu ◽  
H. F. Nied
Keyword(s):  
Contact Angle ◽  
Finite Element ◽  
Glass Fiber ◽  
Flip Chip ◽  
Three Dimensional ◽  
Stress Singularity ◽  
Local Stress ◽  
Stress Singularities ◽  
Element Analysis ◽  
Three Dimensional Finite Element

Cracking and delamination at the interfaces of different materials in plastic IC packages is a well-known failure mechanism. The investigation of local stress behavior, including characterization of stress singularities, is an important problem in predicting and preventing crack initiation and propagation. In this study, a three-dimensional finite element procedure is used to compute the strength of stress singularities at various three-dimensional corners in a typical Flip-Chip assembled Chip-on-Board (FCOB) package. It is found that the stress singularities at the three-dimensional corners are always more severe than those at the corresponding two-dimensional edges, which suggests that they are more likely to be the potential delamination sites. Furthermore, it is demonstrated that the stress singularity at the upper silicon die/epoxy fillet edge can be completely eliminated by an appropriate choice in geometry. A weak stress singularity at the FR4 board/epoxy edge is shown to exist, with a stronger singularity located at the internal die/epoxy corner. The influence of the epoxy contact angle and the FR4 glass fiber orientation on stress state is also investigated. A general result is that the strength of the stress singularity increases with increased epoxy contact angle. In addition, it is shown that the stress singularity effect can be minimized by choosing an appropriate orientation between the glass fiber in the FR4 board and the silicon die. Based on these results, several guidelines for minimizing edge stresses in IC packages are presented. [S1043-7398(00)00904-X]

Sign in / Sign up

Export Citation Format

Share Document