THE FINITE ELEMENT ANALYSIS OF TRANSIENT HEAT TRANSFER IN FRESH TOMATOES DURING COOLING

1991 ◽  
Vol 34 (3) ◽  
pp. 0972-0976 ◽  
Author(s):  
J. C. Pan ◽  
S. R. Bhowmik
Keyword(s):  
Heat Transfer ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Transient Heat Transfer ◽  
Element Analysis ◽  
The Finite Element Analysis

Experimental Platforms and Finite Element Analysis on Hot Stamping Processes

2014 ◽  
Vol 1063 ◽  
pp. 334-338 ◽  
Author(s):  
Tzu Hao Hung ◽  
Heng Kuang Tsai ◽  
Fuh Kuo Chen ◽  
Ping Kun Lee
Keyword(s):  
Heat Transfer ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Process Design ◽  
Hot Stamping ◽  
Boron Steel ◽  
Transfer Coefficients ◽  
Element Analysis ◽  
Heat Transfer Coefficients ◽  
The Finite Element Analysis

Due to the complexity of hot stamping mechanism, including the coupling of material formability, thermal interaction and metallurgical microstructure, it makes the process design more difficult even with the aid of the finite element analysis. In the present study, the experimental platforms were developed to measure and derive the friction and heat transfer coefficients, respectively. The experiments at various elevated temperatures and contact pressures were conducted and the friction coefficients and heat transfer coefficients were obtained. A finite element model was also established with the experimental data and the material properties of the boron steel calculated from the JMatPro software. The finite element simulations for the hot stamping forming of an automotive door beam, including transportation analysis, hot forming analysis and die quenching analysis were then performed to examine the forming properties of the door beam. The validation of the finite element results by the production part confirms the efficiency and accuracy of the developed experimental platforms and the finite element analysis for the process design of hot stamping.

Numerical Simulation of Stress and Deformation on Heat Transfer

2011 ◽  
Vol 422 ◽  
pp. 842-845
Author(s):  
Xue Ping Wang ◽  
Ying Zhang ◽  
Pan Li ◽  
Zhen Wei Zhang
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Heat Exchange ◽  
Structure Design ◽  
Stress And Strain ◽  
Element Analysis ◽  
The Finite Element Analysis ◽  
Stress And Deformation

This paper primarily simulates the heat exchange part’s stress and strain situation under the load of temperature and gravity and their coupling impact aiming at obtaining the stress and deformation distribution. The authors took advantage of the method of the finite element analysis to study the stress and strain situation. Through the analysis, each part of the transfer’s stress and strain can be calculated. The conclusion of this paper provides the basis for the further enhancement of the machine life and optimization of the structure design.

scholarly journals Study on Thermoelectric Conversion and Conjugate Heat Transfer for PCBA by Finite Element Analysis

2019 ◽  
Vol 10 (1) ◽  
pp. 197
Author(s):  
Ah-Der Lin ◽  
Sian Zheng Poon ◽  
Hong-Wei Tu ◽  
Cheng-Yi Chen ◽  
Chao-Ming Hsu
Keyword(s):  
Heat Transfer ◽  
Experimental Data ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Temperature Distribution ◽  
High Power ◽  
Conjugate Heat Transfer ◽  
Element Analysis ◽  
The Finite Element Analysis ◽  
High Power Led

In this study, the optical sphere and the power analyzer were exploited to measure the optical and power parameters for the high-power LED lamps. The results, derived from the experimental data, were used as the power distribution inputs in the finite element analysis (FEA) for the determination of the temperature distribution for the printed circuit board assembly (PCBA) built in the LED lamp. In the finite element analysis, the conjugate heat transfer model was adapted for the calculation of the heat transfer, including thermal conductivity, convection and radiation. Applied on the power chips located on the PCBA, the graphene thermal interface material (TIMs) had been studied for its effects on the temperature distribution. For an accurate simulation about the LED lamp, the model with closed and compact space was built in the analysis. Compared to the experimental data, it showed that the simulation results had a deviation in the range of 3–5% around the main heating source, the light-emitting diodes. It proves the FEA model proposed in this study were well developed for the simulation of the temperature distribution for the high-power LED lamps which have mixed heat transfer mechanisms. The thermal radiation effects by TIMs with graphene were also investigated in this study and proven to be useful for the heat dissipation for the LED lamps.

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