Surface damage and the optical reflectance of single-crystal silicon

1978 ◽  
Vol 17 (21) ◽  
pp. 3477 ◽  
Author(s):  
P. J. Zanzucchi ◽  
M. T. Duffy
1999 ◽  
Vol 65 (7) ◽  
pp. 992-996
Author(s):  
Takayuki SHIBATA ◽  
Shigeru FUJII ◽  
Atsushi ONO ◽  
Eiji MAKINO

Author(s):  
N. Lewis ◽  
E. L. Hall ◽  
A. Mogro-Campero ◽  
R. P. Love

The formation of buried oxide structures in single crystal silicon by high-dose oxygen ion implantation has received considerable attention recently for applications in advanced electronic device fabrication. This process is performed in a vacuum, and under the proper implantation conditions results in a silicon-on-insulator (SOI) structure with a top single crystal silicon layer on an amorphous silicon dioxide layer. The top Si layer has the same orientation as the silicon substrate. The quality of the outermost portion of the Si top layer is important in device fabrication since it either can be used directly to build devices, or epitaxial Si may be grown on this layer. Therefore, careful characterization of the results of the ion implantation process is essential.


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