Mid-infrared germanium photonic integrated circuits for on-chip biochemical sensing

Author(s):  
Zhenzhou Cheng ◽  
Ting-Hui Xiao ◽  
Ziqiang Zhao ◽  
Wen Zhou ◽  
Mitsuru Takenaka ◽  
...  
2013 ◽  
Vol 3 (9) ◽  
pp. 1523 ◽  
Author(s):  
Gunther Roelkens ◽  
Utsav Dave ◽  
Alban Gassenq ◽  
Nannicha Hattasan ◽  
Chen Hu ◽  
...  

2018 ◽  
Vol 24 (1) ◽  
pp. 1-20 ◽  
Author(s):  
Fred Kish ◽  
Vikrant Lal ◽  
Peter Evans ◽  
Scott W. Corzine ◽  
Mehrdad Ziari ◽  
...  

2021 ◽  
Author(s):  
Yun-Da Hsieh ◽  
Jun-Han Lin ◽  
Richard Soref ◽  
Greg Sun ◽  
Hung-Hsiang Cheng ◽  
...  

Abstract Si-based electronic-photonic integrated circuits (EPICs), which are compatible with state-of-the-art complementary metal-oxide-semiconductor (CMOS) processes, offer promising opportunities for on-chip mid-infrared (MIR) photonic systems. However, the lack of efficient MIR optical modulators on Si hinders the utilization of MIR EPICs. Here, we clearly demonstrate the Franz-Keldysh (FK) effect in GeSn alloys and achieve on-Si MIR electro-absorption optical modulation using GeSn heterostructures. Our experimental and theoretical results verify that the direct bandgap energy of GeSn can be widely tuned by varying the Sn content, thereby realizing wavelength-tunable optical modulation in the MIR range with a figure-of-merit of Δα /α0 (FOM) greater than 1.5 and a broadband operating range greater than 140 nm. In contrast to conventional silicon-photonic modulators based on the plasma dispersion effect, our GeSn heterostructure demonstrates practical and effective FK MIR optical modulation on Si and helps unlock the potential of MIR EPICs for a wide range of applications.


2017 ◽  
Vol 27 (4) ◽  
pp. 327 ◽  
Author(s):  
Dung Cao Truong ◽  
Dao Anh Vu ◽  
Chung Vu Hoang

In this paper, we introduce a new two-mode (de)multiplexer based on the silicon-on-insulator (SOI) platform. The device is built on a symmetric Y-junction, a 2×2 multimode interference (MMI) waveguide and a phaseshifter in the form of a ridge waveguide which is designed using 3D scalar beam propagation method (BPM). The phase evolution in the structure is discussed in details. Simulation results show that the device can operate in a wide wavelength range (150 nm) with a low insertion loss and small crosstalk. Large fabrication tolerance to the width of the input waveguide up to 100 nm is achieved, which is compatible to the current CMOS manufacturing technologies for the photonic integrated circuits. Furthermore, the small footprint (4µm×286µm) makes the device suitable for applications in high bitrate and compact on-chip silicon photonic integrated circuits.


2011 ◽  
Author(s):  
N. Hattasan ◽  
L. Cerutti ◽  
J. B. Rodriguez ◽  
E. Tournié ◽  
D. Van Thourhout ◽  
...  

Nanoscale ◽  
2019 ◽  
Vol 11 (29) ◽  
pp. 13885-13893 ◽  
Author(s):  
Kexiu Rong ◽  
Hui Liu ◽  
Kebin Shi ◽  
Jianjun Chen

The simple pattern-assisted stacking approach using the same material is proposed to construct on-chip photonic components for integrated circuits.


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