scholarly journals Characterization of high density through silicon vias with spectral reflectometry

2011 ◽  
Vol 19 (7) ◽  
pp. 5993 ◽  
Author(s):  
Yi-Sha Ku ◽  
Kuo Cheng Huang ◽  
Weite Hsu
Keyword(s):  
High Density ◽  
Through Silicon Vias ◽  
Silicon Vias

Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias

2012 ◽  
Vol 22 (5) ◽  
pp. 055021 ◽  
Author(s):  
Pradeep Dixit ◽  
Tapani Vehmas ◽  
Sami Vähänen ◽  
Philippe Monnoyer ◽  
Kimmo Henttinen
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Electrical Characterization ◽  
Through Silicon Vias ◽  
Poly Silicon ◽  
Silicon Vias

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

2012 ◽  
Vol 100 (4) ◽  
pp. 041901 ◽  
Author(s):  
Suk-Kyu Ryu ◽  
Tengfei Jiang ◽  
Kuan H. Lu ◽  
Jay Im ◽  
Ho-Young Son ◽  
...  
Keyword(s):  
Thermal Stresses ◽  
Three Dimensional ◽  
Through Silicon Vias ◽  
Silicon Vias ◽  
Beam Technique

Characterization of Copper Diffusion in Through Silicon Vias

2016 ◽  
pp. 923-951
Author(s):  
Xiaodong Zhang ◽  
Shi-Wei Ricky Lee ◽  
Fuliang Le
Keyword(s):  
Through Silicon Vias ◽  
Copper Diffusion ◽  
Silicon Vias
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