Abstract
Glassy materials offer a number of advantages over traditional packaging materials, such as laminates and ceramics including: (1) Better material properties, (2) decreased surface roughness to mitigate current crowding, (3) the ability to create small precise features with greater densities, and (4) the opportunity to integrate passive devices such as power inductors and High-Q inductors into an interposer substrate along with other active and passive devices. This paper will cover an overview of our efforts to create APEX® Glass based devices that form the building blocks for a variety of RF applications including power inductors, High-Q inductors, capacitors, filters and interposers. We also demonstrate the power of integrating these individual building blocks into more complex devices that offer compelling solutions for the increasingly complex RF market. Performance data is presented for power inductors and the in-glass inductors.