A Study on the Properties of the Photosensitive Silver Paste with Silver Powder Shape

Recently, PbO containing glass systems in commercial silver paste have been used due to their low glass transition temperature, good thermal and electrical properties. However, PbO is a hazardous material to both health and the environment. In this study, Pb-free silver paste was prepared by mixing commercial silver powder and silver nanoparticles. The commercial powder has an average particle size of 1.6 μm. The silver nanoparticles with particles size of 20–50 nm were synthesized by a chemical reduction method using surfactant. Pb-free frit was added into the mixed silver powder as the amounts of 3, 6 and 9 wt%. Using the obtained paste, thick films were fabricated by a screen printing on alumina substrate and the films were fired at temperature from 400 to 550 °C. The films had thickness of 6–11 μm and sheet resistivity of about 4–11 μΩ cm.

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Tuning the Electrical Resistivity of Conductive Silver Paste Prepared by Blending Multi-Morphologies and Micro-Nanometers Silver Powder

10.21203/rs.3.rs-270282/v1 ◽

2021 ◽

Author(s):

Liu Xiao ◽

Wu Siyuan ◽

Chen Baishan ◽

Ma Yunzhu ◽

Huang Yufeng ◽

...

Keyword(s):

Silver Nanoparticles ◽

Electrical Resistivity ◽

Printed Circuit Board ◽

Silver Powder ◽

Circuit Board ◽

Silver Paste ◽

Printed Circuit ◽

Folding Endurance ◽

Lower Temperature ◽

Interconnection Material

Abstract As an important interconnection material in electronics, conductive silver paste has attract much research interest in chip packaging and printed circuit board due to its predominant properties like high conductivity and flexible interconnection. In this paper, the silver nanoparticles, the silver sphere particles and flake silver powder are fabricated by various methods. Different proportions of silver powder are selected to prepare micro-silver paste and mn silver paste (fabricated by silver nanoparticles : sphere particles : flake silver powder=1:1:1). Compared to traditional silver paste (containing 80wt% silver), the electrical resistivity of micro-silver paste containing 66.67wt% silver and cured at 200℃ for 45min in air is about (3.31±0.73)×10-5Ω·cm when the ratio of sphere particle to flake silver powder is 1:1, the resistance of silver paste doesn’t also increase dramatically after bending ten times. The addition of nano-silver particles can reduce the resistivity in lower temperature curing. The folding endurance of mn silver paste is comparable to that of micro-silver paste with sphere : flake=1:1.

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Fabrication of Pb-Free Silver Paste and Thick Film Adding Silver Nanoparticles

Solid State Phenomena ◽

10.4028/www.scientific.net/ssp.124-126.639 ◽

2007 ◽

Vol 124-126 ◽

pp. 639-642 ◽

Cited By ~ 2

Author(s):

Sung Hyun Park ◽

Dong Seok Seo ◽

Jong Kook Lee

Keyword(s):

Silver Nanoparticles ◽

Screen Printing ◽

Chemical Reduction ◽

Silver Powder ◽

Thick Films ◽

Electronic Devices ◽

Average Particle Size ◽

Average Particle ◽

Silver Paste ◽

The Relationship

Fabrication of paste at low temperature has been developed in order to apply for various electronic devices, such as bus electrode and address electrode in PDP, especially for enlargement of a screen size. In this study, nano-sized silver particles with 10 - 30 nm were synthesized from silver nitrate (AgNO3) by a chemical reduction method. To prepare Pb-free silver paste, the silver nanoparticles were mixed with conventional silver powder with an average particle size of 1.6 and conventional Pb-free frit. Thick films were fabricated from silver paste by a screen printing on alumina substrate and the films were fried at temperatures ranging from 550 °C to 600 °C. Microstructures of the fried thick films were analyzed by FE-SEM. Sheet resistivity of fried thick films was measured and also the relationship between sinterability and conductivity of these films were investigated.

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