scholarly journals Long-Lived Plasma Process, Created by Impulse Discharge in Micro-Disperse Droplet Environment

10.14311/1763 ◽  
2013 ◽  
Vol 53 (2) ◽  
Author(s):  
Serge Olszewski ◽  
Tamara Lisitchenko ◽  
Vitalij Yukhymenko
Keyword(s):  
Organic Compound ◽  
Plasma Treatment ◽  
Computer Model ◽  
Spectral Properties ◽  
Pulsed Discharge ◽  
Plasma Process ◽  
Impulse Discharge ◽  
Charged Droplets ◽  
Liquid Systems ◽  
Disperse Droplet

The processes of organic compound (phenol and cation-active surfactants) destruction in water solutions, which stay under the influence of plasma treatment have been investigated in different dynamic plasma-liquid systems (PLS) with discharges in droplet micro-disperse environments (DMDE). The long-lived plasma process with separate spectral properties has been observed for pulsed discharge in DMDE. The approximate computer model is being proposed for a description of this effect. According to the introduced model this long-lived process is the aggregation of correlated discharges between charged droplets.

The Study of Surface Morphology and Roughness of Silicon Wafers Treated by Plasma

2020 ◽  
Vol 980 ◽  
pp. 88-96
Author(s):  
Jin Rui Bai ◽  
Rui Xiang Hou
Keyword(s):  
Surface Morphology ◽  
Plasma Treatment ◽  
Silicon Wafer ◽  
Processing Time ◽  
Surface Region ◽  
Silicon Wafers ◽  
Plasma Process ◽  
Plasma Doping ◽  
Atom Force Microscope ◽  
The Way

Plasma is generally used for the doping of semiconductors. During plasma doping process, plasma interacts with the surface of semiconductor. As a result, defects are induced in the surface region. In this work, the surface morphology and roughness of silicon wafer caused by plasma treatment is studied by use of atom force microscope (AFM). It is found that, during the plasma process, each of the processing time of plasma, location of silicon wafer in plasma and the way of placement of silicon wafer has an influence on the surface morphology and roughness and the reason is discussed. The interaction between plasma and the surface of silicon wafer is qualitatively discussed.

Kinetic analysis of soil contained pyrene oxidation by a pulsed discharge plasma process

2016 ◽  
Vol 19 (1) ◽  
pp. 015504 ◽  
Author(s):  
Huijuan Wang (王慧娟) ◽  
Guangshun Zhou (周广顺) ◽  
He Guo (郭贺) ◽  
Cong Geng (耿聪)
Keyword(s):  
Kinetic Analysis ◽  
Discharge Plasma ◽  
Pulsed Discharge ◽  
Plasma Process ◽  
Pulsed Discharge Plasma

Effect of Cold Plasma Treatment on Surface Roughness and Bonding Strength of Polymeric Substrates

2014 ◽  
Vol 611-612 ◽  
pp. 1484-1493 ◽  
Author(s):  
Chiara Mandolfino ◽  
Enrico Lertora ◽  
Carla Gambaro
Keyword(s):  
Surface Roughness ◽  
Plasma Treatment ◽  
Bonded Joints ◽  
Plasma Process ◽  
Adhesive Properties ◽  
Low Surface Energy ◽  
Lap Shear ◽  
General Terms ◽  
Polymeric Substrates ◽  
Adhesive Bonded Joints

For an effective application of polymers, it is essential to have good adhesion behaviour to ensure good mechanical properties and durable components. Unfortunately, in general terms, polymers are characterized by high chemical inertness, which leads to very low surface energy values and, consequently, poor adhesive properties; this is particularly true for polyolefins. In this study, the effects of low pressure plasma treatment on surface roughness of polyethylene and polypropylene samples and on shear properties of adhesive bonded joints based on these substrates have been investigated. In particular, the optimization of three plasma process parameters, exposure time, voltage and working gas, were studied performing roughness measurement, contact angle evaluation and lap-shear tests. The experimental results show that the optimized plasma process may remarkably change the surface morphology, increasing wettability properties of the surfaces and shear strength of the bonded joints. These good properties remain almost unchanged even after some days of storage in the laboratory.

scholarly journals Growth promotion of vertical graphene on SiO2/Si by Ar plasma process in plasma-enhanced chemical vapor deposition

RSC Advances ◽  
2018 ◽  
Vol 8 (34) ◽  
pp. 18757-18761 ◽  
Author(s):  
Yanping Sui ◽  
Zhiying Chen ◽  
Yanhui Zhang ◽  
Shike Hu ◽  
Yijian Liang ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Plasma Treatment ◽  
Vapor Deposition ◽  
Growth Promotion ◽  
Chemical Vapor ◽  
Plasma Process ◽  
Ar Plasma

This study investigates the growth promotion of vertically oriented graphene in plasma-enhanced chemical vapor deposition through Ar plasma treatment.

Low Temperature Plasma Treatment for Immobilization of Biomaterials on Polymer Surface

2011 ◽  
Vol 222 ◽  
pp. 297-300 ◽  
Author(s):  
Akihisa Ogino ◽  
Suguru Noguchi ◽  
Masaaki Nagatsu
Keyword(s):  
Plasma Treatment ◽  
Surface Property ◽  
Blood Compatibility ◽  
Polymer Surface ◽  
Amino Group ◽  
Low Temperature Plasma ◽  
Plasma Process ◽  
Temperature Plasma ◽  
Strongly Connected ◽  
Anticoagulant Property

In some medical use, surface property such as biocompatibility and blood compatibility is very important. To improve the surface property of polymers, ammonia plasma was used to introduce amino group onto polymer surface in order to bind with heparin. The amount and the selectivity of amino group were improved by plasma treatment. The ratio of sulfur contained in heparin to carbon also increased from 0.5% to 10% by plasma process. The positive correlation can be found between heparin immobilization and amino group introduced by plasma. The immobilized heparin is strongly connected and it enhances the anticoagulant property on the surface.

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