scholarly journals Using rectangular trace to reduce the crosstalk of the coupled microstrip lines

2015 ◽  
Vol 5 (1) ◽  
pp. 7
Author(s):  
Ahmed Ali Hussein
Keyword(s):  
Electromagnetic Interference ◽  
High Speed ◽  
Printed Circuit Boards ◽  
Signal Integrity ◽  
Circuit Boards ◽  
Crosstalk Noise ◽  
Circuit Performance ◽  
Microstrip Lines ◽  
Via Hole ◽  
Better Than

New electronic products must have high-speed, small size and lower voltages supply. With such layout, signal integrity (SI) becomes an actual important issue because sensitive equipment is affected on electromagnetic interference (EMI). Crosstalk is a major factor in signal integrity (SI) of printed circuit boards (PCBs). Crosstalk noise is usually represented in terms of Near-End crosstalk (NEXT) and Far-End crosstalk (FEXT). Crosstalk is a common problem that degrades circuit performance. To reduce this problem, via hole-fences connected by guard trace between double microstrip lines are used, in this case the crosstalk will be reduce by 6 dB than use 3W rule, but when it replaced by rectangular metal the crosstalk was reduce by 7dB, is better than use via hole-fences by 1 dB. The simulation result was done by using FEKO 5.5 simulator.

Effects of microstrip line fabrication and design on high-speed signal integrity transmission of PCB manufacturing process

Circuit World ◽  
2018 ◽  
Vol 44 (2) ◽  
pp. 53-59 ◽  
Author(s):  
Shouxu Wang ◽  
Xiaolan Xu ◽  
Guoyun Zhou ◽  
Yuanming Chen ◽  
Wei He ◽  
...  
Keyword(s):  
Insertion Loss ◽  
High Speed ◽  
Microstrip Line ◽  
Printed Circuit Boards ◽  
Signal Integrity ◽  
Content Type ◽  
Microstrip Lines ◽  
Reference Layer ◽  
Line Space ◽  
Space Ratio

Purpose As a common transmission line, the microstrip line plays an important role in high-speed circuits. The purpose of this paper was to investigate the effects of the circuit design of microstrip lines on the signal integrity (SI). In addition, the influence of the type and thickness of the solder resist ink on SI was analyzed to provide guidance for the related producing process design of printed circuit boards (PCBs). Design/methodology/approach Microstrip line properties consisting of shape, line-width/line-space ratio, reference layer design and as-covered solder resist ink were designed to measure the insertion loss (S21) in high-speed PCB. Findings The study showed that the insertion loss (S21) of straight, meander, snake-shaped and wavy microstrip lines was approximately consistent. A microstrip line with width/space ratio less than 0.96 is necessary, as the differential line closing produces a mutual interference. Reference layer including the discontinuous area should be repaired by adjusting the microstrip line parameters. With regard to the solder resist ink, the insertion loss of novel solder resist ink decreased by 0.163 dB/in at 12.9 GHz and 0.164 dB/in at 14 GHz, compared with traditional solder resist ink. Accordingly, the insertion loss effectively improved at a lower thickness of solder resist. Originality/value This paper demonstrated that the common designing factors of line shape, line/space ratio, reference layer and solder resist influence microstrip line SI in the significant reference of designer-making PCB layout.

Sign in / Sign up

Export Citation Format

Share Document