scholarly journals Requirements on Needed Frequency Bandwidth Depending on Pulse Waveforms and Their Allowed Distortion

2016 ◽  
Vol 67 (6) ◽  
pp. 459-462 ◽  
Author(s):  
Milan Sigmund ◽  
Lubomir Brancik
Keyword(s):  
Frequency Band ◽  
High Frequency ◽  
Printed Circuit Board ◽  
Signal Transmission ◽  
Circuit Board ◽  
Frequency Bandwidth ◽  
High Frequency Band ◽  
Printed Circuit ◽  
Periodic Pulse

Abstract This paper deals with pulse signals influenced by loss of energy in high frequency band. Five types of pulses were tested and evaluated under various conditions. Achieved results can be helpful for some specific tasks in signal transmission. An example presents highest frequency of periodic pulse signals processed on printed circuit board.

A Design of Printed Inverted-F Antenna for RFID Tag at 5.8 GHz

2013 ◽  
Vol 427-429 ◽  
pp. 1293-1296
Author(s):  
Yan Zhong Yu ◽  
Ji Zhen Ni ◽  
Xian Hui Li
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Ground Plane ◽  
Simulation Software ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Antenna Structure ◽  
Rfid Tag ◽  
Printed Circuit ◽  
Substrate Layer

A printed inverted-F antenna for RFID tag at 5.8 GHz is designed in this paper. The antenna structure consists of an inverted-F patch, a substrate layer, and a ground plane. To reduce costs, the FR4 is selected as the material of substrate layer, which is used commonly in PCB (Printed Circuit Board). Its relative permittivity is 4.4 and a loss tangent is 0.02. The inverted-F patch and ground plane are laid on/under the substrate layer respectively. The designed antenna is modeled, simulated and optimized by using HFSS (high frequency electromagnetic simulation software). Simulation results demonstrate that the printed inverted-F antenna can satisfy the requirements of RFID Tag applications.

A Novel Low Cost Package for Radio Frequency Applications

2013 ◽  
Vol 135 (2) ◽  
Author(s):  
Sandeep Chaturvedi ◽  
Shiban K. Koul
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Cost Effective ◽  
Circuit Board ◽  
Test Results ◽  
Printed Circuit ◽  
Pcb Manufacturing ◽  
Manufacturing Techniques ◽  
Commercial Applications

Design, fabrication, and test results of a novel 3-layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed circuit board (PCB) manufacturing techniques making it cost effective for commercial applications. The package exhibits excellent RF characteristics up to 6 GHz.

scholarly journals A Double Inverted F-Shape Patch Antenna for Dual-Band Operation

2014 ◽  
Vol 2014 ◽  
pp. 1-8 ◽  
Author(s):  
M. M. Islam ◽  
M. R. I. Faruque ◽  
W. Hueyshin ◽  
J. S. Mandeep ◽  
T. Islam
Keyword(s):  
Finite Element Method ◽  
Patch Antenna ◽  
High Frequency ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Dual Band ◽  
The Finite Element Method ◽  
Microstrip Transmission Line ◽  
Printed Circuit ◽  
Measured Impedance

A double inverted F-shape patch antenna is presented for dual-band operation. The proposed antenna is comprised of circular and rectangular slots on a printed circuit board of 40 mm × 40 mm × 1.6 mm with a 50 Ω microstrip transmission line. Commercially available high frequency structural simulator (HFSS) based on the finite element method (FEM) has been adopted in this investigation. It has a measured impedance bandwidths (2 : 1 VSWR) of 18.53% on the lower band and 7.8% on the upper band, respectively. It has achieved stable radiation efficiencies of 79.76% and 80.36% with average gains of 7.82 dBi and 5.66 dBi in the operating frequency bands. Moreover, numerical simulations have been indicated as an important uniformity with measured results.

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