Effect of Steel Framing in Attic/Ceiling Assemblies on Overall Thermal Resistance

Insulation Materials: Testing and Applications: 4 ◽

10.1520/stp11011s ◽

2009 ◽

pp. 159-159-17

Author(s):

TW Petrie ◽

J Kśsny ◽

JA Atchley ◽

AO Desjarlais

Keyword(s):

Thermal Resistance ◽

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Measurement of digital integrated circuits thermal resistance on change of frequency of ring generator

Izmeritel`naya Tekhnika ◽

10.32446/0368-1025it.2018-2-46-50 ◽

2018 ◽

pp. 46-50

Author(s):

V. A. Sergeyev ◽

Ya. G. Teten’kin

Keyword(s):

Integrated Circuits ◽

Thermal Resistance ◽

Digital Integrated Circuits

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Thermal Resistance of Brown Coals from Various Deposits in Russia and Mongolia

Химия в интересах устойчивого развития ◽

10.15372/khur2019189 ◽

2019 ◽

Keyword(s):

Thermal Resistance ◽

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Development of Highly Accurate Transmission Capacity Calculation Program considering Thermal Resistance Decrease by Convection and Heat Radiation

IEEJ Transactions on Power and Energy ◽

10.1541/ieejpes.133.286 ◽

2013 ◽

Vol 133 (3) ◽

pp. 286-294

Author(s):

Masahiko Nakade ◽

Kenji Umekawa ◽

Toshiya Kano ◽

Tomotada Ishikawa

Keyword(s):

Thermal Resistance ◽

Transmission Capacity ◽

Heat Radiation ◽

Capacity Calculation ◽

Resistance Decrease

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Development of Nano-porous SiO2 Electret with High Thermal Resistance and Its Application to Vibration Energy Harvester

IEEJ Transactions on Sensors and Micromachines ◽

10.1541/ieejsmas.135.171 ◽

2015 ◽

Vol 135 (5) ◽

pp. 171-177

Author(s):

Masato Suzuki ◽

Tomokazu Takahashi ◽

Seiji Aoyagi

Keyword(s):

Thermal Resistance ◽

Energy Harvester ◽

Vibration Energy ◽

Vibration Energy Harvester ◽

High Thermal Resistance

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A SIMPLE MATHEMATICAL MODEL TO PREDICT HEAT PIPE MAXIMUM HEAT TRANSFER, EQUIVALENT THERMAL CONDUCTIVITY, AND THERMAL RESISTANCE

Heat Pipe Science and Technology An International Journal ◽

10.1615/heatpipescietech.2016017223 ◽

2016 ◽

Vol 7 (1-2) ◽

pp. 45-55

Author(s):

Masataka Mochizuki ◽

Thang Nguyen ◽

Yuji Saito ◽

Tien Nguyen ◽

Vijit Wuttijumnong

Keyword(s):

Heat Transfer ◽

Thermal Conductivity ◽

Mathematical Model ◽

Thermal Resistance ◽

Heat Pipe ◽

Simple Mathematical Model ◽

Equivalent Thermal Conductivity ◽

Maximum Heat ◽

Maximum Heat Transfer

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Experimental Comparison of Thermal Resistance for Micro pin fin heat sinks with different shapes and arrangement

Proceeding of Proceedings of the 25th National and 3rd International ISHMT-ASTFE Heat and Mass Transfer Conference (IHMTC-2019) ◽

10.1615/ihmtc-2019.710 ◽

2019 ◽

Author(s):

Gagan V. Kewalramani ◽

Gaurav Hedau ◽

Sandip Kumar Saha ◽

Amit Agrawal

Keyword(s):

Thermal Resistance ◽

Experimental Comparison ◽

Pin Fin ◽

Different Shapes

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NUMERICAL STUDY ON THE INFLUENCE OF NANOFLUIDS ON THE BOREHOLE HEAT EXCHANGER THERMAL RESISTANCE

Proceeding of Proceedings of CHT-17 ICHMT International Symposium on Advances in Computational Heat Transfer May 28-June 1, 2017, Napoli, Italy ◽

10.1615/ichmt.2017.cht-7.920 ◽

2017 ◽

Author(s):

Giuseppe Diglio ◽

Maurizio Sasso ◽

Carlo Roselli ◽

Umavathi Jawali

Keyword(s):

Heat Exchanger ◽

Thermal Resistance ◽

Numerical Study ◽

Borehole Heat Exchanger

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Two Successive Thermal Inverse Problems Solved for Plasma Facing Components Inside JET Tokamak: Estimation of Surface Heat Flux and Thermal Resistance of a Surface Carbon Layer

Proceedings of the 15th International Heat Transfer Conference ◽

10.1615/ihtc15.pls.009415 ◽

2014 ◽

Author(s):

jonathan gaspar ◽

Fabrice Rigollet ◽

Jean-Laurent Gardarein ◽

Christophe Le Niliot ◽

Yann Corre

Keyword(s):

Heat Flux ◽

Inverse Problems ◽

Thermal Resistance ◽

Surface Heat Flux ◽

Carbon Layer ◽

Surface Heat ◽

Surface Carbon ◽

Plasma Facing Components

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THERMAL RESISTANCE OF NANOPARTICLE LAYER DEPOSITED SOLID-LIQUID INTERFACE

10.1615/ihtc16.tpm.022135 ◽

2018 ◽

Author(s):

Yoshitaka Ueki ◽

Tomoya Oyabu ◽

Masahiko Shibahara

Keyword(s):

Thermal Resistance ◽

Liquid Interface ◽

Nanoparticle Layer ◽

Solid Liquid Interface ◽

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Investigation of Thermal Resistance and Heat Conduction at α-quartz -liquid Alkane Interfaces Using Nonequilibrium Molecular Dynamics Simulations

Proceedings of the 15th International Heat Transfer Conference ◽

10.1615/ihtc15.nmm.009459 ◽

2014 ◽

Author(s):

Hari Krishna Chilukoti ◽

Gota Kikugawa ◽

Masahiko Shibahara ◽

Taku Ohara

Keyword(s):

Molecular Dynamics ◽

Heat Conduction ◽

Thermal Resistance ◽

Molecular Dynamics Simulations ◽

Nonequilibrium Molecular Dynamics ◽

Dynamics Simulations

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