Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications

2008 ◽  
Author(s):  
S. Mallik ◽  
N.N. Ekere ◽  
A.E. Marks ◽  
A. Seman ◽  
R. Durairaj
Keyword(s):  
Flip Chip ◽  
Flow Behaviour ◽  
Time Dependent ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Pastes ◽  
Flip Chip Assembly ◽  
Dependent Flow ◽  
Free Solder

Enabling Cu Pillar Flip Chip Assembly with Water Soluble Lead-free Solder Paste

2019 ◽  
Author(s):  
B. Senthil Kumar ◽  
Bayaras Abito Danila ◽  
Chong Mei Hoe Joanne ◽  
Zhang Rui Fen ◽  
Santosh Kumar Rath ◽  
...  
Keyword(s):  
Flip Chip ◽  
Water Soluble ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Cu Pillar ◽  
Flip Chip Assembly ◽  
Free Solder

scholarly journals Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls

2004 ◽  
Vol 45 (3) ◽  
pp. 754-758 ◽  
Author(s):  
Ikuo Shohji ◽  
Yuji Shiratori ◽  
Hiroshi Yoshida ◽  
Masahiko Mizukami ◽  
Akira Ichida
Keyword(s):  
Growth Kinetics ◽  
Flip Chip ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Balls ◽  
Free Solder ◽  
Kinetics Of Reaction ◽  
Kinetics Of
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