Surface hardening of SUS304 by irradiation with a KrF excimer laser in SiH4 gas ambient

1990 ◽  
Vol 5 (2) ◽  
pp. 265-270 ◽  
Author(s):  
Koji Sugioka ◽  
Hideo Tashiro ◽  
Koichi Toyoda ◽  
Eiichi Tamura ◽  
Keigo Nagasaka
Keyword(s):  
Excimer Laser ◽  
Surface Hardening ◽  
Continuous Distribution ◽  
Surface Hardness ◽  
Laser Pulses ◽  
High Concentration ◽  
Laser Fluences ◽  
High Adhesion ◽  
Krf Excimer Laser ◽  
Si Films

Surface hardening of SUS304 resulting from the process of doping and deposition of Si by irradiation of a KrF excimer laser beam in a SiH4 gas ambient is investigated, and variations of the surface hardness are examined for different numbers of laser pulses and the laser fluences. The hardening is due to Si incorporation in high concentration. The continuous distribution of Si atoms across the surface layer suggests that a very high adhesion strength of the deposited Si films can be formed. The specific process for surface modification is referred to as laser implant-deposition (LID).

Etch Performance of KRF Excimer Laser Micromachining Characterization on Silicon Material

2015 ◽  
Vol 780 ◽  
pp. 29-32 ◽  
Author(s):  
M.Z. Zainol ◽  
Yufridin Wahab ◽  
H. Fazmir ◽  
A.F.M. Anuar ◽  
S. Johari ◽  
...  
Keyword(s):  
Excimer Laser ◽  
Etch Rate ◽  
Three Dimensional ◽  
Laser Pulses ◽  
Laser Micromachining ◽  
Rate Change ◽  
Performance Parameters ◽  
Laser Parameters ◽  
Characterization Study ◽  
Krf Excimer Laser

Excimer laser micromachining enables us to overcome the conventional lithography-based microfabrication limitations and simplify the process of creating three dimensional (3D) microstructures.The objective of this study is to investigate the relation between the number of laser pulses, number of laser passes through the channel of ablation site and their etch performance. Parameters such as frequency, fluence and velocity were retained as constants. In this paper, we present a parametric characterization study on silicon using KrF excimer laser micromachining. From the result, the etch rate change were recorded as the two major laser parameters (Number of laser pulses and number of laser passes) were varied. Both parameters were showing declination profile however from comparing both graphs, it showed that etch rate dropped more steeply when varied number of laser passes rather than number of pulses.

Efficient keV x‐ray emission from plasmas generated with 4 ps KrF excimer laser pulses

1993 ◽  
Vol 63 (22) ◽  
pp. 3046-3048 ◽  
Author(s):  
I. C. E. Turcu ◽  
I. N. Ross ◽  
G. J. Tallents
Keyword(s):  
Excimer Laser ◽  
Laser Pulses ◽  
X Ray ◽  
Krf Excimer Laser

Poly-Resistor Thin Film Formation by Excimer Laser Micromachine

2015 ◽  
Vol 780 ◽  
pp. 17-21
Author(s):  
A.F.M. Anuar ◽  
Yufridin Wahab ◽  
M.Z. Zainol ◽  
H. Fazmir ◽  
M. Najmi ◽  
...  
Keyword(s):  
Thin Film ◽  
Excimer Laser ◽  
Laser Energy ◽  
Film Formation ◽  
Chemical Vapor ◽  
Laser Pulses ◽  
Beam Size ◽  
Silicon Thin Film ◽  
Pressure Chemical ◽  
Krf Excimer Laser

A simple theoretical model and resistor fabrication for calculating the resistance of a polycrystalline silicon thin film is presented. The resistance value for poly-resistor is perfomed in terms of polysilicon thickness and its total area. The KrF excimer laser micromachine is used in assisting the resistor formation for a low pressure chemical vapor deposition (LPCVD) based polysilicon. Laser micromachine with three main parameters is used to aid the fabrication of the poly-resistor; namely as the pulse rate (i.e. number of laser pulses per second), laser beam size and laser energy. These parameters have been investigated to create the isolation between materials and also to achieve the desired poly-resistor shape. Preliminary results show that the 35 um beam size and 15 mJ of energy level is the most effective parameter to produce the pattern. Poly-resistor formation with 12 and 21 number of squares shows the total average resistance of 303.52 Ω and 210.14 Ω respectively. The laser micromachine process also significantly reduce the total time and number of process steps that are required for resistor fabrication.

High-Concentration, Low-Temperature, and Low-Cost Excimer Laser Doping for 4H-SiC Power Device Fabrication

2019 ◽  
Vol 963 ◽  
pp. 403-406
Author(s):  
Kaname Imokawa ◽  
Toshifumi Kikuchi ◽  
Kento Okamoto ◽  
Daisuke Nakamura ◽  
Akihiro Ikeda ◽  
...  
Keyword(s):  
Thin Film ◽  
Excimer Laser ◽  
Low Cost ◽  
Device Fabrication ◽  
Contact Resistivity ◽  
Power Devices ◽  
High Concentration ◽  
Laser Doping ◽  
Krf Excimer Laser ◽  
Al Thin Film

We developed a novel KrF excimer laser doping system for 4H-SiC power devices, and demonstrated laser doping of 4H-SiC with Al thin film deposited on the surface. As seen from the results of the Al depth profile, high concentration implantation (~ 1021 cm-3 at the surface) of Al was achieved by laser ablation of the Al thin film. A high, built-in-potential (~3.5 V) of the pn junction diode was clearly seen in the I-V curve. In addition, the contact resistivity of the deposited Al/Ti electrodes on the surface was 1.9 × 10−4 Ωcm2 by TLM (Transmission Line Model). It was confirmed that a high concentration of Al doping and low contact resistivity were achieved by the KrF excimer laser doping system.

High-order harmonic generation by subpicosecond KrF excimer laser pulses

1996 ◽  
Vol 21 (1) ◽  
pp. 15 ◽  
Author(s):  
Yutaka Nagata ◽  
Katsumi Midorikawa ◽  
Minoru Obara ◽  
Koichi Toyoda
Keyword(s):  
Excimer Laser ◽  
Harmonic Generation ◽  
Laser Pulses ◽  
High Order ◽  
High Order Harmonic Generation ◽  
High Order Harmonic ◽  
Krf Excimer Laser

STUDY OF COLORATION ON EXCIMER LASER TREATED TITANIUM SURFACES

2008 ◽  
Vol 15 (05) ◽  
pp. 675-679 ◽  
Author(s):  
H. X. QIAN ◽  
WEI ZHOU ◽  
H. Y. ZHENG
Keyword(s):  
Excimer Laser ◽  
Photoelectron Spectroscopy ◽  
Morphological Difference ◽  
Surface Oxidation ◽  
Laser Pulses ◽  
Compositional Variation ◽  
X Ray ◽  
Chemical States ◽  
Titanium Surfaces ◽  
Krf Excimer Laser

Surface oxidation of Ti was carried out using KrF excimer laser in the presence of O 2. Different colors were obtained by varying the number of laser pulses at the fixed laser fluence. X-ray photoelectron spectroscopy shows that the outmost surface is composed of TiO 2 and the inner layer consists of TiO and Ti 2 O 3 as well as TiO 2. Fractions of titanium chemical states stabilized at 33% TiO , 63% TiO 2, and 2% Ti 2 O 3 with increasing number of laser pulses. The surface roughness tends to increase with number of laser pulses. It is suggested that compositional variation and morphological difference contribute to the laser-induced surface coloration.

ArF Excimer Laser Micromachining of MEMS Materials: Characterization and Applications

2014 ◽  
Vol 2 (2) ◽  
Author(s):  
Kewei Liu ◽  
Yoontae Kim ◽  
Hongseok (Moses) Noh
Keyword(s):  
Laser Ablation ◽  
Excimer Laser ◽  
Laser Pulses ◽  
Laser Micromachining ◽  
Laser Frequency ◽  
Excimer Laser Ablation ◽  
Characterization Study ◽  
Arf Excimer Laser ◽  
Etch Rates ◽  
Krf Excimer Laser

Excimer laser ablation is a versatile technique that can be used for a variety of different materials. Excimer laser ablation overcomes limitations of conventional two-dimensional (2D) microfabrication techniques and facilitates three-dimensional (3D) micromanufacturing. Previously, we have reported a characterization study on 248 nm KrF excimer laser micromachining. This paper extends the study to 193 nm ArF excimer laser micromachining on five representative micro-electro-mechanical systems (MEMS) materials (Si, soda-lime glass, SU-8, polydimethylsiloxane (PDMS), and polyimide). Relations between laser parameters (fluence, frequency and number of laser pulses) and etch performances (etch rates, aspect ratio, and surface quality) were investigated. Etch rate per shot was proportional to laser fluence but inversely proportional to number of laser pulses. Laser frequency did not show a notable impact on etch rates. Aspect ratio was also proportional to laser fluence and number of laser pulses but was not affected by laser frequency. Materials absorbance spectrum was found to have important influence on etch rates. Thermal modeling was conducted as well using numerical simulation to investigate how the photothermal ablation mechanism affects the etching results. Thermal properties of material, primarily thermal conductivity, were proved to have significant influence on etching results. Physical deformation in laser machined sites was also investigated using scanning electron microscopy (SEM) imaging. Element composition of redeposited materials around ablation site was analyzed using energy dispersive x-ray spectroscopy (EDXS) analysis. Combined with our previous report on KrF excimer laser micromachining, this comprehensive characterization study provides guidelines to identify optimized laser ablation parameters for desired microscale structures on MEMS materials. In order to demonstrate the 3D microfabrication capability of ArF excimer laser, cutting and local removal of insulation for a novel floating braided neural probe made of polyimide and nichrome was conducted successfully using the optimized laser ablation parameters obtained in the current study.

scholarly journals Random noise can help to improve synchronization of excimer laser pulses

2016 ◽  
Vol 3 (2) ◽  
pp. 150548
Author(s):  
Róbert Mingesz ◽  
Angéla Barna ◽  
Zoltán Gingl ◽  
János Mellár
Keyword(s):  
Excimer Laser ◽  
Electromagnetic Interference ◽  
Random Noise ◽  
Laser Pulses ◽  
Optical Signal ◽  
Digital Control System ◽  
Flexible System ◽  
Random Jitter ◽  
Krf Excimer Laser

Recently, we have reported on a compact microcontroller-based unit developed to accurately synchronize excimer laser pulses (Mingesz et al. 2012 Fluct. Noise Lett. 11, 1240007 ( doi:10.1142/S021947751240007X )). We have shown that dithering based on random jitter noise plus pseudorandom numbers can be used in the digital control system to radically reduce the long-term drift of the laser pulse from the trigger and to improve the accuracy of the synchronization. In this update paper, we present our new experimental results obtained by the use of the delay-controller unit to tune the timing of a KrF excimer laser as an addition to our previous numerical simulation results. The hardware was interfaced to the laser using optical signal paths in order to reduce sensitivity to electromagnetic interference and the control algorithm tested by simulations was applied in the experiments. We have found that the system is able to reduce the delay uncertainty very close to the theoretical limit and performs well in real applications. The simple, compact and flexible system is universal enough to also be used in various multidisciplinary applications.

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