Microstructure, electrical properties, and thermal stability of Al ohmic contacts to n-GaN

1996 ◽  
Vol 11 (9) ◽  
pp. 2257-2262 ◽  
Author(s):  
L. L. Smith ◽  
R. F. Davis ◽  
M. J. Kim ◽  
R. W. Carpenter ◽  
Y. Huang
Keyword(s):  
Room Temperature ◽  
Ohmic Contacts ◽  
Secondary Phase ◽  
High Resolution Electron Microscopy ◽  
Contact Resistivity ◽  
Cross Sectional ◽  
Resolution Electron ◽  
Secondary Phase Formation ◽  
Specific Contact ◽  
Diffraction Patterns

As-deposited Al contacts were ohmic with a room-temperature contact resistivity of 8.6 × 10−5 Ω · cm2 on Ge-doped, highly n-type GaN (n = 5 × 1019 cm−3). They remained thermally stable to at least 500 °C, under flowing N2 at atmospheric pressure. The specific contact resistivities (ρc) calculated from TLM measurements on as-deposited Al layers were found to range from 8.6 × 10−5 Ω · cm2 at room temperature and 6.2 × 10−5 Ω · cm2 at 500 °C. Annealing treatments at 550 °C and 650 °C for 60 s each under flowing N2 resulted in an overall increase of contact resistivity. Cross-sectional, high-resolution electron microscopy (HREM) revealed that interfacial secondary phase formation occurred during high-temperature treatments, and coincided with the degradation of contact performance. Electron diffraction patterns from the particles revealed a cubic structure with lattice constant a = 0.784 nm, and faceting occurring on the {100} faces. Spectroscopic analysis via electron energy loss spectroscopy (EELS) revealed the presence of nitrogen and small amounts of oxygen in the Al layer, but no appreciable amounts of Ga. The results of microstructural and crystallographic characterization indicate that the new interfacial phase is a type of spinel Al nitride or Al oxynitride.

Microstructure, electrical properties, and thermal stability of Au-based ohmic contacts to p-GaN

1997 ◽  
Vol 12 (9) ◽  
pp. 2249-2254 ◽  
Author(s):  
L. L. Smith ◽  
R. F. Davis ◽  
M. J. Kim ◽  
R. W. Carpenter ◽  
Y. Huang
Keyword(s):  
High Temperature ◽  
Ohmic Contacts ◽  
Microstructural Characterization ◽  
Secondary Phase ◽  
High Resolution Electron Microscopy ◽  
Contact Resistivity ◽  
Cross Sectional ◽  
Ohmic Behavior ◽  
Specific Contact ◽  
Specific Contact Resistivity

The work described in this paper is part of a systematic study of ohmic contact strategies for GaN-based semiconductors. Gold contacts exhibited ohmic behavior on p-GaN when annealed at high temperature. The specific contact resistivity (ρc) calculated from TLM measurements on Au/p-GaN contacts was 53 Ω · cm2 after annealing at 800 °C. Multilayer Au/Mg/Au/p-GaN contacts exhibited linear, ohmic current-voltage (I-V) behavior in the as-deposited condition with ρc = 214 Ω · cm2. The specific contact resistivity of the multilayer contact increased significantly after rapid thermal annealing (RTA) through 725 °C. Cross-sectional microstructural characterization of the Au/p-GaN contact system via high-resolution electron microscopy (HREM) revealed that interfacial secondary phase formation occurred during high-temperature treatments, which coincided with the improvement of contact performance. In the as-deposited multilayer Au/Mg/Au/p-GaN contact, the initial 32 nm Au layer was found to be continuous. However, Mg metal was found in direct contact with the GaN in many places in the sample after annealing at 725 °C for 15 s. The resultant increase in contact resistance is believed to be due to the barrier effect increased by the presence of the low work function Mg metal.

A transmission electron microscopy study of the crystallinity and secondary phase formation in melt-processed YBa2Cu3O7−δ

1996 ◽  
Vol 11 (12) ◽  
pp. 2990-2999 ◽  
Author(s):  
Y. Yan ◽  
D. A. Cardwell ◽  
A. M. Campbell ◽  
W. M. Stobbs
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Secondary Phase ◽  
High Resolution Electron Microscopy ◽  
Microscopy Study ◽  
Electron Microscopy Study ◽  
Transmission Electron ◽  
Resolution Electron ◽  
Secondary Phase Formation ◽  
Layer Stacking

The microstructure of large grain melt-processed YBa2Cu3O7−δ containing 10 molar% excess Y2BaCuO5 prepared and oxygenated under atmospheric pressure has been investigated by transmission electron microscopy (TEM) and optical microscopy. These materials always contain parallel structural and microscopic platelet-like features in the crystallographic a-b plane of a few microns spacing which have been variously described as grain boundaries or microcracks. We have observed such features, which clearly influence the flow of current in melt-processed YBCO, to consist of copper deficient, impurity phase material which can be either amorphous or crystalline in nature. A variety of defects have been observed by high-resolution electron microscopy (HREM) in the vicinity of these platelet boundaries, including double and triple CuO layer stacking faults, which may constitute effective flux pinning sites.

Formation of β-FeSi2, by thermal annealing of Fe-implanted (001) Si

1993 ◽  
Vol 51 ◽  
pp. 808-809
Author(s):  
X.W. Lin ◽  
Z. Liliental-Weber ◽  
J. Washburn ◽  
J. Desimoni ◽  
H. Bernas
Keyword(s):  
Thermal Annealing ◽  
Room Temperature ◽  
Solid Phase ◽  
Ion Beam ◽  
High Resolution Electron Microscopy ◽  
Optoelectronic Device ◽  
Amorphous Layer ◽  
Cross Sectional ◽  
Resolution Electron ◽  
Device Technology

Epitaxy of semiconducting β-FeSi2 on Si is of interest for optoelectronic device technology, because of its direct bandgap of ≈0.9 eV. Several techniques, including solid phase epitaxy (SPE) and ion beam synthesis, have been successfully used to grow β-FeSi2 on either Si (001) or (111) wafers. In this paper, we report the epitaxial formation of β-FeSi2 upon thermal annealing of an Fe-Si amorphous layer formed by ion implantation.Si (001) wafers were first implanted at room temperature with 50-keV Fe+ ions to a dose of 0.5 - 1×1016 cm−2, corresponding to a peak Fe concentration of cp ≈ 2 - 4 at.%, and subsequently annealed at 320, 520, and 900°C, in order to induce SPE of the implanted amorphous layer. Cross-sectional high-resolution electron microscopy (HREM) was used for structural characterization.We find that the implanted surface layer ( ≈100 nm thick) remains amorphous for samples annealed at 320°C for as long as 3.2 h, whereas annealing above 520°C results in SPE of Si, along with precipitation of β-FeSi2.

Microstructure, electrical properties, and thermal stability of Ti-based ohmic contacts to n-GaN

1999 ◽  
Vol 14 (3) ◽  
pp. 1032-1038 ◽  
Author(s):  
L. L. Smith ◽  
R. F. Davis ◽  
R-J. Liu ◽  
M. J. Kim ◽  
R. W. Carpenter
Keyword(s):  
Photoelectron Spectroscopy ◽  
Room Temperature ◽  
Ohmic Contacts ◽  
Tem Analysis ◽  
Cross Sectional ◽  
X Ray ◽  
Transmission Electron ◽  
Specific Contact ◽  
Contact Resistivities ◽  
Thermal Stability Of

Single Ti layers, single TiN layers, and thin Ti films overlayered with Au were investigated as ohmic contacts to n-type (n 4.5 × 1017 to 7.4 × 1018 cm−3) single-crystal GaN (0001) films. Transmission line measurements (TLM) revealed the as-deposited TiN and Au/Ti contacts on n = 1.2 − 1018 cm−3 to be ohmic with room-temperature specific contact resistivities of 650 and 2.5 × 107minus;5 Ω cm2, respectively. Single Ti layer contacts had high resistance and were weakly rectifying in the as-deposited condition. The three contact/GaN systems exhibited a substantial decrease in resistivity after annealing; the value of ρc was also a function of the carrier concentration in the GaN. The Au/Ti contacts exhibited the lowest resistivity values yet observed in these contact studies, particularly for the more lightly doped n-GaN. The ρc for n = 1.2 × 1018 cm−3 reached 1.2 × 1026 Ω cm2; for n = 4.5 × 1017 cm−3, ρc = 7.5 × 1025 Ω cm2 after annealing both samples through 900 °C. X-ray photoelectron spectroscopy (XPS) and high-resolution cross-sectional transmission electron microscopy (X-TEM) analysis revealed the formation of TiN at the interface of annealed Ti layers in contact with GaN, which is believed to be beneficial for ohmic contact performance on n-GaN.

Electrical and microstructural characteristics of Ge/Cu ohmic contacts to n-type GaAs

1997 ◽  
Vol 12 (9) ◽  
pp. 2325-2331 ◽  
Author(s):  
M. O. Aboelfotoh ◽  
S. Oktyabrsky ◽  
J. Narayan ◽  
J. M. Woodall
Keyword(s):  
Ohmic Contacts ◽  
Field Effect Transistors ◽  
Contact Resistivity ◽  
Microstructural Characteristics ◽  
Cross Sectional ◽  
Ohmic Behavior ◽  
Transmission Electron ◽  
Wide Range ◽  
Specific Contact ◽  
Abrupt Interface

It is shown that Cu–Ge alloys prepared by depositing sequentially Cu and Ge layers onto GaAs substrates at room temperature followed by annealing at 400 °C form a low-resistance ohmic contact to n-type GaAs over a wide range of Ge concentration that extends from 15 to 40 at. %. The contacts exhibit a specific contact resistivity of 7 × 10−7 Ω cm2 on n-type GaAs with doping concentrations of 1 × 1017 cm−3. The contact resistivity is unaffected by varying the Ge concentration in the range studied and is not influenced by the deposition sequence of the Cu and Ge layers. Cross-sectional high-resolution transmission electron microscopy results show that the addition of Ge to Cu in this concentration range causes Cu to react only with Ge forming the ξ and ε1–Cu3Ge phases which correlate with the low contact resistivity. The ξ and ε1–Cu3Ge phases have a planar and structurally abrupt interface with the GaAs substrate without any interfacial transition layer. It is suggested that Ge is incorporated into the GaAs as an n-type impurity creating a highly doped n+-GaAs surface layer which is responsible for the ohmic behavior. n-channel GaAs metal-semiconductor field-effect transistors using ohmic contacts formed with the ξ and ε1–Cu3Ge phases demonstrate a higher transconductance compared to devices with AuGeNi contacts.

Anisotropic radiation damage of potassium tetracyano platinate (KCP)

1978 ◽  
Vol 36 (1) ◽  
pp. 392-393
Author(s):  
N. Uyeda ◽  
E. J. Kirkland ◽  
B. M. Siegel
Keyword(s):  
Electron Diffraction ◽  
Radiation Damage ◽  
Structural Changes ◽  
High Resolution Electron Microscopy ◽  
Radiation Sensitivity ◽  
Resolution Electron ◽  
Damage Process ◽  
Diffraction Patterns ◽  
Fading Rate

The direct observation of structural change by high resolution electron microscopy will be essential for the better understanding of the damage process and its mechanism. However, this approach still involves some difficulty in quantitative interpretation mostly being due to the quality of obtained images. Electron diffraction, using crystalline specimens, has been the method most frequently applied to obtain a comparison of radiation sensitivity of various materials on the quantitative base. If a series of single crystal patterns are obtained the fading rate of reflections during the damage process give good comparative measures. The electron diffraction patterns also render useful information concerning the structural changes in the crystal. In the present work, the radiation damage of potassium tetracyano-platinate was dealt with on the basis two dimensional observation of fading rates of diffraction spots. KCP is known as an ionic crystal which possesses “one dimensional” electronic properties and it would be of great interest to know if radiation damage proceeds in a strongly asymmetric manner.

Characterization of Rh/Si multilayer structure by HREM and HAADF

1992 ◽  
Vol 50 (1) ◽  
pp. 122-123
Author(s):  
Y. Cheng ◽  
J. Liu ◽  
M.B. Stearns ◽  
D.G. Steams
Keyword(s):  
Normal Incidence ◽  
High Resolution Electron Microscopy ◽  
X Rays ◽  
Beam Direction ◽  
Cross Sectional ◽  
Optical Elements ◽  
Resolution Electron ◽  
Point To Point ◽  
Better Than

The Rh/Si multilayer (ML) thin films are promising optical elements for soft x-rays since they have a calculated normal incidence reflectivity of ∼60% at a x-ray wavelength of ∼13 nm. However, a reflectivity of only 28% has been attained to date for ML fabricated by dc magnetron sputtering. In order to determine the cause of this degraded reflectivity the microstructure of this ML was examined on cross-sectional specimens with two high-resolution electron microscopy (HREM and HAADF) techniques.Cross-sectional specimens were made from an as-prepared ML sample and from the same ML annealed at 298 °C for 1 and 100 hours. The specimens were imaged using a JEM-4000EX TEM operating at 400 kV with a point-to-point resolution of better than 0.17 nm. The specimens were viewed along Si [110] projection of the substrate, with the (001) Si surface plane parallel to the beam direction.

TEM Studies and Contact Resistance of Au/Ni/Ti/Ta/n-GaN Ohmic Contacts

2003 ◽  
Vol 764 ◽  
Author(s):  
D.N. Zakharov ◽  
Z. Liliental-Weber ◽  
A. Motayed ◽  
S.N. Mohammad
Keyword(s):  
Contact Resistance ◽  
Ohmic Contacts ◽  
High Resolution Electron Microscopy ◽  
X Ray ◽  
Electron Energy Loss Spectrometry ◽  
Resolution Electron ◽  
Order Of Magnitude ◽  
Contact Surfaces ◽  
Electron Energy Loss ◽  
Magnitude Difference

AbstractOhmic Ta/Ti/Ni/Au contacts to n-GaN have been studied using high resolution electron microscopy (HREM), energy dispersive X-ray spectrometry (EDX) and electron energy loss spectrometry (EELS). Two different samples were used: A - annealed at 7500C withcontact resistance 5×10-6 Ω cm2 and B-annealed at 7750C with contact resistance 6×10-5 Ω cm2. Both samples revealed extensive in- and out-diffusion between deposited layers with some consumption ofGaNlayerand formation of TixTa1-xN50 (0<x<25) at the GaN interface. Almost an order of magnitude difference in contact resistances can be attributed to structure and chemical bonding of Ti-O layers formed on the contact surfaces.

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