Micromachined Shear Stress Sensors for Characterization of Surface Forces During Chemical Mechanical Polishing

2007 ◽  
Vol 991 ◽  
Author(s):  
Andrew Mueller ◽  
Robert White ◽  
Vincent Manno ◽  
Chris Rogers ◽  
Sriram Anjur ◽  
...  
Keyword(s):  
Shear Stress ◽  
Chemical Mechanical Polishing ◽  
Surface Forces ◽  
Mechanical Polishing ◽  
Contact Forces ◽  
Scale Model ◽  
Dimethyl Siloxane ◽  
Stress Sensors ◽  
Shear Stress Sensors

ABSTRACTThis paper describes the fabrication and calibration of micromachined shear stress sensors intended for characterization of the local pad-wafer contact forces present during chemical-mechanical polishing. Sensors consist of arrays of microfabricated poly-dimethyl-siloxane (PDMS) posts and are able to measure forces ranging from 2 to 200 μN. The posts are 100 μm high and have diameters of 40-100 μm. Calibrated post deflection sensitivities are linear and lie between 0.2 μm/μN and 1.3μm/μN. Sensor design, fabrication, and calibration are detailed. Feasibility is established for sensor integration into a CMP scale model test setup, including an optical viewing method for observing post deflection during polishing. Initial micrographs of post deflection during polishing do not yet have sufficient resolution to determine the microscale forces during polishing.

Micromachined Lateral Force Sensors for Characterization of Microscale Surface Forces During Chemical Mechanical Polishing

2008 ◽  
Vol 1085 ◽  
Author(s):  
Douglas Gauthier ◽  
Andrew Mueller ◽  
Robert David White ◽  
Vincent Manno ◽  
Chris Rogers ◽  
...  
Keyword(s):  
Chemical Mechanical Polishing ◽  
Fumed Silica ◽  
Lateral Force ◽  
Surface Forces ◽  
Mechanical Polishing ◽  
Force Sensors ◽  
Dimethyl Siloxane ◽  
Lateral Forces ◽  
Silica Slurry

ABSTRACTMicromachined structures with diameters ranging from 50 — 100 μm have been applied to the measurement of the microscale shearing forces present at the wafer-pad interface during chemical mechanical polishing (CMP). The structures are 80 μm high poly-dimethyl-siloxane posts with bending stiffnesses ranging from 1.6 to 14 μN/μm. The structures were polished using a stiff, ungrooved pad and 3 wt% fumed silica slurry at relative velocities of approximately 0.5 m/s and downforces of approximately 1 psi. Observed lateral forces on the structures were on the order of 5–500 μN, and highly variable in time.

Design and characterization of microfabricated piezoresistive floating element-based shear stress sensors

2007 ◽  
Vol 134 (1) ◽  
pp. 77-87 ◽  
Author(s):  
A. Alvin Barlian ◽  
Sung-Jin Park ◽  
Vikram Mukundan ◽  
Beth L. Pruitt
Keyword(s):  
Shear Stress ◽  
Stress Sensors ◽  
Shear Stress Sensors ◽  
Floating Element

Design, Fabrication, and Characterization of Piezoresistive MEMS Shear Stress Sensors

2005 ◽  
Author(s):  
A. Alvin Barlian ◽  
Sung-Jin Park ◽  
Vikram Mukundan ◽  
Beth L. Pruitt
Keyword(s):  
Shear Stress ◽  
Force Sensor ◽  
Lateral Force ◽  
Stress Sensors ◽  
Silicon Cantilever ◽  
Shear Stress Sensors ◽  
Out Of Plane ◽  
Order Of Magnitude ◽  
Fabrication And Characterization

This paper presents the design, fabrication, and characterization of unique piezoresistive microfabricated shear stress sensors for direct measurements of shear stress underwater. The uniqueness of this design is in its transduction scheme which uses sidewall-implanted piezoresistors to measure lateral force (and shear stress), along with traditional top-implanted piezoresistors to detect normal forces. Aside from the oblique-implant technique, the fabrication process also includes hydrogen anneal step to smooth scalloped silicon sidewalls due to Deep Reactive Ion Etch process, which was shown to reduce 1/f noise level by almost an order of magnitude for the sidewall-implanted piezoresistors. Lateral sensitivity characterization of the sensors was done using a microfabricated silicon cantilever force sensor, while out-of-plane characterization was done using Laser Doppler Vibrometry technique. In-plane sensitivity and out-of-plane crosstalk were characterized, as well as hysteresis and repeatability of the measurements. The sensors are designed to be used underwater for various applications.

Microfabricated shear stress sensors. I - Design and fabrication

AIAA Journal ◽  
1999 ◽  
Vol 37 ◽  
pp. 66-72
Author(s):  
Tao Pan ◽  
Daniel Hyman ◽  
Mehran Mehregany ◽  
Eli Reshotko ◽  
Steven Garverick
Keyword(s):  
Shear Stress ◽  
Stress Sensors ◽  
Shear Stress Sensors

Characterization and Control of Copper CMP with Optoacoustic Metrology

2001 ◽  
Vol 671 ◽  
Author(s):  
Michael Gostein ◽  
Paul Lefevre ◽  
Alex A. Maznev ◽  
Michael Joffe
Keyword(s):  
Film Thickness ◽  
Spatial Resolution ◽  
Chemical Mechanical Polishing ◽  
High Spatial Resolution ◽  
Mechanical Polishing ◽  
Length Measurement ◽  
And Control ◽  
Non Destructive

ABSTRACTWe discuss applications of optoacoustic film thickness metrology for characterization of copper chemical-mechanical polishing (CMP). We highlight areas where the use of optoacoustics for CMP characterization provides data complementary to that obtained by other techniques because of its ability to directly measure film thickness with high spatial resolution in a rapid, non-destructive manner. Examples considered include determination of planarization length, measurement of film thickness at intermediate stages of polish, and measurement of arrays of metal lines.

Sign in / Sign up

Export Citation Format

Share Document