Characterization of Dressing Behaviors and Optimization Technique in Chemical Mechanical Polishing

2009 ◽  
Keyword(s):  
Chemical Mechanical Polishing ◽  
Optimization Technique ◽  
Mechanical Polishing

Characterization and Control of Copper CMP with Optoacoustic Metrology

2001 ◽  
Vol 671 ◽  
Author(s):  
Michael Gostein ◽  
Paul Lefevre ◽  
Alex A. Maznev ◽  
Michael Joffe
Keyword(s):  
Film Thickness ◽  
Spatial Resolution ◽  
Chemical Mechanical Polishing ◽  
High Spatial Resolution ◽  
Mechanical Polishing ◽  
Length Measurement ◽  
And Control ◽  
Non Destructive

ABSTRACTWe discuss applications of optoacoustic film thickness metrology for characterization of copper chemical-mechanical polishing (CMP). We highlight areas where the use of optoacoustics for CMP characterization provides data complementary to that obtained by other techniques because of its ability to directly measure film thickness with high spatial resolution in a rapid, non-destructive manner. Examples considered include determination of planarization length, measurement of film thickness at intermediate stages of polish, and measurement of arrays of metal lines.

Frictional Characterization of Chemical–Mechanical Polishing Pad Surface and Diamond Conditioner Wear

2008 ◽  
Vol 47 (8) ◽  
pp. 6282-6287 ◽  
Author(s):  
Yohei Yamada ◽  
Masanori Kawakubo ◽  
Osamu Hirai ◽  
Nobuhiro Konishi ◽  
Syuhei Kurokawa ◽  
...  
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Polishing Pad ◽  
Diamond Conditioner
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