Ion Implantation Damage in Aluminum Studied by Quantitative Electron Chanelling and Tem.

1988 ◽  
Vol 100 ◽  
Author(s):  
Ronald G. Vardiman

ABSTRACTElectron chanelling linewidth changes in aluminum have been measured as a function of dose for boron and aluminum ion implantation. Weak beam TEM observations assist interpretation of the results by showing the nature and degree of the damage. For self implantation, a linear relationship between dose, linewidth, and dislocation density has been found up to 3×1017ions/cm2. For boron implantation, a new point-like defect appears at the higher boron concentrations, giving a much slower increase of chanelling linewidth with dose above l×1016 ions/cm2. Boron interaction with the damage stabilizes higher damage acumilations than for sel f-i mpl antati on.

2007 ◽  
Vol 28 (12) ◽  
pp. 1089-1091 ◽  
Author(s):  
R. Singanamalla ◽  
H. Y. Yu ◽  
B. Van Daele ◽  
S. Kubicek ◽  
K. De Meyer

1980 ◽  
Vol 1 ◽  
Author(s):  
T. O. Yep ◽  
R. T. Fulks ◽  
R. A. Powell

ABSTRACTSuccessful annealing of p+ n arrays fabricated by ion-implantation of 11B (50 keV, 1 × 1014 cm-2) into Si (100 has been performed using a broadly rastered, low-resolution (0.25-inch diameter) electron beam. A complete 2" wafer could be uniformly annealed in ≃20 sec with high electrical activation (>75%) and small dopant redistribution (≃450 Å). Annealing resulted In p+n junctions characterized by low reverse current (≃4 nAcm-2 at 5V reverse bias) and higher carrier lifetime (80 μsec) over the entire 2" wafer. Based on the electrical characteristics of the diodes, we estimate that the electron beam anneal was able to remove ion implantation damage and leave an ordered substrate to a depth of 5.5 m below the layer junction.


2009 ◽  
Vol 159-160 ◽  
pp. 168-172
Author(s):  
I. Mica ◽  
L. Di Piazza ◽  
L. Laurin ◽  
M. Mariani ◽  
A.G. Mauri ◽  
...  

1983 ◽  
Vol 27 ◽  
Author(s):  
H. Kanber ◽  
M. Feng ◽  
J. M. Whelan

ABSTRACTArsenic and argon implantation damage is characterized by Rutherford backscattering in GaAs undoped VPE buffer layers grown on Cr-O doped semi-insulating substrates and capless annealed in a H2 −As4 atmosphere provided by AsH3. The damage detected in the RBS channeled spectra varies as a function of the ion mass, the implant depth and the annealing temperature of the stress-free controlled atmosphere technique. This damage is discussed in terms of the stoichiometric disturbances introduced by the implantation process. The as-implanted and annealed damage characteristics of the Ar and As implants are correlated to the electrical activation characteristics of Si and Se implants in GaAs, respectively.


1973 ◽  
Vol 22 (5) ◽  
pp. 238-240 ◽  
Author(s):  
C.M. Hsieh ◽  
J.R. Mathews ◽  
H.D. Seidel ◽  
K.A. Pickar ◽  
C.M. Drum

2016 ◽  
Vol 55 (4S) ◽  
pp. 04EG05 ◽  
Author(s):  
Kenji Shiojima ◽  
Shingo Murase ◽  
Shingo Yamamoto ◽  
Tomoyoshi Mishima ◽  
Tohru Nakamura

1976 ◽  
Vol 29 (11) ◽  
pp. 698-699 ◽  
Author(s):  
C. O. Bozler ◽  
J. P. Donnelly ◽  
W. T. Lindley ◽  
R. A. Reynolds

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