Metallic Glass Formation Diagrams

1982 ◽  
Vol 19 ◽  
Author(s):  
B. C. Giessen ◽  
S. H. Whang
Keyword(s):  
Binary Alloy ◽  
Glass Formation ◽  
Composition Range ◽  
Equilibrium Phase ◽  
Alloy System ◽  
Equilibrium Phase Diagram ◽  
Two Dimensional ◽  
Fundamental Parameters ◽  
System Parameters ◽  
Binary Alloy System

ABSTRACTThe ability to predict ready glass formation (RGF) in binary alloy systems upon rapid cooling of the melt is of value both theoretically and practically. Two-dimensional maps show promise as a means of associating RGF with two system parameters which must have a combination of favorable values. In this paper, two types of glass formation diagrams are reviewed. One of these, the ΔH-r/R plot, is based on fundamental parameters which can, in principle, be derived from elemental quantities for each binary alloy system. The second type of diagram, the temperature-composition map, uses two equilibrium phase diagram features, namely reduced liquidus temperatures and reduced eutectic compositions to predict RGF. Both approaches are compared for binary alloys of Zr. The temperature-composition plot approach can be extended to predict qualitatively the RGF composition range of a given alloy system.

scholarly journals Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films

Materials ◽  
2020 ◽  
Vol 13 (6) ◽  
pp. 1330 ◽  
Author(s):  
Tatsuya Tsurusaki ◽  
Takeshi Ohgai
Keyword(s):  
Solid Solution ◽  
Equilibrium Phase ◽  
Alloy System ◽  
Equilibrium Phase Diagram ◽  
Solid Solution Phase ◽  
Alloy Films ◽  
Cu Substrate ◽  
Soldering Process ◽  
Fracture Elongation ◽  
Zn Alloy

Enforced solid solution type Sn-Zn alloy films were electrochemically synthesized on Cu substrate from an aqueous solution containing citric acid complexes. The electrodeposition behavior of Sn-Zn alloys was classified to a normal co-deposition type, in which electrochemically nobler Sn deposits preferentially compared to Zn. Electrodeposited Sn-Zn alloy films were composed of a non-equilibrium phase, like an enforced solid solution, which was not observed in an equilibrium phase diagram of an Sn-Zn binary alloy system. By applying a thermal annealing process at 150 °C for 10 minutes, a pure Zn phase was precipitated from an electrodeposited Sn-based solid solution phase with excessively dissolved Zn atoms. During the soldering process, intermetallic phases such as Cu3Sn and Cu5Zn8 were formed at the interface between an Sn-Zn alloy and Cu substrate. Tensile strength and fracture elongation of solder-jointed Cu rods with Sn-8 at.%Zn alloy films reached ca. 40 MPa and 12%, respectively.

Microstructure Analysis of The Channel Regions in Dual Two-phase Intermetallic Alloy Based on The Ni3Al-Ni3V Pseudo-binary Alloy System

2011 ◽  
Vol 1295 ◽  
Author(s):  
T. Moronaga ◽  
Y. Kaneno ◽  
H. Tsuda ◽  
T. Takasugi
Keyword(s):  
High Temperature ◽  
Binary Alloy ◽  
Lattice Misfit ◽  
Alloy System ◽  
Dark Field ◽  
Intermetallic Alloys ◽  
Two Phase ◽  
Transmission Electron ◽  
Phase Intermetallic ◽  
Binary Alloy System

ABSTRACTDual two-phase intermetallic alloys based on the Ni3Al-Ni3V pseudo-binary alloy system have been reported to display high phase and microstructure stabilities and good mechanical properties at high temperature and are therefore considered to be used as a next generation type of high temperature structural materials. The microstructure of the dual two-phase intermetallic alloys is composed of primary Ni3Al and the channel (eutectoid) regions consisting of Ni3Al+Ni3V. In this study, the microstructure of the channel regions was investigated by a transmission electron microscope (TEM). The contrasts of the channel regions showed a complicated microstructure in bright-field images. However, the electron beam diffraction consisted of a single set of patterns and the spots did not accompany streaks, indicating that crystallographic coherency among the constituent phases or the domains is very high. It was also shown that the lattice misfit between the a-axis of Ni3Al and the c-axis of Ni3V is larger than that between the a-axis of Ni3Al and the a-axis of Ni3V. From the dark-field observation, it was found that the c-axis of Ni3V domains in the channel regions is oriented perpendicular to the interface between primary Ni3Al and Ni3V. Therefore, it is suggested that the crystallographic orientation of Ni3V in the channel regions is aligned in the manner of lowering an internal stress caused by the lattice misfit between primary Ni3Al precipitates and Ni3V domains.

Bulk glass formation in the Ni–Zr–Ti–Nb–Si–Sn alloy system

2004 ◽  
Vol 19 (8) ◽  
pp. 2221-2225 ◽  
Author(s):  
J.Y. Lee ◽  
D.H. Bae ◽  
J.K. Lee ◽  
D.H. Kim
Keyword(s):  
Glass Formation ◽  
Liquidus Temperature ◽  
Eutectic Composition ◽  
Composition Range ◽  
Alloy System ◽  
Glass Forming Ability ◽  
Maximum Diameter ◽  
Bulk Glass ◽  
Glass Forming ◽  
Crystallization Onset

In this study, the effect of addition of Nb on glass formation in Ni–Ti–Zr–Si–Sn alloys has been studied. The composition range for bulk glass formation with Dmax > 2 mm (Dmax, maximum diameter for glass formation by injection cast method) becomes wider when compared with the non-Nb–containing alloy. The ΔTx (= Tx – Tg; Tx, crystallization onset temperature; Tg, glass transition temperature), Trg (= Tg/Tl; Tl, liquidus temperature) and γ [= Tx/(Tl + Tg)] values for the alloys Dmax > 2 mm are in the range of 40–59, 0.638–0.651, and 0.410–0.419, respectively. The compositions of the alloys (Dmax > 2 mm) are closer to pseudo-eutectic composition than that of the alloy without Nb, showing an improved glass forming ability. The critical cooling rate for glass formation (Dmax = 5 mm) is estimated to be order of approximately 40 K/s.

Effect of High Pressure on the Al‐Mn Binary Alloy System between 40 and 100 at.% Mn

1965 ◽  
Vol 36 (3) ◽  
pp. 1241-1242 ◽  
Author(s):  
D. Ernst ◽  
J. Tydings ◽  
M. Pasnak
Keyword(s):  
High Pressure ◽  
Binary Alloy ◽  
Alloy System ◽  
Binary Alloy System

The binary alloy system Au/Pd; a SIMS study

1982 ◽  
Vol 37 (9) ◽  
pp. 797-808 ◽  
Author(s):  
H. Gnaser ◽  
J. Marton ◽  
F.G. Rüdenauer ◽  
W. Steiger
Keyword(s):  
Binary Alloy ◽  
Alloy System ◽  
Binary Alloy System

scholarly journals Activities of Tin in the Liquid Gold Base Binary Alloy System

1977 ◽  
Vol 41 (9) ◽  
pp. 950-955 ◽  
Author(s):  
Kazuo Kameda ◽  
Senzi Sakairi ◽  
Yoshio Yoshida
Keyword(s):  
Binary Alloy ◽  
Alloy System ◽  
Liquid Gold ◽  
Binary Alloy System

scholarly journals The Impact of Pt Concentration on Crystal Growth Mechanism in Pt-Pd Binary Alloy System in the Context of Molecular Dynamics

2018 ◽  
Author(s):  
Servet Kizilagac ◽  
Fatih Ahmet Celik ◽  
Koray Koksal
Keyword(s):  
Crystal Growth ◽  
Growth Mechanism ◽  
Binary Alloy ◽  
Alloy System ◽  
Potential Energy Function ◽  
Perfect Crystal ◽  
Lattice Points ◽  
Crystal Growth Mechanism ◽  
Binary Alloy System ◽  
The Impact

This work aims to investigate the effect of Pt concentration on crystal growth mechanism of Platinum-Palladium (Pt-Pd) binary alloy system during the annealing process starting from amorphous phase until some definite temperatures. The calculations have been performed by using molecular dynamic (MD) simulations. Interatomic interactions are described by on Sutton-Chen type Embedded Atom Potential Energy function. In order to understand the main structural properties at the stable and unstable phases, changes in RDF curves versus time have been analysed for different annealing temperatures. Crystalline type bonded pairs have been determined using MD calculations which is required for the computation of Avrami coefficients and for understanding crystal growth mechanism. The results demonstrate that the increase in concentration of Pt during annealing leads to migration of atoms in the crystal lattice points, elimination of dislocations and formation of perfect crystal structure.

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