Electroless Copper Deposition for Multilevel Metallization

1990 ◽  
Vol 203 ◽  
Author(s):  
S.Simon Wong ◽  
James S. Cho ◽  
Ho K. Kang ◽  
C.H. Ting
Keyword(s):  
Surface Topography ◽  
Cross Talk ◽  
Current Density ◽  
Electroless Plating ◽  
High Resistance ◽  
Potential Problem ◽  
Integrated Systems ◽  
Signal Delay ◽  
Electroless Copper ◽  
Selective Technique

ABSTRACTIncreases in cross-talk disturbance, signal delay and current density have a significant impact on the performance of integrated systems as the metal pitch continues to be scaled down. A metal, such as copper, which has high conductivity and high resistance to migration, will greatly alleviate these problems. A selective technique for the deposition of copper, such as electroless plating, is highly desirable because it circumvents the potential problem of dry etching copper and inherently planarizes the surface topography.

POLYMER BRUSH-INDUCED ELECTROLESS COPPER PLATING TO FABRICATE Cu/CaCO3 COMPOSITE POWDER

2020 ◽  
pp. 2050053
Author(s):  
QIHONG LI ◽  
GUANGCHAO QIN ◽  
JUNJUN HUANG ◽  
CHENGMEI GUI ◽  
JINGUO BEI ◽  
...  
Keyword(s):  
Noble Metal ◽  
Electroless Plating ◽  
Composite Powder ◽  
Low Cost ◽  
Polymer Brush ◽  
Catalytic Site ◽  
Metal Catalyst ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Electroless plating can be used to prepare metal particle/CaCO3 composite powder, but the use of noble metal as catalytic site would increase the cost. In this work, we adopt the combined 3-amino-propyltriethoxysilane (KH550) modification and NiCl2 activation to coat CaCO3 powder by a uniform layer of Ni particles/polymer brush which acts as non-noble metal catalyst, then, a low-cost electroless plating to prepare Cu particle/CaCO3 composite powder was developed. Results showed hydrolyzed KH550 coated on the CaCO3 surface in the form of polymer brush. The active group on the polymer brush surface could chemisorb Ni[Formula: see text] and then Ni particles/polymer brush was attached on its surface. The Ni particle/polymer brush structure acted as catalytic site and could catalyze electroless copper plating on its surface. The [Formula: see text] is 1%, its average diameter is about 100[Formula: see text]nm. This means that the dependable technology has great potential application in preparing metal inorganic powder at a low cost.

Post-etch treatment enabled electroless copper metallization of porous dielectric

2013 ◽  
Vol 1559 ◽  
Author(s):  
Yezdi N. Dordi
Keyword(s):  
Electroless Plating ◽  
Dielectric Surface ◽  
Copper Deposition ◽  
Copper Metallization ◽  
Plasma Etch ◽  
Thin Carbon ◽  
Electroless Copper ◽  
Pet Film ◽  
Carbon Based

ABSTRACTThis paper describes an alternate two-step metallization scheme for porous dielectrics. The patterned dielectric surface is first treated in a plasma etch chamber where the dielectric surface is coated with a very thin carbon-based film. This is followed by electroless copper deposition. The plasma post-etch treatment (PET) film seals the pores of the dielectric, minimizes dielectric damage, and functionalizes the dielectric to enable electroless plating.

scholarly journals Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature

2020 ◽  
Vol 10 (24) ◽  
pp. 8893
Author(s):  
Zhao-Ying Wang ◽  
Nhat Minh Dang ◽  
Po-Hsun Wang ◽  
Terry Yuan-Fang Chen ◽  
Ming-Tzer Lin
Keyword(s):  
Intermetallic Compound ◽  
Growth Mechanism ◽  
Current Density ◽  
Structural Changes ◽  
Defect Formation ◽  
Copper Substrate ◽  
Signal Delay ◽  
Cross Sectional ◽  
Current Densities

In this study, the effects of electromigration on a solder/copper substrate due to temperature and current density stress were investigated. The copper–tin (Cu–Sn) film samples were subjected under a fixed current and various heating conditions (130 °C and 180 °C) and current densities (different cross-sectional areas). The micro-structural changes and intermetallic compound (IMC) formation were observed, and failure phenomena (brittle cracks, voids, bumps, etc.) on the structures of samples were discussed. The results showed that the IMC thickness increased as the temperature and current density increased. Moreover, it was found that the higher the temperature and current density was, the greater the defects that were observed. By adjusting the designs of sample structures, the stress from the current density can be decreased, resulting in reduced failure phenomena, such as signal delay, distortion, and short circuiting after long-term use of the material components. A detailed IMC growth mechanism and defect formation were also closely studied and discussed.

Laser-enhanced electroless plating of silver seed layers for selective electroless copper deposition

2008 ◽  
Vol 20 (4) ◽  
pp. 218-223 ◽  
Author(s):  
Nicholas S. Dellas ◽  
Kenneth Meinert ◽  
Suzanne E. Mohney
Keyword(s):  
Electroless Plating ◽  
Copper Deposition ◽  
Electroless Copper ◽  
Seed Layers

Study on Anodic Smoothening Velocity in Electrochemical Abrasive Lapping

2007 ◽  
Vol 329 ◽  
pp. 297-302
Author(s):  
Gui Bing Pang ◽  
Wen Ji Xu ◽  
Xu Yue Wang ◽  
A.D.Y. Xie ◽  
H.Y. Li ◽  
...  
Keyword(s):  
Surface Topography ◽  
Current Density ◽  
Machining Parameters ◽  
Grain Sizes ◽  
Abrasive Grain ◽  
Electrochemical Finishing

By analysing the change of the anodic surface topography in Electrochemical Abrasive Lapping (ECAL), the influence of the lapping action and the electrochemical action on the anodic smoothening velocity is studied. In electrochemical finishing, the micro-peaks on the anodic surface could be smoothened quickly by electrochemical action and the surface topography presents the profile wave, but in ECAL, the profile wave after electrochemical action could be divided into micro-peaks renewedly by lapping action and the alternation of electrochemical action and lapping action makes the surface topography before electrochemical action present profile micro-peaks, which will increase the anodic smoothening velocity. The influence of machining parameters, such as abrasive grain sizes, tool’s pressure, abrasive content, frictional velocity and current density etc, on the anodic smoothening velocity is discussed in detailed.

Fabrication and analysis of the mechanical properties of sandwich-type NPC composites by electroless plating NPC

RSC Advances ◽  
2016 ◽  
Vol 6 (116) ◽  
pp. 115175-115182
Author(s):  
Ying Wang ◽  
Shuhua Liang ◽  
Qing Yang
Keyword(s):  
Mechanical Properties ◽  
Electroless Plating ◽  
Electroless Copper ◽  
Sandwich Type

Design and preparation of a novel sandwich NPC material with good mechanical properties by electroless copper.

Direct Electroless Copper Plating on Polyimide for FPCB Applications

2007 ◽  
Vol 544-545 ◽  
pp. 709-712 ◽  
Author(s):  
Jae Ho Lee
Keyword(s):  
Electroless Plating ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Copper Plating ◽  
Optimum Conditions ◽  
Electroless Copper Plating ◽  
Additive Process ◽  
Copper Line ◽  
Electroless Copper ◽  
Copper Seed Layer

As electronic devices are getting smaller and lighter, the density of copper lines on flexible printed circuit board (FPCB) is getting higher. Conventionally, subtractive method was used for copper line on a flexible films, however, as the line pitch is getting smaller, the lateral etching of copper cause serious problem. To replace the subtractive method, semi-additive method was used for fine pitch copper line fabrication. In semi additive process, sputtered layer for the electroplating copper was required. The feasibility of electroless plating to replace high cost sputtered copper seed layer was investigated. Electroless depositions of copper were conducted on different substrate to find optimum conditions of electroless copper plating. To find optimum conditions, the effects and selectivity of activation method on several substrates were also investigated. The adhesion strength between polyimide and copper was improved by treating the polyimide surface with butylamines. Pretreatment prior to electroless plating is very sensitive and surface dependent. Surface morphologies were investigated with FESEM.

The Effect of Electro-Deposition Current Density to Silicon Steel’s Surface Topography and Microstructure

2014 ◽  
Vol 508 ◽  
pp. 83-86
Author(s):  
Hui Li ◽  
Yun Gang Li
Keyword(s):  
Surface Topography ◽  
Current Density ◽  
Electro Deposition ◽  
Deposition Current Density

This experiment shows the effect of Electro-deposition current density to silicon steels surface topography and microstructure, which is useful to determine the best process of electro-plating current density.

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