The Elastic, Plastic, and Time Dependent Properties of thin Films as Determined by Ultra low Load Indentation

1991 ◽  
Vol 239 ◽  
Author(s):  
B. N. Lucas ◽  
W. C. Oliver
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Sapphire Substrate ◽  
Time Dependent ◽  
Indentation Hardness ◽  
Alumina Film ◽  
Elastic Plastic ◽  
Spatially Resolved ◽  
Low Load ◽  
Amorphous Alumina

ABSTRACTUsing a highly spatially resolved mechanical properties microprobe, the elastic, plastic and time dependent mechanical properties of sapphire and a 1.9 μm amorphous alumina film on a sapphire substrate have been studied. Young's modulus, hardness, and stress-exponent data are reported. The technique for characterizing time dependent properties via indentation (hardness versus displacement rate/displacement) are directly compared to standard uniaxial compressive techniques (stress vs strain rate) for a bulk Pb-In alloy to further quantify the relationships between the two techniques.

Percolation Effects in the Mechanical Properties of Granular Ni-A12O3 thin films

1990 ◽  
Vol 195 ◽  
Author(s):  
T.E. Schlesinger ◽  
A. Gavrin ◽  
R.C. Cammarata ◽  
C.-L. Chien
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Plastic Deformation ◽  
Magnetic Properties ◽  
Percolation Threshold ◽  
Volume Fraction ◽  
Electrical And Magnetic Properties ◽  
Low Load

ABSTRACTThe mechanical properties of sputtered Ni-Al2O3 granular thin films were investigated by low load microharaness testing. It was found that the microhardness of these films displayed a percolation threshold at a nickel volume fraction of about 0.6, below which the hardness is greatly enhanced. This behavior is qualitatively similar to the electrical and magnetic properties of these types of films. A percolation threshold in hardness can be understood as due to a change in the mechanism for plastic deformation.

Mechanical properties of the GaN thin films deposited on sapphire substrate

1998 ◽  
Vol 189-190 ◽  
pp. 701-705 ◽  
Author(s):  
G Yu ◽  
H Ishikawa ◽  
T Egawa ◽  
T Soga ◽  
J Watanabe ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Sapphire Substrate

scholarly journals Practical Limitations to Indentation Testing of Thin Films

1997 ◽  
Vol 505 ◽  
Author(s):  
J. A. Schneider ◽  
K. F. McCarty ◽  
J. R. Heffelfinger ◽  
N. R. Moody
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Scanning Force Microscopy ◽  
Indentation Testing ◽  
Force Microscopy ◽  
Sapphire Substrates ◽  
Low Load ◽  
Scanning Force ◽  
Deposited Films

ABSTRACTA method that is becoming increasingly common for measuring the mechanical behavior of thin films is low-load indentation testing. However, there can be complications in interpreting the results as many factors can affect hardness and moduli measurements such as surface roughness and determination of the indentation contact area. To further our understanding, the mechanical properties of thin (50 nm) films of AlN on sapphire substrates were evaluated using a scanning force microscopy (SFM) based pico-indentation device to allow imaging of the surface and indentations. Our primary emphasis was the types of problems or limitations involved in testing very thin, as deposited films in which properties are desired over indentation depths less than 50 nm.

Mechanical Properties of Multilayered Copper-Nickel thin films Measured by Indentation Techniques

1990 ◽  
Vol 188 ◽  
Author(s):  
T. E. Schlesinger ◽  
R. C. Cammarata ◽  
C. Kim ◽  
S. B. Qadri ◽  
A. S. Edelstein
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Ion Beam ◽  
Repeat Length ◽  
Elastic Behavior ◽  
Ion Beam Sputtering ◽  
Individual Layer ◽  
Nickel Thin Films ◽  
Copper Nickel ◽  
Low Load

ABSTRACTArtificially multilayered copper/nickel thin films with bilayer repeat lengths between 1.6 and 12 nm were produced by ion beam sputtering. The mechanical properties of these films were investigated by low load microhardness and nanoindentation (force versus depth) techniques. It was found that none of the films displayed bilayer repeat length dependent enhanced elastic behavior (the supermodulus effect) as measured during unloading in the nanoindenter. However, enhancements in hardness, as measured by both the nanoindenter and the low load microhardness tester, were observed in films with small bilayer repeat lengths. These measurements displayed a Hall-Petch-type relationship, using the individual layer thickness (equal to half the bilayer repeat length) as the characteristic “grain size.” This hardness behavior can be understood in terms of a mechanism involving dislocation pinning at the interfaces analogous to the mechanism of grain boundary hardening.

The Calibration of the Nanoindenter

1993 ◽  
Vol 308 ◽  
Author(s):  
N J Mccormick ◽  
M G Gee ◽  
D J Hall
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Fracture Behaviour ◽  
Deformation Behaviour ◽  
Measurement Process ◽  
Time Dependent ◽  
Thermal Drift

The nanoindenter has a tremendous potential for the measurement of mechanical properties of thin films and coatings. Information can be obtained about plastic, elastic and time dependent deformation behaviour. In some cases fracture behaviour of the coatings and the adhesion of the coating to the substrate can also be investigated.Before accurate and reproducible measurements can be made the nanoindenter needs to be suitably calibrated. The magnitude of the uncertainties associated with calibration and their relevance to measurements are also required. Additionally it is important that a thorough understanding of the effect of thermal drift on the measurement process is developed. Traceability of calibration is also an important consideration.The primary areas where calibration is essential are displacement, load and shape of the indenter.

Parameters Associated With Errors in the Nanoindentation at Low Load

Manufacturing ◽  
2003 ◽  
Author(s):  
Hong-Lim Lee ◽  
Young-Seok Lee ◽  
Seong-Min Jeong ◽  
Sung-Eun Park ◽  
Han-Seog Oh
Keyword(s):  
Mechanical Properties ◽  
Surface Roughness ◽  
Indentation Size Effect ◽  
Fused Silica ◽  
Indentation Hardness ◽  
Element Analysis ◽  
The Finite Element Analysis ◽  
Low Load ◽  
Effect Of Surface ◽  
Indenter Geometry

In the nanoindentation at very low load, various parameters give difficulties in estimating mechanical properties. These parameters are the uncertainties of the indenter geometry and limitations including minimum detectable load and surface roughness. The geometrical deviation in the indenter tip shape and surface roughness are key parameters of errors related to measurement of mechanical properties by nanoindentation at very low load. Therefore, in this work, the effect of surface roughness on the indentation hardness was studied for fused silica wafer, fused silica plate and silicon wafer, which have different roughness values one another. To compare the theoretical values with the measured ones, the effect of the indenter tip geometry was studied using the simulation of the finite element analysis (FEA), neglecting other effects, such as indentation size effect (ISE) and surface roughness. As a result, the geometrical deviation in the indenter tip shape was observed to affect the indentation hardness and the contact area at low load. The roughness of specimens is assumed to be related to the scattering of the evaluated indentation hardness.

Mechanical properties of PVD Al1−xCrxN thin films

2011 ◽  
Vol 99 (2) ◽  
pp. 239-244 ◽  
Author(s):  
T.T.H. Pham ◽  
E. Le Bourhis ◽  
P. Goudeau ◽  
P. Guérin
Keyword(s):  
Thin Films ◽  
Mechanical Properties

Progressive Debonding of Multilayer Interconnect Structures

1997 ◽  
Vol 473 ◽  
Author(s):  
Michael Lane ◽  
Robert Ware ◽  
Steven Voss ◽  
Qing Ma ◽  
Harry Fujimoto ◽  
...  
Keyword(s):  
Thin Films ◽  
Crack Growth ◽  
Driving Force ◽  
Adhesion Energy ◽  
Time Dependent ◽  
Multilayer Thin Films ◽  
Processing Conditions ◽  
Interface Morphology ◽  
Entire Sample ◽  
Crack Growth Velocity

ABSTRACTProgressive (or time dependent) debonding of interfaces poses serious problems in interconnect structures involving multilayer thin films stacks. The existence of such subcriticai debonding associated with environmentally assisted crack-growth processes is examined for a TiN/SiO2 interface commonly encountered in interconnect structures. The rate of debond extension is found to be sensitive to the mechanical driving force as well as the interface morphology, chemistry, and yielding of adjacent ductile layers. In order to investigate the effect of interconnect structure, particularly the effect of an adjacent ductile Al-Cu layer, on subcriticai debonding along the TiN/SiO2 interface, a set of samples was prepared with Al-Cu layer thicknesses varying from 0.2–4.0 μm. All other processing conditions remained the same over the entire sample run. Results showed that for a given crack growth velocity, the debond driving force scaled with Al-Cu layer thickness. Normalizing the data by the critical adhesion energy allowed a universal subcriticai debond rate curve to be derived.

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