The Use of Low Temperature AlInAs and GalnAs Lattice Matched to InP in the Fabrication of HBTs and HEMTs

1991 ◽  
Vol 241 ◽  
Author(s):  
R. A. Metzger ◽  
A. S. Brown ◽  
R. G. Wilson ◽  
T. Liu ◽  
W. E. Stanchina ◽  
...  

ABSTRACTAlInAs and GaInAs lattice matched to InP and grown by MBE over a temperature range of 200 to 350°C (normal growth temperature of 500°C) has been used to enhance the device performance of inverted (where the donor layer lies below the channel) High Electron Mobility Transistors (HEMTs) and Heterojunction Bipolar Transistors (HBTs), respectively. We will show that an AlInAs spacer grown over a temperature range of 300 to 350°C and inserted between the AlInAs donor layer and GaInAs channel significantly reduces Si movement from the donor layer into the channel. This produces an inverted HEMT with a channel charge of 3.0×1012 cm−2 and mobility of 9131 cm2/V-s, as compared to the same HEMT with a spacer grown at 500 °C resulting in a channel charge of 2.3×1012 cm−2 and mobility of 4655 cm2/V-s. We will also show that a GaInAs spacer grown over a temperature range of 300 to 350°C and inserted between the AlInAs emitter and GalnAs base of an npn HBT significantly reduces Be movement from the base into the emitter, thereby allowing higher Be base dopings (up to 1×1020 cm−3) confined to 500 Å base widths, resulting in an AlInAs/GaInAs HBT with an fmax of 73 GHz and ft of 110 GHz.

1993 ◽  
Vol 324 ◽  
Author(s):  
S. J. Pearton ◽  
F. Ren ◽  
C. R. Abernathy ◽  
C. Constantine

AbstractNarrow (∼30 μm ϕ) via holes have been etched in both InP and GaAs substrates using either C12/CH4/H2 /Ar or BC13/C12 discharges, respectively. High density (∼5×1011 cm−3), low pressure (1 mTorr for C12/CH4/H2/Ar or 15 mTorr for BC13/C12) conditions, combined with sidewall passivation obtained using AZ 4620 photoresist masks, produce the correct profiles for subsequent metallization to complete the via connection. Optical emission monitoring of the 417.2 nm Ga line during GaAs etching or of the 325.6 nm In line during InP etching provided a sensitive, non invasive and reliable indicator of endpoint for both types of substrates. The intensity of these lines was proportional to the microwave input power at fixed dc bias and pressure. The via holes are suitable for a range of InP and GaAs microwave power devices, including Heterojunction Bipolar Transistors and High Electron Mobility Transistors.


Sign in / Sign up

Export Citation Format

Share Document