Process Dependence of Microstructure and Properties of Sintered Aluminum Nitride for Electronic Packaging
Keyword(s):
AbstractThe development of secondary phases due to additions of Y2O3 during sintering of aluminum nitride was studied. Depending on the heat treatment conditions and the amount of Y2O3 added, different proportions of AlYO3, Al5Y3O12 and Al2Y4O9 were found at the grain boundaries. Temperatures ≳1850°C also resulted in loss of Y2O3 and/or Y-aluminate, yielding some γAl2O3. The mechanical properties and the thermal conductivity of the sintered product were observed to be dependent on the grain boundary phase constitution and hence the specific heat treatment condition.
2004 ◽
Vol 13
(1)
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pp. 55-59
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2021 ◽
pp. 095440622110231
2019 ◽
Vol 2019.25
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pp. 18C14
Keyword(s):
2014 ◽
Vol 686
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pp. 3-9
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2011 ◽
Vol 391-392
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pp. 864-867
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