A Study on the Blends of Epoxy/Polybutadiene and the Application to the Encapsulation of a Capacitor

1992 ◽  
Vol 274 ◽  
Author(s):  
Zhongyuan Ren ◽  
Liying Qui

ABSTRACTThis paper describes the blends of epoxy/polybutadiene and the application of the blends to the encapsulation of capacitors. Experiments showed that the hydroxy-carboxyl terminated polybutadiene (HCTPB) had a good toughening effect on epoxy resins, and the blends of epoxy/HTPB or epoxy/HCTPB had good craze resistance at low temperatures. The phase separation and dynamic mechanical analysis of these blends are discussed below.

2002 ◽  
Vol 51 (10) ◽  
pp. 1100-1106 ◽  
Author(s):  
Joaquín López ◽  
Carmen Ramírez ◽  
María J Abad ◽  
Luis Barral ◽  
Jesús Cano ◽  
...  

2018 ◽  
Vol 55 (4) ◽  
pp. 469-473
Author(s):  
Yu. V. Yurkin ◽  
I. A. Mansurova ◽  
V. S. Belozerov ◽  
A. Zlobina

This work deals with the problem of developing vibration damping polymeric materials which are effective at low temperatures (from minus 40 to 0�C). Due to the fact that the vibration damping efficiency in the composite is mainly determined by the properties of the polymer matrix, it is necessary to study its properties depending on the type and amount of structure-forming parameters. The purpose of the work is to determine the changes in the dynamic properties of the polymer composition based on butyl rubber, EPDM, ethylene-vinyl acetate copolymer (EVA) filled with increasing amount of calcium carbonate. The leading methods of studying this problem were the method of scanning electron microscopy and the method of dynamic mechanical analysis. It has been stated that the selected polymers can be considered as competent candidates for damping materials at low temperatures, and the calcium carbonate filler allows more fully to realize the vibration damping properties of the polymer. The obtained dependences can be used as initial data for analytical predicting of damping properties of polymer composites.


2021 ◽  
pp. 095400832098875
Author(s):  
Shuo Wang ◽  
Meng Cao ◽  
Hongqian Xue ◽  
Fanglin Cong ◽  
Xiaodong Li ◽  
...  

In the electronics and aerospace industries, epoxy resins are generally regarded as economical and efficient adhesives and have a high status. However, epoxy resins are highly crosslinked polymers and are very brittle adhesives where they are prone to fast crack propagation under dynamic loads. Therefore, it is very necessary to enhance the toughness of epoxy resin adhesives. Nano-rubber has been proved to be an important toughening agent for epoxy resin, which can significantly improve the fracture toughness of epoxy resin. However, increasing the toughness of epoxy resin by adding nanomaterials is often accompanied by decreasing the strength and stiffness of resin. Therefore, in this work, rigid nano-silica particles were added to improve the rigidity and tensile strength reduction caused by the addition of rubber particles. And further increase the toughness of the epoxy resin to obtain an epoxy adhesive with balanced stiffness-toughness. As a result, it can be found that the addition of silica particles can significantly improve the decrease in stiffness caused by the addition of rubber particles. For example, Young’s modulus and tensile strength are increased by 28%, and 23%, respectively, with 4% silica is added based on rubber particles. Through the single lap shear experiment, it is found that the shear strength of the epoxy/RnP/silica composite adhesive has increased, which further proves that the addition of nano-silica particles can increase the stiffness of the epoxy composite. The dynamic mechanical analysis experiment found that after adding nano-silica particles, the storage modulus of epoxy composites increased, which also shows that adding nano-silica particles can improve the stiffness of epoxy composites. Scanning electron microscopy analysis was performed to study the reinforcement mechanism of epoxy/RnP/silica composite materials. The thermal stability of epoxy composites was characterized by Dynamic mechanical analysis and thermogravimetric analysis.


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