The Effect of Ultra-Low Temperature Treatments on the Stress in Aluminum Metallization on Silicon Wafers

1994 ◽  
Vol 338 ◽  
Author(s):  
Frank Baldwin ◽  
Paul H. Holloway ◽  
Mark Bordelon ◽  
Thomas R. Watkins

ABSTRACTThe stresses in Al-0.75w%Si-0.5w%Cu unpatterned metallization on silicon wafers have been measured using substrate curvature and x-ray diffraction techniques after quenching in liquid nitrogen. Stresses were measured with and without phospho-silicate glass overlayers and SiO2 underlayers, and thermal cycling followed by relaxation at room temperature. It was found that cooling the substrates to 77 K and warming to room temperature caused the metallization stress to go from tensile to compressive. Subsequent heating of the substrates to above ∼70°C followed by cooling to room temperature caused the stress to become tensile. Both compressive and tensile stresses were found to relax at room temperature with a time constant of 2.3 ± 0.2 hours. The magnitude of stress relaxation was a function of temperature, being about 20 MPa after heating to 240°C. The metallization exhibited both compressive and tensile flow stresses of ∼100 MPa near room temperature.

Author(s):  
E. Louise R. Robins ◽  
Michela Brunelli ◽  
Asiloé J. Mora ◽  
Andrew N. Fitch

AbstractDSC and high-resolution powder X-ray diffraction measurements in the range 295 K–100 K show that RS-thiocamphor undergoes two phase transitions. The first, at around 260 K on cooling, is from the room-temperature body-centred-cubic phase to a short-lived intermediate. At 258 K the low-temperature form starts to appear. The crystal structure of the latter is orthorhombic, space group


1988 ◽  
Vol 116 ◽  
Author(s):  
A. Freundlich ◽  
G. Neu ◽  
A. Leycuras ◽  
R. Carles ◽  
C. Verie

AbstractResidual stress in MOVPE grown GaAs on (100)Si substrates is investigated using Haman spectroscopy, X-ray diffraction, low temperature photoluminescence and photoluminescence excitation spectroscopy experiments. At room temperature, 2 µm-thick GaAs/Si is found to be under biaxial (100) tensile stress of X = 1.8 ± 0.3 kbar, near the epilayer surface. The stress magnitude decreases as the distance from interface decreases. PL and PLE studies on post-growth thermally annealed GaAs/Si reveal coexistence of unstrained and strained GaAs.


1993 ◽  
Vol 71 (3) ◽  
pp. 331-334 ◽  
Author(s):  
Martin K. Ehlert ◽  
Alan Storr ◽  
Robert C. Thompson ◽  
Frederick W. B. Einstein ◽  
Raymond J. Batchelor

Room temperature and low-temperature (110–140 K) powder diffractograms have been obtained for the polymeric compounds [Cu(4-Xpz)2]x (where X = H, CH3, Cl, and Br), and values of the unit cell parameters (orthorhombic, space group Ibam) a, b, and c have been obtained at both high and low temperatures. A single crystal X-ray diffraction study of the X = H compound at 116 K was completed and the results compared with a published study done at room temperature. The structures of these complexes involve extended chains of pyrazolate-bridged copper ions extending along the c crystallographic axis. The X-ray studies indicate little change in the c parameter with decreasing temperature and small but significant changes in the a or b parameters reflecting changes in interchain packing. This study permits some evaluation of how structural parameters are affected by these variations in interchain packing and how these variations may be affecting the magnitude of magnetic exchange in the compounds.


2011 ◽  
Vol 347-353 ◽  
pp. 3662-3665 ◽  
Author(s):  
Yu Hui Wang ◽  
Zhe Li ◽  
Kai Zhu ◽  
Gang Li ◽  
Ying Jin Wei ◽  
...  

The Li[Li0.2Co0.4Mn0.4]O2 cathode material was prepared by a sol-gel method. Combinative X-ray diffraction (XRD) studies showed that the material was a solid solution of LiCoO2 and Li2MnO3. The material showed a reversible discharge capacity of 155.0 mAhg−1 at -20 °C, which is smaller than that at room temperature (245.5 mAhg−1). However, the sample exhibited capacity retention of 96.3 % at -20 °C, only 74.2 % at 25 °C. The good electrochemical cycle performance at low temperature was due to the inexistence of Mn3+ in the material.


1951 ◽  
Vol 24 (3) ◽  
pp. 550-556
Author(s):  
H. N. Campbell ◽  
M. D. Allen

Abstract Since many elastomers indicate by their physical properties that crystallization occurs even when such crystallization is not detectable by x-ray diffraction, a direct microscopic study in polarized light was undertaken. This study confirms the presence of such crystallinity not only in rubber but also in polybutadiene and some low-temperature copolymers. Furthermore, the same crystal pattern is reproduced on melting and refreezing provided the intermediate melting temperature is not too high. This indicates that x-ray diffraction is not a very sensitive method for detecting small amounts of crystallinity in high polymers. The reproduction of the crystal pattern on refreezing shows that the molecular segments have limited mobility even at room temperature; this may require revision of current theories of the origin of retractive forces in elastomers.


Author(s):  
Masoud Mirzaei ◽  
Maryam Bazargan ◽  
Pouria Ebtehaj ◽  
Joel T. Mague

The product obtained from the reaction of pyridine-2,3-dicarboxylic acid and hydrated copper(II) chloride in hot aqueous NaOH solution was determined by low temperature X-ray diffraction to be [Cu3(C6H4NO3)4(OH)2(H2O)2] n or [Cu3(μ-OH)2(μ-nicNO)4(H2O)2] n (nicNO is pyridine-3-carboxylate N-oxide), a structure obtained from room temperature data and reported previously. The present determination is improved in quality and treatment of the H atoms. A Hirshfeld surface analysis of the intermolecular interactions is presented.


1991 ◽  
Vol 230 ◽  
Author(s):  
A. C. Vermeulen ◽  
R. Delhez ◽  
E. J. Mittemeijer

AbstractStress relaxation in polycrystalline layers can be explained by processes, in which the microstructure plays a dominant role. The microstructure itself may also be subjected to changes. With X-ray diffraction information about both the stress and the microstructure can be obtained without destroying the specimen and without disturbing the stress relaxation process.In this paper a model system is studied: Au on Si<100>. The specimens showed a simultaneous decrease of macrostress and dislocation density with time at room temperature. This could be interpreted on the basis of a model founded on thermally activated dislocation motion. It followed that the grain size is an important parameter for the change of the dislocation density.


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