Structural study of single Shockley stacking faults terminated near substrate/epilayer interface in 4H-SiC

Structural analysis is carried out of a single Shockley stacking fault (1SSF) that terminates near the substrate/epilayer interface and originally expanded from a basal plane dislocation segment near the epilayer surface of 4H-SiC. The characteristic zigzag structure is found for the partial dislocations (PDs), with microscopic connecting angles of almost 120°. It has been suggested that the microscopic construction of PDs might be limited by the Peierls valley. The termination line near the substrate/epilayer interface was found to have 30° Si-core and 90° Si-core PDs. This combination is the same as that found near the surface of the epilayer in commonly observed 1SSFs. Penetrating BPDs of this kind were also found experimentally for the first time. For the currently proposed charts for the 1SSF expansions, photoluminescence imaging during UV illumination is one of the nondestructive analysis methods that can provide the structural information and expected expansion shapes of the 1SSFs.

Effect of C/Si Ratio and Nitrogen Doping on 4H-SiC Epitaxial Growth Using Dichlorosilane Precursor

Application of dichlorosilane (DCS) in 4H-SiC epitaxial growth on 4° off-cut substrates has been studied. The effect of C/Si ratio and N2gas flow rate on epilayer properties is investigated in detail. It is found that the C/Si ratio has a significant influence on the growth rate, epilayer surface roughness (step-bunching), conversion of basal plane dislocations (BPDs), and generation of morphological defects and in-grown stacking faults. A wide range of doping concentration from p- to n+ can be controlled in DCS growth. High quality 4° off-cut SiC epilayers are achieved for C/Si=1.3 – 1.8. Addition of N2has no obvious influence on growth rate and defect densities. The BPD conversion greater than 99.8% is achieved independent of N doping without any pretreatment.

Study of SiC Epitaxial Growth Using Tetrafluorosilane and Dichlorosilane in Vertical Hotwall CVD Furnace

This paper presents one of the first comparative studies of distinctive results obtained using halogenated silicon precursors, dichlorosilane (SiH2Cl2, DCS) and tetrafluorosilane (SiF4, TFS) for SiC homo epitaxial growth. Both TFS and DCS possess very distinct properties that show specific influence on SiC growth. SiC epitaxial growth using TFS greatly suppresses parasitic deposition in the gas delivery system. Growth using TFS shows carbon mediated growth regime, and exhibits controlled doping concentration of the epilayer by an order of magnitude lower than that in the growth using DCS at the same C/Si ratio. Studies of epilayer surface morphology show that the epilayers from TFS growth have a specular surface in a wide C/Si range whereas in the growth using DCS, the epilayer surface roughness is strongly dependent on the C/Si ratio.

Studies of the Origins of Half Loop Arrays and Interfacial Dislocations Observed in Homoepitaxial Layers of 4H-SiC

Dislocation behavior during homo-epitaxy of 4H-SiC on offcut substrates by Chemical Vapor Deposition (CVD) has been studied using Synchrotron X-ray Topography and KOH etching. Studies carried out before and after epilayer growth have revealed that, in some cases, short, edge oriented segments of basal plane dislocation (BPD) inside the substrate can be drawn towards the interface producing screw oriented segments intersecting the growth surface. In other cases, BPD half-loops attached to the substrate surface are forced to glide into the epilayer producing similar screw oriented surface intersections. It is shown that the initial motion of the short edge oriented BPD segments that are drawn from the substrate into the epilayer is caused by thermal stress resulting from radial temperature gradients experienced by the wafer whilst in the epi-chamber. This same stress also causes the initial glide of the surface half-loop into the epilayer and through the advancing epilayer surface. These mobile BPD segments provide screw oriented segments that pierce the advancing epilayer surface that initially replicate as the crystal grows. Once critical thickness is reached, according to the Mathews-Blakeslee model, these screw segments glide sideways under the action of the mismatch stress leaving IDs and HLAs in their wake.

Progress of SiC Epitaxy on 150mm Substrates

This paper presents the current performance of 150mm SiC epitaxy on state-of-the-art 150mm substrates. Excellent on-wafer uniformity has been achieved with mean thickness uniformity at 1.8% and mean doping uniformity at 5.4%. The epilayer surface is smooth across wafer diameter with a typical defect density below 1 cm-2. Within a run, wafer-to-wafer variation of 0.7 % for thickness and 5% for doping is demonstrated. The mean values of warp and bow after epitaxy are 35 um 15 μm, respectively. The above metrics are critical to enable cost effective production of 150mm SiC epiwafers suited for device fabrication.

X-ray Topography Studies of Relaxation during the Homo-Epitaxy of 4H-SiC

ABSTRACTA review is presented of Synchrotron X-ray Topography and KOH etching studies carried out on n type 4H-SiC offcut substrates before and after homo-epitaxial growth to study defect replication and strain relaxation processes and identify the nucleation sources of both interfacial dislocations (IDs) and half-loop arrays (HLAs) which are known to have a deleterious effect on device performance. We show that these types of defects can nucleate during epilayer growth from: (1) short segments of edge oriented basal plane dislocations (BPDs) in the substrate which are drawn by glide into the epilayer; and (2) segments of half loops of BPD that are attached to the substrate surface prior to growth which also glide into the epilayer. It is shown that the initial motion of the short edge oriented BPD segments that are drawn from the substrate into the epilayer is caused by thermal stress resulting from radial temperature gradients experienced by the wafer whilst in the epi-chamber. This same stress also causes the initial glide of the surface half-loop into the epilayer and through the advancing epilayer surface. These mobile BPD segments provide screw oriented segments that pierce the advancing epilayer surface that initially replicate as the crystal grows. Once critical thickness is reached, according to the Mathews-Blakeslee model [1], these screw segments glide sideways under the action of the mismatch stress leaving IDs and HLAs in their wake. The origin of the mismatch stress is shown to be associated with lattice parameter differences at the growth temperature, arising from the differences in doping concentration between substrate and epilayer.

Improved Epilayer Surface Morphology on 2˚ Off-Cut 4H-SiC Substrates

Homoepitaxial layers of 4H-SiC were grown with horizontal hot-wall CVD on 2˚ off-cut substrates, with the purpose of improving the surface morphology of the epilayers and reducing the density of surface morphological defects. In-situ etching conditions in either pure hydrogen or in a mixture of silane and hydrogen prior to the growth were compared as well as C/Si ratios in the range 0.8 to 1.0 during growth. The smoothest epilayer surface, together with lowest defect density, was achieved with growth at a C/Si ratio of 0.9 after an in-situ etching in pure hydrogen atmosphere.

Use of Vanadium Doping for Compensated and Semi-Insulating SiC Epitaxial Layers for SiC Device Applications

Vanadium doping from SiCl4 source during epitaxial growth with chlorinated C and Si precursors was investigated as a mean of achieving compensated and semi-insulating epitaxial 4H-SiC layers for device applications. Thin epilayers were grown at 1450°C with a growth rate of ~6 μm/h. Experiments at 1600°C resulted in the growth rates ranging from 60 to 90 µm/h producing epilayers with thickness above 30 µm. V concentrations up to about 1017cm-3 were found safe for achieving defect-free epilayer surface morphology, however certain degradation of the crystalline quality was detected by XRD at V concentrations as low as 3-5x1015 cm-3. Controllable compensation of nitrogen donors with V acceptors provided low-doped and semi-insulating epitaxial layers. Mesa isolated PiN diodes with V-acceptor-compensated n- epilayers used as drift regions showed qualitatively normal forward- and reverse-bias behavior.