Transmission Electron Diffraction Techniques for Nm Scale Strain Measurement in Semiconductors

1995 ◽  
Vol 405 ◽  
Author(s):  
J. Vanhellemont ◽  
K. G. F. Janssens ◽  
S. Frabboni ◽  
P. Smeys ◽  
R. Balboni ◽  
...  

AbstractAn overview is given of transmission electron microscopy techniques to address strain with nm scale spatial resolution. In particular the possibilities and limitations of (large angle) convergent beam electron diffraction ((LA)CBED) and electron diffraction contrast imaging (EDCI) techniques are discussed in detail. It will be shown by a few case studies that unique and quantitative information on local strain distributions can be obtained by the combined use of both (LA)CBED and EDCI in correlation with three dimensional finite element simulations of the strain distributions in the thinned specimen.

1995 ◽  
Vol 406 ◽  
Author(s):  
J. Vanhellemont ◽  
K. G. F. Janssens ◽  
S. Frabboni ◽  
P. Smeys ◽  
R. Balboni ◽  
...  

AbstractAn overview is given of transmission electron microscopy techniques to address strain with nm scale spatial resolution. In particular the possibilities and limitations of (large angle) convergent beam electron diffraction ((LA)CBED) and electron diffraction contrast imaging (EDCI) techniques are discussed in detail. It will be shown by a few case studies that unique and quantitative information on local strain distributions can be obtained by the combined use of both (LA)CBED and EDCI in correlation with three dimensional finite element simulations of the strain distributions in the thinned specimen.


Author(s):  
Koenraad G F Janssens ◽  
Omer Van der Biest ◽  
Jan Vanhellemont ◽  
Herman E Maes ◽  
Robert Hull

There is a growing need for elastic strain characterization techniques with submicrometer resolution in several engineering technologies. In advanced material science and engineering the quantitative knowledge of elastic strain, e.g. at small particles or fibers in reinforced composite materials, can lead to a better understanding of the underlying physical mechanisms and thus to an optimization of material production processes. In advanced semiconductor processing and technology, the current size of micro-electronic devices requires an increasing effort in the analysis and characterization of localized strain. More than 30 years have passed since electron diffraction contrast imaging (EDCI) was used for the first time to analyse the local strain field in and around small coherent precipitates1. In later stages the same technique was used to identify straight dislocations by simulating the EDCI contrast resulting from the strain field of a dislocation and comparing it with experimental observations. Since then the technique was developed further by a small number of researchers, most of whom programmed their own dedicated algorithms to solve the problem of EDCI image simulation for the particular problem they were studying at the time.


2015 ◽  
Vol 21 (3) ◽  
pp. 637-645 ◽  
Author(s):  
Heiko Groiss ◽  
Martin Glaser ◽  
Anna Marzegalli ◽  
Fabio Isa ◽  
Giovanni Isella ◽  
...  

AbstractBy transmission electron microscopy with extended Burgers vector analyses, we demonstrate the edge and screw character of vertical dislocations (VDs) in novel SiGe heterostructures. The investigated pillar-shaped Ge epilayers on prepatterned Si(001) substrates are an attempt to avoid the high defect densities of lattice mismatched heteroepitaxy. The Ge pillars are almost completely strain-relaxed and essentially defect-free, except for the rather unexpected VDs. We investigated both pillar-shaped and unstructured Ge epilayers grown either by molecular beam epitaxy or by chemical vapor deposition to derive a general picture of the underlying dislocation mechanisms. For the Burgers vector analysis we used a combination of dark field imaging and large-angle convergent beam electron diffraction (LACBED). With LACBED simulations we identify ideally suited zeroth and second order Laue zone Bragg lines for an unambiguous determination of the three-dimensional Burgers vectors. By analyzing dislocation reactions we confirm the origin of the observed types of VDs, which can be efficiently distinguished by LACBED. The screw type VDs are formed by a reaction of perfect 60° dislocations, whereas the edge types are sessile dislocations that can be formed by cross-slips and climbing processes. The understanding of these origins allows us to suggest strategies to avoid VDs.


Crystals ◽  
2019 ◽  
Vol 10 (1) ◽  
pp. 5
Author(s):  
Heiko Groiss

Dislocations play a crucial role in self-organization and strain relaxation mechanisms in SiGe heterostructures. In most cases, they should be avoided, and different strategies exist to exploit their nucleation properties in order to manipulate their position. In either case, detailed knowledge about their exact Burgers vectors and possible dislocation reactions are necessary to optimize the fabrication processes and the properties of SiGe materials. In this review a brief overview of the dislocation mechanisms in the SiGe system is given. The method of choice for dislocation characterization is transmission electron microscopy. In particular, the article provides a detailed introduction into large-angle convergent-beam electron diffraction, and gives an overview of different application examples of this method on SiGe structures and related systems.


2012 ◽  
Vol 186 ◽  
pp. 16-19 ◽  
Author(s):  
Elżbieta Jezierska

The antiphase domain structure in Ni3Al and Al3Ti+Cu intermetallic alloys was recognized by conventional transmission electron microscopy and large angle convergent beam electron diffraction methods. In the case of antiphase boundary the superlattice excess line is split into two lines with equal intensity on bright and dark field LACBED pattern. This splitting can be considered as typical and used to identify APBs. The recognition between perfect structure of the defect-free matrix and the screw deviation around the nanopipes in GaN epilayers was performed with high accuracy using Zone Axis LACBED images.


2014 ◽  
Vol 70 (a1) ◽  
pp. C41-C41
Author(s):  
John Steeds

The effective routine achievement of useful convergent beam electron diffraction (CBED) patterns was frustrated for many years until transmission electron microscopes (TEMs) were developed that overcame the practical difficulties. Because specimen thickness and orientation are two critical parameters in electron diffraction and are not under good control because of the difficulty of producing thin enough regions it was necessary to have TEMs capable of forming small focussed probes of less than 100nm diameter in local environments where the hydrocarbon level was sufficiently low to reduce carbon contamination to a reasonable level. Once these problems were overcome the importance of three-dimensional diffraction became apparent but to exploit this property it was necessary to develop TEMs with a large angular range in the diffraction plane. With appropriately designed instruments very beautiful CBED patterns could be obtained from crystalline samples and a variety of experimental techniques were exploited to extract meaningful information from them.


2014 ◽  
Vol 70 (a1) ◽  
pp. C1455-C1455 ◽  
Author(s):  
Colin Ophus ◽  
Peter Ercius ◽  
Michael Sarahan ◽  
Cory Czarnik ◽  
Jim Ciston

Traditional scanning transmission electron microscopy (STEM) detectors are monolithic and integrate a subset of the transmitted electron beam signal scattered from each electron probe position. These convergent beam electron diffraction patterns (CBED) are extremely rich in information, containing localized information on sample structure, composition, phonon spectra, three-dimensional defect crystallography and more. Many new imaging modes become possible if the full CBED pattern is recorded at many probe positions with millisecond dwell times. In this study, we have used a Gatan K2-IS direct electron detection camera installed on an uncorrected FEI Titan-class transmission electron microscope to record 4D-STEM probe diffraction patterns on a variety of samples at up to 1600 frames per second. As an example, a 4D-STEM dataset for a multilayer stack of epitaxial SrTiO3 and mixed LaMnO3-SrTiO3 is plotted in Figure 1. Figure 1A shows a HAADF micrograph of the multilayer along a (001) zone axis. Only the A sites (Sr and La) are visible in this micrograph and the composition can be roughly determined from the relative brightness. One possible 4D-STEM technique is position-averaged convergent beam electron diffraction (PACBED) described by LeBeau et al. [1]. We can easily construct ideal PACBED patterns by averaging the probe images over each unit cell fitted from Figure 1A, which is shown in Figure 1B. By matching these patterns to PACBED images simulated with the multislice method we can precisely determine parameters such as sample thickness and composition, the latter of which is plotted in Figure 1C. For comparison, the composition has also been determined with electron energy loss spectroscopy (EELS) in a separate experiment, shown in Figure 1D. The composition range of 0-85% LaMnO3 measured by PACBED is in good agreement with the EELS measurements. In this talk we will demonstrate several other possible uses for 4D-STEM datasets.


Author(s):  
John F. Mansfield

One of the most important advancements of the transmission electron microscopy (TEM) in recent years has been the development of the analytical electron microscope (AEM). The microanalytical capabilities of AEMs are based on the three major techniques that have been refined in the last decade or so, namely, Convergent Beam Electron Diffraction (CBED), X-ray Energy Dispersive Spectroscopy (XEDS) and Electron Energy Loss Spectroscopy (EELS). Each of these techniques can yield information on the specimen under study that is not obtainable by any other means. However, it is when they are used in concert that they are most powerful. The application of CBED in materials science is not restricted to microanalysis. However, this is the area where it is most frequently employed. It is used specifically to the identification of the lattice-type, point and space group of phases present within a sample. The addition of chemical/elemental information from XEDS or EELS spectra to the diffraction data usually allows unique identification of a phase.


Author(s):  
J W Steeds

That the techniques of convergent beam electron diffraction (CBED) are now widely practised is evident, both from the way in which they feature in the sale of new transmission electron microscopes (TEMs) and from the frequency with which the results appear in the literature: new phases of high temperature superconductors is a case in point. The arrival of a new generation of TEMs operating with coherent sources at 200-300kV opens up a number of new possibilities.First, there is the possibility of quantitative work of very high accuracy. The small probe will essentially eliminate thickness or orientation averaging and this, together with efficient energy filtering by a doubly-dispersive electron energy loss spectrometer, will yield results of unsurpassed quality. The Bloch wave formulation of electron diffraction has proved itself an effective and efficient method of interpreting the data. The treatment of absorption in these calculations has recently been improved with the result that <100> HOLZ polarity determinations can now be performed on III-V and II-VI semiconductors.


Author(s):  
J. A. Eades ◽  
A. E. Smith ◽  
D. F. Lynch

It is quite simple (in the transmission electron microscope) to obtain convergent-beam patterns from the surface of a bulk crystal. The beam is focussed onto the surface at near grazing incidence (figure 1) and if the surface is flat the appropriate pattern is obtained in the diffraction plane (figure 2). Such patterns are potentially valuable for the characterization of surfaces just as normal convergent-beam patterns are valuable for the characterization of crystals.There are, however, several important ways in which reflection diffraction from surfaces differs from the more familiar electron diffraction in transmission.GeometryIn reflection diffraction, because of the surface, it is not possible to describe the specimen as periodic in three dimensions, nor is it possible to associate diffraction with a conventional three-dimensional reciprocal lattice.


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