Electromigration in Sputter Deposited Copper/Zirconium Alloys

1999 ◽  
Vol 563 ◽  
Author(s):  
N. D. McCusker ◽  
N. D. McCusker ◽  
B. M. Armstrong

AbstractRF-magnetron sputter deposited copper/zirconium alloy films have been characterised in terms of resistivity, composition, microstructure, texture and stress. The properties and electromigration reliability of these alloys have been compared to those of pure sputtered copper films. The surface segregation of zirconium within the films after annealing has been studied. We have proposed a mechanism in which zirconium at the copper surface can influence the electromigration damage process, enhancing reliability.

2014 ◽  
Vol 2 (1) ◽  
pp. 016401 ◽  
Author(s):  
K S Usha ◽  
R Sivakumar ◽  
C Sanjeeviraja ◽  
M Ichimura

2017 ◽  
Vol 56 (22) ◽  
pp. 6114 ◽  
Author(s):  
S. Maidul Haque ◽  
Rajnarayan De ◽  
S. Tripathi ◽  
C. Mukherjee ◽  
A. K. Yadav ◽  
...  

1999 ◽  
Vol 232 (1) ◽  
pp. 141-146 ◽  
Author(s):  
S. Srinivas ◽  
S. Bhaskar ◽  
Ram S. Katiyar

2007 ◽  
Vol 25 (2) ◽  
pp. 225-231 ◽  
Author(s):  
David M. DeVito ◽  
Avni A. Argun ◽  
Evan Law ◽  
Mark R. Davidson ◽  
M. Puga-Lambers ◽  
...  

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