Intrinsic Stress Measurements in CVD Diamond Films

1999 ◽  
Vol 593 ◽  
Author(s):  
Jin Yu ◽  
J.G. Kim ◽  
Y. C. Sohn ◽  
Y. S. Lee
Keyword(s):  
Film Thickness ◽  
Diamond Films ◽  
Strain Analysis ◽  
Chemical Vapor ◽  
Film Stress ◽  
Intrinsic Stress ◽  
Ex Situ ◽  
Chemical Vapor Deposition Method ◽  
Si Substrate ◽  
Curvature Measurements

ABSTRACTDiamond films were grown over Si substrate at 1253K by the hot filament chemical vapor deposition method using CH4/H2 gas mixture, and intrinsic stresses in the film were deduced from the ex-situ curvature measurements. In order to account for the creep deformation of the Si substrate, an elastic/plastic stress and strain analysis were conducted. Results showed that intrinsic stresses were generally several times larger than the average film stresses and always positive increasing with the film thickness. For the film thickness larger than 10μm, stress relaxation by creep of the substrate became significant, and must be considered for the accurate assessment of the film stress in diamond. Later, an analysis based on the grain growth accounted for the development of intrinsic stresses reasonably well

Intrinsic Stress Measurements in CVD Diamond Films

1999 ◽  
Vol 594 ◽  
Author(s):  
Jin Yu ◽  
J. G. Kim ◽  
Y. C. Sohn ◽  
Y. S. Lee
Keyword(s):  
Film Thickness ◽  
Diamond Films ◽  
Strain Analysis ◽  
Chemical Vapor ◽  
Film Stress ◽  
Intrinsic Stress ◽  
Ex Situ ◽  
Chemical Vapor Deposition Method ◽  
Si Substrate ◽  
Curvature Measurements

AbstractDiamond films were grown over Si substrate at 1253K by the hot filament chemical vapor deposition method using CH4/H2 gas mixture, and intrinsic stresses in the film were deduced from the ex-situ curvature measurements. In order to account for the creep deformation of the Si substrate, an elastic/plastic stress and strain analysis were conducted. Results showed that intrinsic stresses were generally several times larger than the average film stresses and always positive increasing with the film thickness. For the film thickness larger than 10μm, stress relaxation by creep of the substrate became significant, and must be considered for the accurate assessment of the film stress in diamond. Later, an analysis based on the grain growth accounted for the development of intrinsic stresses reasonably well.

In Situ Thin Film Stress Measurements – A Path to Understanding the Structure and Morphology of Electron Beam Evaporated ZnS

2002 ◽  
Vol 749 ◽  
Author(s):  
Vincent Barrioz ◽  
Stuart J. C. Irvine ◽  
D. Paul
Keyword(s):  
Residual Stress ◽  
Surface Roughness ◽  
Electron Beam ◽  
Stress Reduction ◽  
Float Glass ◽  
Film Stress ◽  
Intrinsic Stress ◽  
Ex Situ ◽  
Stress Measurements

ABSTRACTZnS is a material of choice in the optical coating industry for its optical properties and broad transparency range. One of the drawbacks of ZnS is that it develops high compressive intrinsic stress resulting in large residual stress in the deposited layer. This paper concentrates on the evolution of residual stress reduction in ZnS single layers, depending upon their deposition rate or the substrate temperature during deposition (i.e. 22 °C and 133 °C). The substrate preparation is addressed for consideration of layer adhesion. Residual stress of up to − 550 MPa has been observed in amorphous/poor polycrystalline ZnS layers, deposited on CMX and Float glass type substrates, by electron beam evaporation at 22 °C, with a surface roughness between 0.4 and 0.8 nm. At 133 °C, the layer had a surface roughness of 1 nm, the residual stress in the layer decreased to − 150 MPa, developing a wurtzite structure with a (002) preferred orientation. In situ stress measurements, using a novel optical approach with a laser-fibre system, were carried out to identify the various sources of stress. A description of this novel in situ stress monitor and its advantages are outlined. The residual stress values were supported by two ex situ stress techniques. The surface morphology analysis of the ZnS layers was carried out using an atomic force microscope (AFM), and showed that stress reduced layers actually gave rougher surfaces.

scholarly journals Research on the Preparation and Spectral Characteristics of Graphene/TMDs Hetero-structures

2020 ◽  
Vol 15 (1) ◽  
Author(s):  
Tao Han ◽  
Hongxia Liu ◽  
Shulong Wang ◽  
Shupeng Chen ◽  
Kun Yang
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Spectral Characteristics ◽  
Graphene Film ◽  
Chemical Vapor ◽  
Chemical Vapor Deposition Method ◽  
Si Substrate ◽  
Broadband Absorption ◽  
Gate Effect ◽  
Pressure Chemical

AbstractThe Van der Waals (vdWs) hetero-structures consist of two-dimensional materials have received extensive attention, which is due to its attractive electrical and optoelectronic properties. In this paper, the high-quality large-size graphene film was first prepared by the chemical vapor deposition (CVD) method; then, graphene film was transferred to SiO2/Si substrate; next, the graphene/WS2 and graphene/MoS2 hetero-structures were prepared by the atmospheric pressure chemical vapor deposition method, which can be achieved by directly growing WS2 and MoS2 material on graphene/SiO2/Si substrate. Finally, the test characterization of graphene/TMDs hetero-structures was performed by AFM, SEM, EDX, Raman and PL spectroscopy to obtain and grasp the morphology and luminescence laws. The test results show that graphene/TMDs vdWs hetero-structures have the very excellent film quality and spectral characteristics. There is the built-in electric field at the interface of graphene/TMDs heterojunction, which can lead to the effective separation of photo-generated electron–hole pairs. Monolayer WS2 and MoS2 material have the strong broadband absorption capabilities, the photo-generated electrons from WS2 can transfer to the underlying p-type graphene when graphene/WS2 hetero-structures material is exposed to the light, and the remaining holes can induced the light gate effect, which is contrast to the ordinary semiconductor photoconductors. The research on spectral characteristics of graphene/TMDs hetero-structures can pave the way for the application of novel optoelectronic devices.

A study on the residual stress measurement methods on chemical vapor deposition diamond films

1998 ◽  
Vol 13 (11) ◽  
pp. 3027-3033 ◽  
Author(s):  
Jung Geun Kim ◽  
Jin Yu
Keyword(s):  
Residual Stress ◽  
Chemical Vapor Deposition ◽  
Tensile Stress ◽  
Residual Stresses ◽  
Vapor Deposition ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Peak Shift ◽  
Intrinsic Stress ◽  
Chemical Vapor Deposition Diamond

Diamond films were deposited on the p-type Si substrate with the hot filament chemical vapor deposition (HFCVD). Residual stresses in the films were measured in air by the laser curvature, the x-ray diffraction (XRD) dϕψ − sin2ψ, and the Raman peak shift methods. All of the measuring methods showed similar behaviors of residual stress that changed from a compressive to a tensile stress with increasing the film thickness. However, values of residual stresses obtained through the Raman and XRD methods were 3–4 times higher than those of the curvature method. These discrepancies involved the setting of materials constants of CVD diamond film, and determination of a peak shifting on the XRD and Raman method. In order to elucidate the disparity, we measured a Young's moduli of diamond films by using the sonic resonance method. In doing so, the Raman and XRD peak shift were calibrated by bending diamond/Si beams with diamond films by a known amount, with stress levels known a priori from the beam theory, and by monitoring the peak shifts simultaneously. Results of each measuring method showed well coincidental behaviors of residual stresses which have the stress range from −0.5 GPa to +0.7 GPa, and an intrinsic stress was caused about +0.7 GPa with tensile stress.

Effects of Seeding Over the Microstructure and Stresses of Diamond Thin Films

1999 ◽  
Vol 594 ◽  
Author(s):  
S. Gupta ◽  
G. Morell ◽  
R. S. Katiyar ◽  
D. R. Gilbert ◽  
R. K. Singh
Keyword(s):  
Electron Cyclotron Resonance ◽  
Raman Band ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Interfacial Stress ◽  
Intrinsic Stress ◽  
Seeding Density ◽  
X Ray Diffraction ◽  
Total Stress ◽  
X Ray

AbstractWe have studied diamond films grown by electron cyclotron resonance-assisted chemical vapor deposition (ECR-CVD) at low pressure (1.0 Torr) and temperatures (550–700 °C). These films were grown on seeded Si (111) substrates with different diamond seed densities (0.225, 1.5, 2.3, and 3.1 × 109 nuclei/cm2). Scanning electron microscopy (SEM), X-ray diffraction (XRD) and Raman spectroscopy (RS) were employed to investigate the crystalline quality, diamond yield, and stresses developed in the films as a function of seeding density. Thermal interfacial stress, interactions across grain boundaries, and internal stress were considered in order to account for the total stress observed from the Raman band. We present correlations among seed density, relative amount of non-sp3 phase, O/C ratio, and total intrinsic stress.

Effect of NH3 Plasma Treatment on Etching of Ti During Ticl4-Based Tin CVD Processes

1998 ◽  
Vol 514 ◽  
Author(s):  
M. E. Gross ◽  
E. Coleman ◽  
K. Ohto
Keyword(s):  
Integrated Circuit ◽  
Chemical Vapor ◽  
Ex Situ ◽  
Si Substrate ◽  
Barrier Films ◽  
Series Of Experiments ◽  
Pre Treatment ◽  
Initial Deposition ◽  
Ti Films

ABSTRACTIntegration of a TiCl4-based chemical vapor deposition (CVD) process for TiN barrier films with Ti underlayers for sub-micron integrated circuit metallization stacks exposes the Ti film to TiCl4 and NH3 adducts of TiCl4 that may etch the Ti in addition to depositing TiN. In this paper we report results of studies on the interactions of TiCl4 with ex situ PVD Ti films during the CVD TiN process. Deposition of TiN on Ti/SiO2/Si using a onestep 650°C process shows evidence of significant etching of the underlying Ti. A two-step process using a reduced TiCl4 flow for the initial deposition reduced the amount of etching but for Ti films over 200Å thick there was significant non-uniformity and peeling at the Ti/SiO2 interface. Pre-treatment of the Ti surface in situ with a 500W, 450 kHz NH3 plasma for 20–60 sec. leads to formation of TiN0.3, which shows a slight protective effect against etching. The same series of experiments with Ti deposited on Si reveals no etching, owing to reaction of the Ti with the Si substrate to form etch-resistant silicides. These results suggest that integration of a TiCl4-based CVD TiN process with an underlying Ti layer may be undesirable unless the surface of the Ti is protected against etching.

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