Gold/Niobium Thin Film Metallizations for GaAs Devices and Circuits
Keyword(s):
X Ray
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ABSTRACTA refractory metallization of Au/Nb is proposed for use in first level metallization of GaAs devices. The diffusion and reaction kinetics are explored using sheet resistance measurements, along with X-ray diffraction and Auger electron spectroscopy depth profiling. The interdiffusion coefficients are reported. Diodes are fabricated using Nb/Au metallization and characterized
1996 ◽
Vol 14
(2)
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pp. 293-298
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Keyword(s):
1987 ◽
Vol 5
(5)
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pp. 2979-2980
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1997 ◽
Vol 15
(2)
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pp. 284-291
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1995 ◽
Vol 84
(1)
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pp. 23-29
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1986 ◽
Vol 9
(1)
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pp. 41-46
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