Silicidation in Ni/Si thin film system investigated by X-ray diffraction and Auger electron spectroscopy

2007 ◽  
Vol 253 (8) ◽  
pp. 3799-3802 ◽  
Author(s):  
S. Abhaya ◽  
G. Amarendra ◽  
S. Kalavathi ◽  
Padma Gopalan ◽  
M. Kamruddin ◽  
...  
Keyword(s):  
Thin Film ◽  
Auger Electron Spectroscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Film System ◽  
X Ray Diffraction ◽  
X Ray ◽  
Thin Film System ◽  
Si Thin Film

Gold/Niobium Thin Film Metallizations for GaAs Devices and Circuits

2001 ◽  
Vol 695 ◽  
Author(s):  
Robert Esser ◽  
Aris Christou
Keyword(s):  
Thin Film ◽  
Auger Electron Spectroscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Depth Profiling ◽  
X Ray Diffraction ◽  
X Ray ◽  
Gaas Devices ◽  
Auger Electron Spectroscopy Depth ◽  
Interdiffusion Coefficients

ABSTRACTA refractory metallization of Au/Nb is proposed for use in first level metallization of GaAs devices. The diffusion and reaction kinetics are explored using sheet resistance measurements, along with X-ray diffraction and Auger electron spectroscopy depth profiling. The interdiffusion coefficients are reported. Diodes are fabricated using Nb/Au metallization and characterized

Quantitative Study of Al/W Interaction In Si/SiO2/W-Ti/Al Thin Film System

1988 ◽  
Vol 119 ◽  
Author(s):  
Hung-Yu Liu ◽  
Peng-Heng Chang ◽  
Jim Bohlman ◽  
Hun-Lian Tsai
Keyword(s):  
Thin Film ◽  
Film System ◽  
X Ray Diffraction ◽  
Compound Formation ◽  
X Ray ◽  
Thin Film System ◽  
Glancing Angle ◽  
Integrated Intensity ◽  
Al Thin Film ◽  
Kinetics Of

AbstractThe interaction of Al and W in the Si/SiO2/W-Ti/Al thin film system is studied quantitatively by glancing angle x-ray diffraction. The formation of Al-W compounds due to annealing is monitored by the variation of the integrated intensity from a few x-ray diffraction peaks of the corresponding compounds. The annealing was conducted at 400°C, 450°C and 500°C from 1 hour to 300 hours. The kinetics of compound formation is determined using x-ray diffraction data and verified by TEM observations. We will also show the correlation of the compound formation to the change of the electrical properties of these films.

Phase Formation and Phase Stability in the Al-Ti Thin Film System

1990 ◽  
Vol 213 ◽  
Author(s):  
L.R. Parks ◽  
D.A. Lilienfeld ◽  
P. BØRgesen ◽  
R. Raj
Keyword(s):  
Thin Film ◽  
Phase Stability ◽  
Rutherford Backscattering Spectrometry ◽  
Intermetallic Phases ◽  
Film System ◽  
X Ray Diffraction ◽  
X Ray ◽  
Annealing Temperatures ◽  
Thin Film System ◽  
Sequential Formation

ABSTRACTThis study focuses on the sequential formation of aluminide phases during annealing of titanium and aluminum thin film bilayers. The formation of titanium-rich intermetallic phases at higher annealing temperatures is emphasized. Using Rutherford Backscattering Spectrometry (RBS) analysis, and x-ray diffraction, phases formed as a function of temperature have been identified. The phases Al3Ti through Ti3Al were observed over the temperature range 450–750°C, where reaction with the SiO2 substrate occurred. All phases were present as discreet layers within the samples with several layered phases coexisting at the higher temperatures.

Auger electron spectroscopy and X-ray diffraction studies of Ti-Si layers synthesised by ion implantation

1990 ◽  
Vol 114 (1-2) ◽  
pp. 93-97 ◽  
Author(s):  
S. V. Vidwans ◽  
A. M. Narsale ◽  
V. P. Salvi ◽  
A. A. Rangwala ◽  
L. Guzman ◽  
...  
Keyword(s):  
Ion Implantation ◽  
Auger Electron Spectroscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
X Ray Diffraction ◽  
X Ray
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