Molecular-Dynamics Simulation of the Initial Period of Cluster Deposition

2002 ◽  
Vol 749 ◽  
Author(s):  
K. Shintani ◽  
T. Nakajima ◽  
Y. Taniguchi

ABSTRACTThe initial periods of deposition process of metal clusters in the soft-landing regime are investigated by the molecular-dynamics simulation. The embedded-atom method potential is adopted for calculation of the interaction between metallic atoms. The predictor-corrector method for second-order differential equations is employed for integration of the equations of motion. A simulation begins with equilibration of clusters and a substrate at a specified temperature. The lowest atomic layer in the substrate is fixed and the next few atomic layers are set to be velocity-scaling layers during the deposition process. The periodic boundary conditions are imposed in the horizontal directions. A single cluster with no velocity is deposited on the substrate. The simulations are performed at different temperatures of the clusters and substrate and for different sizes of clusters. How the morphological transition of the deposited nanostructures is affected by these parameters is discussed.

2006 ◽  
Vol 978 ◽  
Author(s):  
Yoshiaki Kogure ◽  
Kei Sakieda ◽  
Toshio Kosugi ◽  
Tadatoshi Nozaki

Abstract Motion of edge dislocation in copper crystals is investigated by means of molecular dynamics simulation. The embedded atom method potential was used in the simulation. Configuration and motion of dislocations are graphically demonstrated in 3-dimentional model. Change of mean potential energy during the dislocation motion is also investigated.


2014 ◽  
Vol 898 ◽  
pp. 41-46
Author(s):  
Xiao Gang Jian ◽  
Yun Hua Zhang

This paper briefly reviews the overseas and domestic research status of the mechanics of hetero film-substrate interface based on molecular dynamics simulation, on this basis building the accurate model of diamond coatings/WC interface and executing the molecular dynamic simulation, exactly measuring the adhesive strength of the diamond coatings/WC interface, finally exploring the influence of interface scales on the adhesive strength of the diamond coatings/WC interface and verifying the feasibility of studying the microscopic structure by molecular dynamics simulation to characterize the mechanical properties of macrostructure, which has important significance for optimizing deposition process of diamond coatings to improve the adhesive strength of the interface.


1988 ◽  
Vol 100 ◽  
Author(s):  
Davy Y. Lo ◽  
Tom A. Tombrello ◽  
Mark H. Shapiro ◽  
Don E. Harrison

ABSTRACTMany-body forces obtained by the Embedded-Atom Method (EAM) [41 are incorporated into the description of low energy collisions and surface ejection processes in molecular dynamics simulations of sputtering from metal targets. Bombardments of small, single crystal Cu targets (400–500 atoms) in three different orientations ({100}, {110}, {111}) by 5 keV Ar+ ions have been simulated. The results are compared to simulations using purely pair-wise additive interactions. Significant differences in the spectra of ejected atoms are found.


2014 ◽  
Vol 140 (4) ◽  
pp. 044326 ◽  
Author(s):  
Philipp Thaler ◽  
Alexander Volk ◽  
Martin Ratschek ◽  
Markus Koch ◽  
Wolfgang E. Ernst

2007 ◽  
Vol 121-123 ◽  
pp. 1053-1056
Author(s):  
Guo Rong Zhong ◽  
Qiu Ming Gao

Molecular dynamics simulation of the solidification behavior of liquid nickel nanowires has been carried out based on the embedded atom potential with different cooling rates. The nanowires constructed with a face-centered cubic structure and a one-dimensional (1D) periodical boundary condition along the wire axis direction. It is found that the final structure of Ni nanowires strongly depend on the cooling rates during solidification from liquid. With decreasing cooling rates the final structure of the nanowires varies from amorphous to crystalline via helical multi-shelled structure.


2013 ◽  
Vol 652-654 ◽  
pp. 1916-1924 ◽  
Author(s):  
Hong Gao ◽  
Chao Liu ◽  
Fen Hong Song

Using molecular dynamics simulation, the influence factors of deposition process, such as cluster incident velocity, material hardness and so on, were studied. The cluster incident velocity influences the combination strength between the substrate and cluster greatly. The higher the cluster velocity is, the stronger the combination strength is, and the faster the cluster forms the crystalline structure like the substrate. Higher temperature of the substrate and the cluster will improve the combination strength. The size of the cluster influences the effect of combination as well. The larger the cluster is, the stronger the combination strength is. If a soft cluster impacts on a hard substrate, because of lack of enough deformation at the interface of the substrate, it is difficult to form the effective combination. If a hard cluster impacts on a soft substrate, the lattice defects occur and the cluster takes a longer time to form crystalline structure.


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