Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization
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AbstractThe residence time distribution of slurry in the pad-wafer interface was experimentally determined and used to calculate the slurry utilization efficiency (η) of the CMP process. Slurry utilization efficiency represents the percentage of slurry that actually participates in the polish by entering the region bounded between the wafer and the pad. Results show that η ranges from 2 to 22 percent, depending on operating conditions such as applied wafer pressure, relative pad wafer velocity, slurry flow rate and pad surface texture (i.e. type of pad grooving).
2004 ◽
Vol 23
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pp. 189-203
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1995 ◽
Vol 18
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pp. 363-381
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2017 ◽
Vol 158
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pp. 50-57
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2019 ◽
Vol 138
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pp. 248-263
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2010 ◽
Vol 37
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pp. 931-940
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