scholarly journals Identification of multiple crack locations in micro cantilever beam by wavelet transforms

2020 ◽  
Vol 13 (35) ◽  
pp. 3685-3694
Author(s):  
K Ravikumar ◽  

Wavelet Analysis, the improved version of Fourier transform is used to investigate and analyze the variant transient signals in time-frequency domain with higher accuracy and precision. Wavelet theory found its promising application in various fields not limited to Physics, Biology, Geophysics, Engineering and Medicine which becomes a common tool to analyze data. In this work we present new insight using wavelet transform to detect the cracks present in micro structured cantilever beam which found its application in various Micro Electro Mechanical System (MEMS) devices such as Transducers, Sensors, Switches, Actuators and Probes. Even a small change in microstructure will reflect in its dynamic output, so it is desired to locate the presence of cracks or damages over the device structure accurately. The modeling of such microstructure is designed and simulated using COMSOL Multiphysics. The displacement (Static Response) and stress of the beam for simulated damage were analyzed by wavelet transform using MATLAB. The obtained results highlights this method of analysis provides accurate location and effect of the crack over the Micro cantilever structure.


2013 ◽  
Vol 300-301 ◽  
pp. 1309-1312
Author(s):  
Ji Long Su ◽  
Yan Jiao Zhang ◽  
Xing Feng Lian

The Ansys simulate software is utilized to analyze pull-in voltages and stresses of the fixed end of micro- cantilever beam with different thicknesses respectively. Based on the analysis of the electrostatic force at the pull-in voltage, the stress of fixed end of micro-beam and the maximum deflection are obtained. The relationship between the stress of fixed end and thickness is established. The results show that the mutation thickness of the stress and the pull-in voltage are at and respectively , it is consistent with the intrinsic size of the polycrystalline copper micro-beam.


2009 ◽  
Vol 3 (9) ◽  
Author(s):  
Othman Sidek ◽  
Muhamad Azman Miskam ◽  
H.M.T Khaleed ◽  
Mohd Fauzi Alias ◽  
Shukri Korakkottil Kunhi Mohd

2010 ◽  
Vol 37 (7) ◽  
pp. 1784-1788 ◽  
Author(s):  
张晓晶 Zhang Xiaojing ◽  
张博明 Zhang Boming ◽  
陈吉安 Chen Ji′an ◽  
武湛君 Wu Zhanjun

Author(s):  
Atabak Sarrafan ◽  
Seiyed Hamid Zareh ◽  
Abolghassem Zabihollah ◽  
Amir Ali Khayyat

Measurement ◽  
2011 ◽  
Vol 44 (2) ◽  
pp. 454-465 ◽  
Author(s):  
Alireza Shooshtari ◽  
Hamed Kalhori ◽  
Amirhasan Masoodian

2005 ◽  
Author(s):  
Heon J. Lee ◽  
Young-Soo Chang ◽  
Ho-Young Kim ◽  
Jong-Seob Ahn ◽  
Yoon-Pyo Lee

Micro cantilevers are significant structure for MEMS devices, such as bio-chips, sensors and STEM/AFM probes. The beam deflection and its characteristics have been studied for various purposes. In this study, expending bubbles from thermal surface exert force on micro-cantilever beam and causes deflection of the beam. Cantilevers were fabricated by classic MEMS fabrication method; photolithography and dry etching. The micro-beam was fabricated from <100> n-type silicon wafer and its thickness varies from 10 micron to 30micron with various geometry (length, width and tip shapes). The distance from thermal surface and cantilever beam is also significant variables for analysis of bubble-beam interaction. We observed beam deflection with respect to various bubble generation conditions (bubble size, contact area and generating frequency). Simple analysis of bubble-beam interaction were performed and compared with experimental results.


Sign in / Sign up

Export Citation Format

Share Document