scholarly journals Electric Discharge Destruction of Wasted Printed Electronic Boards for Extraction of Metals

2020 ◽  
Author(s):  
V.M. Alexeenko ◽  
L.G. Ananieva ◽  
A.A. Zherlitsyn ◽  
S.S. Kondratiev ◽  
M.V. Korovkin ◽  
...  

The results of the electric discharge crushing of PCB (printed circuit boards) to millimeter-sized fractions suitable for separation of the metal from the dielectric are presented. The crushing was performed on a high-voltage repetitively pulsed generator with varying the number of pulses. It was determined the dependences of the fractional composition of crushing products on the number of pulses in the cycle. Crushing products were studied for definition separation of metal from the dielectric with optical microscope. The results of the work confirm the possibility of electric discharge crushing various types of PCB, including fiberglass PCB with four layers. Keywords: high voltage fragmentation, waste printed circuit board, recycling

2015 ◽  
Vol 787 ◽  
pp. 18-21 ◽  
Author(s):  
A.G. Ganesh Kumar ◽  
G. Ranganath ◽  
S.N. Mani Varmaa ◽  
S. Shylin H. Jose ◽  
M. Sakthivel

Recycling of Printed Circuit Boards (PCB) has been carried out by powdering it into granular size of less than 10 microns. The properties of PCB reveal that it possesses density of 1.3 g/cm3 and Tensile Strength of 310 MPa which is comparatively high when compared to the Polycarbonate material which is normally used in the fabrication of Riot shield. The PCB material was subjected to SEM and EDAX analysis for determining their structure, porosity and material composition. Riot shield fabricated from PCB reduces the environmental effects of E-waste PCBs by the recycling technique, improves the material strength and reduces the weight and cost to a larger extent.


Proceedings ◽  
2019 ◽  
Vol 29 (1) ◽  
pp. 19
Author(s):  
Paul Ghioca ◽  
Madalina Elena David ◽  
Mircea Ioan Filipescu ◽  
Ramona Marina Grigorescu ◽  
Lorena Iancu ◽  
...  

The organic part of the waste printed circuit board (WPCB) contains mainly epoxy resin, fiberglass and brominated flame retardants, a composition that makes it quite difficult to reuse [1,2]. [...]


Author(s):  
P. Singh ◽  
G.T. Galyon ◽  
J. Obrzut ◽  
W.A. Alpaugh

Abstract A time delayed dielectric breakdown in printed circuit boards, operating at temperatures below the epoxy resin insulation thermo-electrical limits, is reported. The safe temperature-voltage operating regime was estimated and related to the glass-rubber transition (To) of printed circuit board dielectric. The TG was measured using DSC and compared with that determined from electrical conductivity of the laminate in the glassy and rubbery state. A failure model was developed and fitted to the experimental data matching a localized thermal degradation of the dielectric and time dependency. The model is based on localized heating of an insulation resistance defect that under certain voltage bias can exceed the TG, thus, initiating thermal degradation of the resin. The model agrees well with the experimental data and indicates that the failure rate and truncation time beyond which the probability of failure becomes insignificant, decreases with increasing glass-rubber transition temperature.


2018 ◽  
Vol 10 (2) ◽  
pp. 179-186 ◽  
Author(s):  
Alexander Fricke ◽  
Mounir Achir ◽  
Philippe Le Bars ◽  
Thomas Kürner

AbstractBased on vector network analyzer Measurements, a model for the specular reflection behavior of printed circuit boards in the Terahertz range has been derived. It has been calibrated to suit the behavior of the measurements using a simulated annealing algorithm. The model has been tailored for integration to ray-tracing-based propagation modeling.


Cryptography ◽  
2020 ◽  
Vol 4 (2) ◽  
pp. 11
Author(s):  
Mitchell Martin ◽  
Jim Plusquellic

Physical Unclonable Functions (PUFs) are primitives that are designed to leverage naturally occurring variations to produce a random bitstring. Current PUF designs are typically implemented in silicon or utilize variations found in commercial off-the-shelf (COTS) parts. Because of this, existing designs are insufficient for the authentication of Printed Circuit Boards (PCBs). In this paper, we propose a novel PUF design that leverages board variations in a manufactured PCB to generate unique and stable IDs for each PCB. In particular, a single copper trace is used as a source of randomness for bitstring generation. The trace connects three notch filter structures in series, each of which is designed to reject specific but separate frequencies. The bitstrings generated using data measured from a set of PCBs are analyzed using statistical tests to illustrate that high levels of uniqueness and randomness are achievable.


2010 ◽  
Vol 113-116 ◽  
pp. 730-734 ◽  
Author(s):  
Chen Long Duan ◽  
Yue Min Zhao ◽  
Jing Feng He ◽  
Nian Xin Zhou

The reutilization of waste Printed Circuit Boards (PCB) is a focused topic in the field of environment protection and resource recycling, and the crushing is the crucial process for recycling waste PCB. A hamper impacting crusher was used to achieve metals crushing liberation from non-metals, the liberation mechanism of PCB can be explained by dispersion liberation accompanied disengaging liberation. The Rosin-Rammler distribution model of crushed PCB particle was put forward. The evaluation indexes show that Rosin-Rammler function can accurately describe size distribution of PCB particles because the convergence property R2 is 0.99694 and fitting error E is 4.80658. The selective crushing is appearance with metals concentrated in coarser fraction and non-metals in finer size during comminution processing. The impact crushing is an effective method to metals liberation of PCB particles.


Author(s):  
Hansang Lim ◽  
Do-Hwan Jung ◽  
Geono Kwon ◽  
Young Jong Lee ◽  
Jun Seo Park

An automotive junction box distributes electric power to electric systems installed in a vehicle with overcurrent protection. As a larger number of electric systems are installed, the junction box is equipped with more components, functionalities and connections. However, owing to the fuse accessibility, its installation space is so restricted that a downsized design is required for the junction box. The junction box is composed of small signal circuitry for control and monitoring, and large current-carrying circuitry for power distribution which includes many parallel traces. Because of these unique features, widely used techniques for downsizing printed-circuit boards are not applicable. Also, there is no rule for designing large current-carrying parallel traces, and it is difficult to optimize the size of the printed-circuit board for the automotive junction box. This paper presents the design rules for a printed-circuit board when downsizing a junction box. First, the layout strategy for the power distribution components is presented, which is determined by the sum of the squares of the currents flowing through connector pairs. Then, the thermal effects of parallel traces are simulated for different conditions by using thermal analysis software. Based on the results, an analytical estimation of the additional temperature rises due to parallel traces and rules for a thermally effective arrangement of the parallel traces are presented.


2014 ◽  
Vol 7 (11) ◽  
pp. 3674-3682 ◽  
Author(s):  
Jingping Liu ◽  
Cheng Yang ◽  
Haoyi Wu ◽  
Ziyin Lin ◽  
Zhexu Zhang ◽  
...  

A multilayer printed circuit board (PCB) can be fabricated using commercially available printing paper, which shows comparable functionalities with the conventional organic PCBs but 100 times lower environmental impact.


1987 ◽  
Vol 108 ◽  
Author(s):  
David Wei Wang

The printed circuit board is an integral part of the electronic packaging hierarchy. Its use began more than 40 years ago, and the demand for printed circuit boards has increased in parallel with the growth of the electronics industry.[1] According to a recent forecast, the worldwide production of printed circuit boards will reach to over 19 billion U.S. dollars' worth by 1990.[2] With continuing demands for more interconnections, the multilayer circuit board industry is experiencing its fastest growth rate. Boards with more than 20 inner planes of circuitry are being manufactured with high reliability.Based on dollar values, more than 90% of the circuit boards produced are in the rigid board category, where starting materials are based on thermosetting prepregs produced by a solution impregnation method. This article is a review of materials currently used in rigid composites.


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