scholarly journals Thermal conductivity measurement at the micrometer scale of ceramics using thermoreflectance technique —High-thermal-conductivity AlN with reduced amount of grain boundary phase—

2008 ◽  
Vol 116 (1360) ◽  
pp. 1260-1264 ◽  
Author(s):  
Sang-Kee LEE ◽  
Ikuko YAMADA ◽  
Shoichi KUME ◽  
Hiromi NAKANO ◽  
Kimihito HATORI ◽  
...  
2008 ◽  
Vol 403 ◽  
pp. 65-67
Author(s):  
Sang Kee Lee ◽  
Ikuko Yamada ◽  
Shoichi Kume ◽  
Hiromi Nakano ◽  
Koji Watari

The thermal conductivity at the micrometer-scale of AlN ceramics with eliminated grain boundary phase was measured by the thermoreflectance technique with periodic heating. Thermal conductivities were ranged from 160 to 260 W/m•K and an average value of 201 W/m•K was obtained from a 22 m2 area. The variation in the thermal conductivities was related to the individual AlN grains and grain boundary characteristics.


Author(s):  
Taehee Jeong ◽  
Jian-Gang Zhu

Using the time–resolved thermoreflectance technique, the thermal conductivity of CoFe films are measured with various thicknesses and the results show a thickness-dependent thermal conductivity. In order to overcome the obstacle for the high thermal conductivity metal film measurement, a thermal barrier (SiNx) is added between the metal film and Si substrate.


2018 ◽  
Vol 135 (5) ◽  
pp. 2831-2836 ◽  
Author(s):  
Tetsuya Nomoto ◽  
Shusaku Imajo ◽  
Satoshi Yamashita ◽  
Hiroki Akutsu ◽  
Yasuhiro Nakazawa ◽  
...  

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