scholarly journals Experimental Investigation on The Effect of Electrical Current Flow on The Coefficient of Friction between Two Dry Rubbing Surfaces.(Dept.M)

2021 ◽  
Vol 19 (1) ◽  
pp. 66-75
Author(s):  
Yousef Ibraheem
Keyword(s):  
Experimental Investigation ◽  
Coefficient Of Friction ◽  
Current Flow ◽  
Electrical Current ◽  
Electrical Current Flow ◽  
The Coefficient Of Friction

Experimental Investigation of aluminum doping crumb rubber/epoxy composite in reciprocating motion

2015 ◽  
Vol 3 ◽  
pp. 1
Author(s):  
Goutam Chandra Karar ◽  
Nipu Modak
Keyword(s):  
Experimental Investigation ◽  
Coefficient Of Friction ◽  
Epoxy Composite ◽  
Normal Load ◽  
Crumb Rubber ◽  
The Other ◽  
Reciprocating Motion ◽  
Molding Process ◽  
Friction Tester ◽  
The Coefficient Of Friction

The experimental investigation of reciprocating motion between the aluminum doped crumb rubber /epoxy composite and the steel ball has been carried out under Reciprocating Friction Tester, TR-282 to study the wear and coefficient of frictions using different normal loads (0.4Kg, 0.7Kgand1Kg), differentfrequencies (10Hz, 25Hz and 40Hz).The wear is a function of normal load, reciprocating frequency, reciprocating duration and the composition of the material. The percentage of aluminum presents in the composite changesbut the other components remain the same.The four types of composites are fabricated by compression molding process having 0%, 10%, 20% and 30% Al. The effect of different parameters such as normal load, reciprocating frequency and percentage of aluminum has been studied. It is observed that the wear and coefficient of friction is influenced by the parameters. The tendency of wear goes on decreasing with the increase of normal load and it is minimum for a composite having 10%aluminum at a normal load of 0.7Kg and then goes on increasing at higher loads for all types of composite due to the adhesive nature of the composite. The coefficient of friction goes on decreasing with increasing normal loads due to the formation of thin film as an effect of heat generation with normal load.

Electrical current flow at conductive nanowires formed in GaN thin films by a dislocation template technique

2010 ◽  
Vol 96 (19) ◽  
pp. 193109 ◽  
Author(s):  
Shin-ichi Amma ◽  
Yuki Tokumoto ◽  
Keiichi Edagawa ◽  
Naoya Shibata ◽  
Teruyasu Mizoguchi ◽  
...  
Keyword(s):  
Thin Films ◽  
Current Flow ◽  
Electrical Current ◽  
Electrical Current Flow

Effect of Current Direction on the Reliability of Different Capped Cu Interconnects

2005 ◽  
Vol 863 ◽  
Author(s):  
C. L. Gan ◽  
C. Y. Lee ◽  
C. K. Cheng ◽  
J. Gambino
Keyword(s):  
Failure Analysis ◽  
Current Flow ◽  
Void Nucleation ◽  
Electrical Current ◽  
Nucleation Site ◽  
Time To Failure ◽  
Current Direction ◽  
Electron Current ◽  
Electrical Current Flow ◽  
Better Than

AbstractThe reliability of Cu M1-V1-M2-V2-M3 interconnects with SiN and CoWP cap layers was investigated. Similar to previously reported results, the reliability of CoWP capped structures is much better than identical SiN capped structures. However, it was also observed that the reliability of CoWP capped interconnects was independent of the direction of electrical current flow. This phenomenon is different from what was observed for SiN capped structures, where M2 lines with electron current flow in the upstream configuration (“via-below”) have about three times larger median-time-to-failure than identical lines in the downstream configuration (“viaabove”). This is because the Cu/SiN interface is the preferential void nucleation site and provides the fastest diffusion pathway in such an architecture. Failure analysis has shown that fatal partially-spanned voids usually had formed directly below the via for “via-above” configuration, and fully-spanned voids occurred in the lines above the vias for “via-below” configuration.On the other hand, failure analysis for CoWP-coated Cu structures showed that partiallyspanned voids below the via do not cause fatal failures in the downstream configuration. This is because the CoWP layer is conducting, and thus able to shunt current around the void. As a result, a large fully-spanning void is required to cause a failure, just like the upstream configuration. Thus the lifetime of an interconnect with a conducting cap layer is independent of whether the current is flowing upstream or downstream.

scholarly journals Nonconservative current-induced forces: A physical interpretation

2011 ◽  
Vol 2 ◽  
pp. 727-733 ◽  
Author(s):  
Tchavdar N Todorov ◽  
Daniel Dundas ◽  
Anthony T Paxton ◽  
Andrew P Horsfield
Keyword(s):  
Physical Interpretation ◽  
Current Flow ◽  
Test Procedure ◽  
Electrical Current ◽  
Stimulated Emission ◽  
General Definition ◽  
Noninvasive Test ◽  
Electrical Current Flow ◽  
Definition Of ◽  
A Current

We give a physical interpretation of the recently demonstrated nonconservative nature of interatomic forces in current-carrying nanostructures. We start from the analytical expression for the curl of these forces, and evaluate it for a point defect in a current-carrying system. We obtain a general definition of the capacity of electrical current flow to exert a nonconservative force, and thus do net work around closed paths, by a formal noninvasive test procedure. Second, we show that the gain in atomic kinetic energy over time, generated by nonconservative current-induced forces, is equivalent to the uncompensated stimulated emission of directional phonons. This connection with electron–phonon interactions quantifies explicitly the intuitive notion that nonconservative forces work by angular momentum transfer.

scholarly journals Peridynamic Formulation for Coupled Thermoelectric Phenomena

2017 ◽  
Vol 2017 ◽  
pp. 1-10 ◽  
Author(s):  
Migbar Assefa ◽  
Xin Lai ◽  
Lisheng Liu ◽  
Yang Liao
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Partial Differential Equations ◽  
Analytical Solutions ◽  
Current Flow ◽  
Numerical Technique ◽  
Electrical Current ◽  
Numerical Examples ◽  
Electrical Current Flow ◽  
Thermoelectric Convertor

Modeling of heat and electrical current flow simultaneously in thermoelectric convertor using classical theories do not consider the influence of defects in the material. This is because traditional methods are developed based on partial differential equations (PDEs) and lead to infinite fluxes at the discontinuities. The usual way of solving such PDEs is by using numerical technique, like Finite Element Method (FEM). Although FEM is robust and versatile, it is not suitable to model evolving discontinuities. To avoid such shortcomings, we propose the concept of peridynamic theory to derive the balance of energy and charge equations in the coupled thermoelectric phenomena. Therefore, this paper presents the transport of heat and charge in thermoelectric material in the framework of peridynamic (PD) theory. To illustrate the reliability of the PD formulation, numerical examples are presented and results are compared with those from literature, analytical solutions, or finite element solutions.

Influence of Surface Roughness on Friction and Contact Resistance in Sliding Electrical Contacts

2007 ◽  
Author(s):  
Dinesh G. Bansal ◽  
Jeffrey L. Streator
Keyword(s):  
Surface Roughness ◽  
Contact Resistance ◽  
Coefficient Of Friction ◽  
Electrical Contact ◽  
Electrical Current ◽  
Electrical Contacts ◽  
Sliding Electrical Contacts ◽  
The Coefficient Of Friction ◽  
Current Densities

An experiment is conducted to investigate the role of surface roughness on the coefficient of friction and contact resistance of sliding electrical contacts. A hemispherical pin is sliding along both smooth and rough 2-meter rail surface. Tests are performed at both low and moderate sliding speed and for a range of electrical current densities, ranging from 0 to about 12 GA/m2. It was found that surface roughness had a significant influence on the coefficient of friction, with the smoother surfaces exhibiting higher coefficients of friction. Contact resistance, on the other hand, did not show as strong an effect of surface roughness, except for a few parameter combinations. At the higher current densities studied (>10 GA/m2), it was found that the contact resistance values tended to be on the order of 1 mΩ, independent of load, speed and roughness. This convergence may be due to presence of liquid metal film at the interface, which established ideal electrical contact.

Bone Formation and Impedance of Electrical Current Flow

1981 ◽  
Vol &NA; (155) ◽  
pp. 196???210 ◽  
Author(s):  
P. C. COLLINS ◽  
D. C. PATERSON ◽  
B. VERNON-ROBERTS ◽  
D. PFEIFFER
Keyword(s):  
Bone Formation ◽  
Current Flow ◽  
Electrical Current ◽  
Electrical Current Flow
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