scholarly journals Multiscale-Informed Modeling of High Temperature Component Response with Uncertainty Quantification

2020 ◽  
Author(s):  
Lynn Munday ◽  
Som Dhulipala ◽  
Albert Casagranda ◽  
Stephanie Pitts ◽  
Benjamin Spencer ◽  
...  
Keyword(s):  
High Temperature ◽  
Uncertainty Quantification ◽  
High Temperature Component ◽  
Temperature Component

Development of Degradation Evaluation SW for High Temperature Component using Machine Learning Approach

2020 ◽  
Vol 44 (1) ◽  
pp. 57-62 ◽  
Author(s):  
Woosung Choi ◽  
Sungho Chang ◽  
Sangmin Lee ◽  
Haesoo Kang ◽  
Myeonghwan Bang ◽  
...  
Keyword(s):  
Machine Learning ◽  
High Temperature ◽  
Learning Approach ◽  
High Temperature Component ◽  
Machine Learning Approach ◽  
Temperature Component ◽  
Degradation Evaluation

High temperature component design

1985 ◽  
Vol 87 ◽  
pp. 365-371
Author(s):  
H.-J. Seehafer ◽  
M. Becker ◽  
E. Bodmann
Keyword(s):  
High Temperature ◽  
High Temperature Component ◽  
Component Design ◽  
Temperature Component

A general framework for fatigue reliability analysis of a high temperature component

2018 ◽  
Vol 35 (1) ◽  
pp. 292-303 ◽  
Author(s):  
Weiqi Du ◽  
Yuanxin Luo ◽  
Yongqin Wang ◽  
Ling Ma
Keyword(s):  
High Temperature ◽  
Reliability Analysis ◽  
General Framework ◽  
Fatigue Reliability ◽  
High Temperature Component ◽  
Temperature Component

scholarly journals ASCA SIS X-ray Observations of the Wind Blown Bubble NGC 6888

1997 ◽  
Vol 166 ◽  
pp. 425-428
Author(s):  
Matthias Wrigge ◽  
You-Hua Chu ◽  
Eugene A. Magnier ◽  
Yuichi Kamata
Keyword(s):  
Heat Conduction ◽  
High Temperature ◽  
Spectral Resolution ◽  
Surface Brightness ◽  
Contact Discontinuity ◽  
Plasma Component ◽  
Central Temperature ◽  
X Ray ◽  
High Temperature Component ◽  
Temperature Component

AbstractWe present ASCA SIS observations of the wind-blown bubble NGC 6888. Because the ASCA SIS is sensitive to higher energy photons and has a higher spectral resolution compared to the ROSAT PSPC, we are able to detect a T ≈ 8×106 K plasma component besides the T ≈ 1.5×106 K component known from previous PSPC observations. The existence of a high-temperature component, the observed limb-brightened X-ray surface brightness profile, and the observed level of X-ray surface brightness cannot be satisfactorily explained by currently available models. Reducing heat conduction at the contact discontinuity may raise the central temperature and produce a limb-brightening; however, the expected X-ray surface brightness is still considerably higher than the observed surface brightness.

scholarly journals Miniature high voltage, high temperature component package development

2016 ◽  
Author(s):  
L. J. Rashkin ◽  
R. W. Brocato ◽  
J. J. Delhotal ◽  
J. C. Neely ◽  
J. D. Flicker ◽  
...  
Keyword(s):  
High Temperature ◽  
High Voltage ◽  
High Temperature Component ◽  
Temperature Component

High-Temperature Component Evaluation of Commercial Flash Memory and Capacitors for Enhancement of Geothermal Tool Development

2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000010-000019 ◽  
Author(s):  
Avery Cashion ◽  
Grzegorz Cieslewski
Keyword(s):  
High Temperature ◽  
Flash Memory ◽  
Oil And Gas ◽  
Oil And Gas Industry ◽  
Department Of Energy ◽  
Equivalent Series Resistance ◽  
Tool Development ◽  
High Temperature Component ◽  
Temperature Component ◽  
Circuit Components

Environments relevant to geothermal energy exploration frequently exceed the temperatures and pressures commonly experienced by downhole tools in the oil and gas industry. As such, pushing the boundaries with geothermal tool development can often necessitate exceeding manufacturer specifications for temperature and pressure of individual circuit components. High-temperature circuit designers often must dedicate considerable time and resources to determine if a component exists that they may be able to knead performance out of to meet their requirements. In light of this difficulty, Sandia National Laboratories has initiated a program funded by the Geothermal Technologies Office at the US Department of Energy to compile and make available an empirically determined, practical dataset of select high-temperature component performances beyond specification. Detailed here are the efforts surrounding geothermal temperature characterization of commercially available HT-Flash memory modules made by Texas Instruments (SM28VLT32-HT) and preliminary results of 3 commercial solid tantalum capacitors. Flash evaluation boards were modified for high temperature application and read, write and erase functionality were tracked as well as prolonged data retention at various temperatures well beyond datasheet specifications. It was observed that each flash function has a different maximum operation temperature above specification. As temperature increases, erase, write, and then read functions successively fail. Within duration and temperature limits, functionality of each operation returns after cooling back below its threshold value. Importantly for logging tools, after cooling the flash modules in this study still retain all memory previously written. Flash lifetime at temperature was examined at several temperatures by 1000hr duration tests in the oven with new writes and periodic full memory reads throughout the test. To test the capacitors, capacitance and equivalent series resistance were tracked over a 1000hr test at 260°C. Results of MatLab fault analyses are described for each aspect of this study to facilitate out-of-spec high temperature tool design.

P21 Statistical material selection maps for high temperature component design

2006 ◽  
Vol 2006 (0) ◽  
pp. 561-562
Author(s):  
Tomohiro SHIMA ◽  
Kazunari FUJIYAMA ◽  
Takashi SAITO ◽  
Yasushi MAEBASHI
Keyword(s):  
High Temperature ◽  
Material Selection ◽  
High Temperature Component ◽  
Component Design ◽  
Temperature Component
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