P21 Statistical material selection maps for high temperature component design

2006 ◽  
Vol 2006 (0) ◽  
pp. 561-562
Author(s):  
Tomohiro SHIMA ◽  
Kazunari FUJIYAMA ◽  
Takashi SAITO ◽  
Yasushi MAEBASHI
1985 ◽  
Vol 87 ◽  
pp. 365-371
Author(s):  
H.-J. Seehafer ◽  
M. Becker ◽  
E. Bodmann

1997 ◽  
Vol 166 ◽  
pp. 425-428
Author(s):  
Matthias Wrigge ◽  
You-Hua Chu ◽  
Eugene A. Magnier ◽  
Yuichi Kamata

AbstractWe present ASCA SIS observations of the wind-blown bubble NGC 6888. Because the ASCA SIS is sensitive to higher energy photons and has a higher spectral resolution compared to the ROSAT PSPC, we are able to detect a T ≈ 8×106 K plasma component besides the T ≈ 1.5×106 K component known from previous PSPC observations. The existence of a high-temperature component, the observed limb-brightened X-ray surface brightness profile, and the observed level of X-ray surface brightness cannot be satisfactorily explained by currently available models. Reducing heat conduction at the contact discontinuity may raise the central temperature and produce a limb-brightening; however, the expected X-ray surface brightness is still considerably higher than the observed surface brightness.


2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000010-000019 ◽  
Author(s):  
Avery Cashion ◽  
Grzegorz Cieslewski

Environments relevant to geothermal energy exploration frequently exceed the temperatures and pressures commonly experienced by downhole tools in the oil and gas industry. As such, pushing the boundaries with geothermal tool development can often necessitate exceeding manufacturer specifications for temperature and pressure of individual circuit components. High-temperature circuit designers often must dedicate considerable time and resources to determine if a component exists that they may be able to knead performance out of to meet their requirements. In light of this difficulty, Sandia National Laboratories has initiated a program funded by the Geothermal Technologies Office at the US Department of Energy to compile and make available an empirically determined, practical dataset of select high-temperature component performances beyond specification. Detailed here are the efforts surrounding geothermal temperature characterization of commercially available HT-Flash memory modules made by Texas Instruments (SM28VLT32-HT) and preliminary results of 3 commercial solid tantalum capacitors. Flash evaluation boards were modified for high temperature application and read, write and erase functionality were tracked as well as prolonged data retention at various temperatures well beyond datasheet specifications. It was observed that each flash function has a different maximum operation temperature above specification. As temperature increases, erase, write, and then read functions successively fail. Within duration and temperature limits, functionality of each operation returns after cooling back below its threshold value. Importantly for logging tools, after cooling the flash modules in this study still retain all memory previously written. Flash lifetime at temperature was examined at several temperatures by 1000hr duration tests in the oven with new writes and periodic full memory reads throughout the test. To test the capacitors, capacitance and equivalent series resistance were tracked over a 1000hr test at 260°C. Results of MatLab fault analyses are described for each aspect of this study to facilitate out-of-spec high temperature tool design.


Author(s):  
Hamid R. Ahmadi Moghaddam ◽  
Pierre Mertiny

The safety of high pressure and high temperature components is paramount, and therefore, developing effective and reliable methodologies to improve the prediction of crack propagation is an important task. The present paper describes and demonstrates a multi-physics numerical analysis approach for assessing crack propagation using a sensor device. This method employs a coupled structural-thermal-electric analysis in conjunction with a thermal-fluid-structure interaction analysis to study the structural health of a high pressure and high temperature component.


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