scholarly journals Development of dental inspection method: nondestructive evaluation of a dentin–adhesive interface by acoustic emission

Author(s):  
Ryoma Ezaki ◽  
Atsushi Mine ◽  
Kazuhisa Sato ◽  
Ken-ichi Fukui ◽  
Keigo Kumada ◽  
...  
2013 ◽  
Vol 2013 ◽  
pp. 1-5
Author(s):  
Alireza Panjsetooni ◽  
Norazura Muhamad Bunnori ◽  
Amir Hossein Vakili

Acoustic emission (AE) technique is one of the nondestructive evaluation (NDE) techniques that have been considered as the prime candidate for structural health and damage monitoring in loaded structures. This technique was employed for investigation process of damage in reinforced concrete (RC) frame specimens. A number of reinforced concrete RC frames were tested under loading cycle and were simultaneously monitored using AE. The AE test data were analyzed using the AE source location analysis method. The results showed that AE technique is suitable to identify the sources location of damage in RC structures.


1999 ◽  
Vol 4 (1) ◽  
pp. 22 ◽  
Author(s):  
R. M. Lemor ◽  
M. B. Kruger ◽  
D. M. Wieliczka ◽  
J. R. Swafford ◽  
P. Spencer

Author(s):  
Mingchun Lin ◽  
Yewei Kang ◽  
Weibin Wang ◽  
Lei Zhang ◽  
Yi Sun

Much manpower is needed and a lot of materials are wasted when the floor of large above-ground storage tank (AST) is inspected with conventional methods which need to shut down the tank, then to empty and clean it before inspection. Due to the disadvantages of that, an in-service inspection method using acoustic emission (AE) technology is presented. By this mean the rational inspection plan and integrity evaluation of tank floors can be constructed. First, specific inspection steps are established based on the acoustic emission principle for large AST’s floors and the practical condition of AST in order to acquire the AE corrosion data. Second, analysis method of acoustic emission dataset is studied. Finally, maintenance proposes are provided based on results of analysis for the corrosion status of the tank floors. In order to evaluate the performance of our method, an in-service field inspection is practiced on product oil tank with a volume of 5000 cubic meters. Then a traditional inspection procedure using magnetic flux leakage (MFL) technology is followed up. Comparative analysis of the results of the two inspection methods shows that there is consistency in localizing the position of corrosion between them. The feasibility of inservice inspection of AST’s floors with AE is demonstrated.


1988 ◽  
Vol 117 ◽  
Author(s):  
Haydn N. G. Wadley ◽  
Arnold H. Kahn ◽  
Ward Johnson

AbstractTo implement new process control strategies including Intelligent Processing of Materials, advanced sensors are required to nonintrusively evaluate process and microstructure variables. Researchers increasingly are looking to innovative extensions of traditional nondestructive evaluation technologies, such as ultrasonics, acoustic emission, and eddy current methodologies for this. Here, the nature and characteristics of emerging sensors based upon these new measurement methods are described and examples of their application discussed.


Author(s):  
Yuhki Sato ◽  
Hideo Miura

A new nondestructive evaluation method of adhesion condition between a Si chip and small metallic bumps in a flip chip bonding structure is proposed. The local deformation of a surface of a Si chip mounted on a substrate increases drastically between two bumps with decrease of the thickness of the chip thinner than 200 μm. The magnitude of the local deformation exceeds 100 nm easily. Once the lack or delamination of the metallic bumps occurs at the interface, the local deformation at a surface of a Si chip around the bump changes remarkably. The change of the magnitude of the local deformation reaches about 50 nm to 600 nm depending on the thickness of the chip. Such a small change of deformation can be measured using a scanning blue laser microscope. Therefore, the adhesion condition of the area-arrayed bumps can be examined by measuring the local deformation of a surface of an LSI chip mounted on a substrate.


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