scholarly journals Применение селективного контакта MoO-=SUB=-x-=/SUB=-/p-Si для оценки деградации приповерхностной области кремния

2020 ◽  
Vol 46 (24) ◽  
pp. 37
Author(s):  
Д.А. Кудряшов ◽  
А.С. Гудовских ◽  
А.А. Максимова ◽  
А.И. Баранов ◽  
А.В. Уваров ◽  
...  
Keyword(s):  
Surface Layer ◽  
Magnetron Sputtering ◽  
Silicon Surface ◽  
Silicon Oxide ◽  
Near Surface ◽  
Type Silicon ◽  
Current Voltage ◽  
Current Voltage Characteristics ◽  
Degree Of Damage ◽  
P Type

The possibility of evaluation the degree of damage to the near-surface layer of p-type silicon using a selective contact based on MoOx/p-Si is shown. A strong sensitivity of the current-voltage characteristics to the states on the silicon surface formed during the deposition of silicon oxide by magnetron sputtering is demonstrated.

Investigation of current-voltage characteristics of p-type silicon during electrochemical anodization and application to doping profiling

2011 ◽  
Vol 8 (3) ◽  
pp. 784-787
Author(s):  
Ahmed Gharbi ◽  
Boudjemaa Remaki ◽  
Aomar Halimaoui ◽  
Daniel Bensahel ◽  
Abdelkader Souifi
Keyword(s):  
Electrochemical Anodization ◽  
Type Silicon ◽  
Current Voltage ◽  
Current Voltage Characteristics ◽  
P Type

Influence of copper contamination on the illuminated forward and dark reverse current-voltage characteristics of multicrystalline p-type silicon solar cells

2014 ◽  
Vol 11 (11-12) ◽  
pp. 1697-1702 ◽  
Author(s):  
Tleuzhan Turmagambetov ◽  
Sébastien Dubois ◽  
Jean-Paul Garandet ◽  
Benoit Martel ◽  
Nicolas Enjalbert ◽  
...  
Keyword(s):  
Solar Cells ◽  
Reverse Current ◽  
Silicon Solar Cells ◽  
Copper Contamination ◽  
Type Silicon ◽  
Current Voltage ◽  
Current Voltage Characteristics ◽  
P Type

scholarly journals Properties of Silicon-on-Defect-Layer Material

1995 ◽  
Vol 396 ◽  
Author(s):  
Jianming Li ◽  
K. W. Jones ◽  
J. H. Coleman ◽  
J. Yi ◽  
R. Wallace ◽  
...  
Keyword(s):  
Surface Layer ◽  
Silicon Wafer ◽  
Silicon Oxide ◽  
Secondary Ion Mass Spectrometry ◽  
Low Cost ◽  
Defect Layer ◽  
Oxide Semiconductor ◽  
Implantation Energy ◽  
Type Silicon ◽  
P Type

AbstractA new silicon material, silicon-on-defect-layer (SODL), has been measured by secondary ion mass spectrometry (SIMS) and spreading resistivity (SR) measurements. SIMS data show that the buried defect-layer in SODL consists of silicon oxide due to the gettering of intrinsic oxygen by proton-implanted damage. Furthermore, SODL procedure makes a silicon wafer contain much fewer oxygen in surface-layer on the defect-layer, resulting in a purfied surface-layer. Measurements of SR indicate that the surface-layer of n-type silicon wafer was converted to p-type silicon after SODL procedure. A metal oxide semiconductor (MOS) device with a value of the electron mobility in the inversion mode of 714 cm2/(V s) was fabricated on SODL material. Like isolation function of a well in a complementary MOS (CMOS) device, the p-n junction in SODL material could play a role of isolation between the surface-layer and bulk. In addition, by reducing the implantation energy, SODL technology for making p-n junction, in which built-in field separates light-generated electrons and holes, is a candidate to make cheap solar cells by using low-quality low-cost silicon.

Band-Bending Effects on Field Electron Emission From N- and P-Type Silicon Gated Emitter Tips

1999 ◽  
Vol 558 ◽  
Author(s):  
T. Matsukawa ◽  
K. Tokunaga ◽  
S. Kanemaru ◽  
J. Itoh
Keyword(s):  
Field Emission ◽  
Potential Barrier ◽  
Device Simulation ◽  
Surface States ◽  
Emission Characteristics ◽  
Band Bending ◽  
Type Silicon ◽  
Current Voltage ◽  
Current Voltage Characteristics ◽  
P Type

ABSTRACTField emission characteristics from n- and p-type silicon gated emitter tips have been investigated in detail by means of experiments and theoretical estimation of band-bending induced by surface states. Single-tip emitters have been fabricated from n- and p-type silicon and their current-voltage characteristics have been evaluated. The field emission from the p-type emitter has been found to occur at lower extraction voltage than that of the n-type emitter. As the theoretical approach to the origin of the phenomena, potential distribution in the emitter tips has been calculated by using device simulation technique. The surface states of the n-type emitter tip are negatively charged and form a potential barrier against the electrons. On the contrary, there is no potential barrier in the p-type tips. The potential barrier in the n-type tip prevents electrons from reaching the tip apex. This is the reason why the emission current of the n-type emitter was suppressed lower than that of the p-type emitter.

Si1−xGex Bulk Crystals Growth and PN Junction Formation by Diffusing Phosphorus

1999 ◽  
Vol 607 ◽  
Author(s):  
S. Kato ◽  
T. Horikoshi ◽  
T. Ohkubo ◽  
T. Iida ◽  
Y. Takano
Keyword(s):  
Silicon Germanium ◽  
Bulk Crystals ◽  
Temperature Dependent ◽  
Alloy Scattering ◽  
Self Diffusion ◽  
Pn Junction ◽  
Current Voltage ◽  
Vertical Bridgman ◽  
Current Voltage Characteristics ◽  
P Type

AbstractThe bulk crystal of silicon germanium was grown by vertical Bridgman method with germanium composition, x, varying from 0.6 to 1.0. The temperature dependent variation of the mobility is indicative of alloy scattering dominantly for the bulk wafer. Phosphorus was diffused in as-grown p-type bulk wafer at 850 °C to form pn-junction, and the diffusion coefficient of phosphorus was evaluated as a function of x. The diffusion behavior of phosphorus in silicon germanium is closely correlated with the germanium self-diffusion with changing x. For specimens with lower content x, P concentration profiles indicated “kink and tail” shape, while it was not observed for higher x. For current-voltage characteristics measurement, an ideality factor was obtained.

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