scholarly journals Roughness development in electrodeposited soft magnetic CoNiFe films in the presence of organic additives

2003 ◽  
Vol 68 (4-5) ◽  
pp. 349-361 ◽  
Author(s):  
Ibro Tabakovic ◽  
Steve Riemer
Keyword(s):  
Dynamic Scaling ◽  
Scaling Analysis ◽  
Lauryl Sulfate ◽  
Organic Additives ◽  
Plating Bath ◽  
Force Microscopy ◽  
Kinetic Roughening ◽  
Polar Species ◽  
Atomic Force ◽  
Hydrogen Bubbles

The effects of three additives, sodium lauryl sulfate (NaLS), saccharin (Sacc), and NaLS + Sacc, on roughness development during the electrodeposition of CoNiFe films were investigated. The characterization of these films by atomic force microscopy shows that the electrodeposits produced from NaLS containing solution result in a rough surface. The role of NaLS surfactant is to change the interfacial tension and clean non-polar species like hydrogen bubbles from the surface. In Sacc containing solution the evolution of a smooth surface is controlled by adsorbed Sacc molecule at the interface. The kinetic roughening of these deposits was investigated by dynamic scaling analysis. It was demonstrated that the roughness of CoNiFe films, obtained in the presence of NaLS + Sacc additives, was also dependent on current density, roughness of substrate, and the temperature of plating bath.

Scaling Analysis of a- and poly-Si Surface Roughness by Atomic Force Microscopy

1994 ◽  
Vol 367 ◽  
Author(s):  
T. Yoshinobu ◽  
A. Iwamoto ◽  
K. Sudoh ◽  
H. Iwasaki
Keyword(s):  
Surface Roughness ◽  
Atomic Force Microscopy ◽  
Surface Area ◽  
Scaling Behavior ◽  
Linear Size ◽  
Scaling Analysis ◽  
Macroscopic Scale ◽  
Force Microscopy ◽  
Atomic Force ◽  
Roughness Exponent

AbstractThe scaling behavior of the surface roughness of a-and poly-Si deposited on Si was investigated by atomic force microscopy (AFM). The interface width W(L), defined as the rms roughness as a function of the linear size of the surface area, was calculated from various sizes of AFM images. W(L) increased as a power of L with the roughness exponent ∝ on shorter length scales, and saturated at a constant value of on a macroscopic scale. The value of roughness exponent a was 0.48 and 0.90 for a-and poly-Si, respectively, and σ was 1.5 and 13.6nm for 350nm-thick a-Si and 500nm-thick poly-Si, respectively. The AFM images were compared with the surfaces generated by simulation.

scholarly journals Microstructure and corrosion behavior of Zn-Co alloys deposited from three different plating baths

2011 ◽  
Vol 76 (11) ◽  
pp. 1537-1550 ◽  
Author(s):  
Jelena Bajat ◽  
Sanja Stevanovic ◽  
Bojan Jokic
Keyword(s):  
Crystallite Size ◽  
Open Circuit ◽  
Plating Bath ◽  
Corrosion Stability ◽  
Force Microscopy ◽  
Atomic Force ◽  
Sulphate Chloride ◽  
Chemical Content ◽  
Lower Corrosion Rate ◽  
Co Alloys

The effects of plating baths of different composition on the microstructure and corrosion stability of Zn-Co alloy coatings were studied. Zn-Co alloys with the same Co content were deposited from chloride plating baths containing different amounts of Co2+ ions, as well as from a sulphate-chloride plating bath. The surface morphology and crystallite size were investigated by scanning electron microscopy (SEM) and atomic force microscopy (AFM). The corrosion stability of the Zn- Co alloys was determined by following the change of the open circuit potential with time of immersion in a 3 % NaCl solution and by polarization measurements. The results showed a significant influence of the plating bath on the morphology and corrosion stability of the Zn-Co alloys. The surface of the alloy coatings deposited from the chloride baths were uniform and homogenous, whereas the deposit obtained from the sulphate-chloride bath was quite inhomogeneous. The corrosion stability of the homogenous Zn-Co deposits obtained by deposition from both chloride baths was higher than that of the deposit obtained from the sulphate-chloride bath. An increase in the Co content in the chlorideplating bath resulted in a reduction of the alloy crystallite size and it was shown that the alloy with the smaller crystallites of the two alloy deposits, although having the same chemical content, exhibited a lower corrosion rate.

Scaling Analysis ofSiO2/Si Interface Roughness by Atomic Force Microscopy

1994 ◽  
Vol 33 (Part 1, No. 1B) ◽  
pp. 383-387 ◽  
Author(s):  
Tatsuo Yoshinobu ◽  
Atsushi Iwamoto ◽  
Hiroshi Iwasaki
Keyword(s):  
Atomic Force Microscopy ◽  
Interface Roughness ◽  
Scaling Analysis ◽  
Force Microscopy ◽  
Atomic Force

Scaling analysis of Fe-implanted Ge surfaces using atomic force microscopy

2002 ◽  
Vol 48 (2-3) ◽  
pp. 241-247
Author(s):  
R. Venugopal ◽  
B. Sundaravel ◽  
I.H. Wilson ◽  
J.B. Xu
Keyword(s):  
Atomic Force Microscopy ◽  
Scaling Analysis ◽  
Force Microscopy ◽  
Atomic Force

Dynamic Scaling in Electrochemical Deposition

1994 ◽  
Vol 367 ◽  
Author(s):  
Hiroshi Iwasaki ◽  
Atsushi Iwamoto ◽  
Koichi Sudoh ◽  
Tatsuo Yoshinobu
Keyword(s):  
Electrochemical Deposition ◽  
Numerical Solutions ◽  
Additional Term ◽  
Organic Additive ◽  
Scaling Behavior ◽  
Dynamic Scaling ◽  
Length Scales ◽  
Force Microscopy ◽  
Atomic Force ◽  
Stable Growth

AbstractStatic and dynamic scaling behavior in copper electrochemical deposition in the stable growth condition (non-bulk fractal growth) was studied by atomic force microscopy and numerical simulation. We found two distinct scaling regimes with roughness exponent α of 0.6 and 0.87α0.05 corresponding to the concentrations of the “brightener” organic additive higher and lower than 1 mℓ/ℓ, respectively. The rms surface width of the whole measured area of the surfaces in the former regime was smaller than that in the latter regime. For the latter rougher surface, we observed dynamic scaling behavior for longer length scales as well as the stationary scaling behavior for shorter length scales: surface width did not further increase with linear size of the area for longer length scales than a characteristic correlation length and increased as a power of deposition time with the dynamic exponent β of 0.45. The sum of α + (α/β) was larger than the value expected for KPZ local growth, 2. This was understood that in electrochemical deposition there is enhancement of growth at protrusions owing to non-local Laplacian field effect. The smoother (α =0.6) and the rougher (0.87) surfaces were reproduced by numerical solutions of KPZ + (the growth term proportional to height) for the shorter and the longer growth times, respectively. Bifurcation of the surface morphology is understood as a result of decrease of weight of the additional term owing to increase of the additive.

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