Photonic integration of Er3+:Y₂SiO₅ and thin-film lithium niobate by flip chip bonding
Likai Yang
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Sihao Wang
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Mohan Shen
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Yuntao Xu
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Jia-Cheng Xie
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...
R. Bonda
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T. Fang
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B. Hileman
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D. Spigler
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J. Stafford
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...
D.L. Smith
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D.K. Fork
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R.L. Thornton
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A.S. Alimonda
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C.L. Chua
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...
2015 ◽
Vol 56
(10)
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pp. 1719-1724
Kang-Je Shin
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Tae-Sung Oh
2005 ◽
Vol 88
(4)
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pp. 37-45
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Naoya Tamaki
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Norio Masuda
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Toshihide Kuriyama
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Jin-Ching Bu
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Masahiro Yamaguchi
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...
2012 ◽
Vol 53
(12)
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pp. 2160-2165
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Min-Young Kim
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Tae-Sung Oh
2015 ◽
Vol 44
(6)
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pp. 2026-2033
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Kang-Je Shin
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Tae-Sung Oh
2019 ◽
Vol 95
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pp. 48-53
Chun-Han Ku
◽
Wei-Kai Wang
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Ray-Hua Horng
Yi Zhang
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Liang Wang
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Yang Zou
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Qinwen Xu
◽
Jieyu Liu
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...
2021 ◽
Vol 13
(2)
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pp. 1-9
Xingrui Huang
◽
Yang Liu
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Zezheng Li
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Huan Guan
◽
Qingquan Wei
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...
Peian Li
◽
Xu Zhang
◽
Wing Cheung Chong
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Kei May Lau