scholarly journals Aging Effect on Adhesion Strength between Electroless Copper and Polyimide Films

2013 ◽  
Vol 54 (6) ◽  
pp. 1040-1044 ◽  
Author(s):  
Ho-Nyun Lee ◽  
Yoonsung Han ◽  
Jang-hun Lee ◽  
Jin-Young Hur ◽  
Hong Kee Lee
Keyword(s):  
Adhesion Strength ◽  
Aging Effect ◽  
Polyimide Films ◽  
Electroless Copper

Plasma Treatment and Surface Analysis of Polyimide Films for Electroless Copper Buildup Process

2005 ◽  
Vol 152 (10) ◽  
pp. F162 ◽  
Author(s):  
Dhananjay Bhusari ◽  
Harley Hayden ◽  
Ravindra Tanikella ◽  
Sue Ann Bidstrup Allen ◽  
Paul A. Kohl
Keyword(s):  
Plasma Treatment ◽  
Surface Analysis ◽  
Polyimide Films ◽  
Electroless Copper

scholarly journals Photocatalytic Surface Modification of PI Film for Electroless Copper Plating

2018 ◽  
Vol 2018 ◽  
pp. 1-8 ◽  
Author(s):  
Wenxia Zhao ◽  
Zenglin Wang ◽  
Liang Qiao ◽  
Shiwei Liu ◽  
Hongjian Zhao ◽  
...  
Keyword(s):  
Contact Angle ◽  
Surface Modification ◽  
Adhesion Strength ◽  
Photoelectron Spectroscopy ◽  
Carboxyl Groups ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Surface Contact ◽  
Surface Contact Angle ◽  
Surface Modified

This study investigated the surface modification of polyimide (PI) film through TiO2 photocatalytic treatment. The effects of TiO2 content, treatment duration, and UV power on the surface topography, surface contact angle, and adhesion strength of the surface-modified PI films were investigated. The results indicated that, after surface modification under the optimal photocatalytic conditions, the surface contact angle of the PI film decreased from 84.4° to 38.8°, and the adhesion strength between the PI film and the electroless copper film reached 0.78 kN/m. X-ray photoelectron spectroscopy analysis further demonstrated that carboxyl groups formed on the surface of the PI film after photocatalytic treatment. The surface hydrophilicity and adhesion strength of the surface-modified PI film were enhanced due to the numerous carboxyl groups formed on its surface. Therefore, the photocatalytic treatment is an environmentally friendly and effective method for the surface modification of PI films.

scholarly journals Effect of Additional Electrical Current on Adhesion Strength between Copper and Polyimide Films

2013 ◽  
Vol 46 (1) ◽  
pp. 9-15 ◽  
Author(s):  
Jang-Hun Lee ◽  
Yoonsung Han ◽  
Ho-Nyun Lee ◽  
Jin-Young Hur ◽  
Hong Kee Lee
Keyword(s):  
Adhesion Strength ◽  
Electrical Current ◽  
Polyimide Films

scholarly journals Correction to: Study on Aging Effect of Adhesion Strength Between Polyimide Film and Copper Layer

2019 ◽  
Vol 25 (3) ◽  
pp. 821-821
Author(s):  
Seok-Bon Koo ◽  
Chang-Myeon Lee ◽  
Sang-Jun Kwon ◽  
Jun-Mi Jeon ◽  
Jin-young Hur ◽  
...  
Keyword(s):  
Adhesion Strength ◽  
Aging Effect ◽  
Polyimide Film ◽  
Copper Layer

A saw Sensor Study of the Relative Adhesion and Surface Properties of Polyimide Films

1991 ◽  
Vol 239 ◽  
Author(s):  
D. W. Galipeau ◽  
C. Feger ◽  
J. F. Veteldmo
Keyword(s):  
Surface Properties ◽  
Adhesion Strength ◽  
Film Surface ◽  
Quantitative Measure ◽  
Polyimide Film ◽  
Polyimide Films ◽  
Adhesion Promoter ◽  
Saw Sensor ◽  
Humidity Response ◽  
In Situ Sensor

ABSTRACTA surface acoustic wave (SAW) sensor is used to study the relative humidity response of polyimide films where interfacial and surface properties are varied. The relationship between these responses and the relative adhesion strength of these films is of particular interest since it could have application as a nondestructive, quantitative measure of adhesion strength. The results show clear differences in the SAW humidity response for cured and uncured films. There are also significant differences in the SAW humidity response for films applied with and without adhesion promoter. In addition the humidity response has proven to be particularly sensitive to the surface treatment of the polyimide film. These results suggest applications of the SAW sensor as a cure indicator, an in-situ sensor for the monitoring of film surface properties in process control applications and as an adhesion sensor.

Adhesion Strength of CuCr Alloy Films to Polyimide

1995 ◽  
Vol 390 ◽  
Author(s):  
E. C. Ahn ◽  
Jin Yu ◽  
I. S. Park
Keyword(s):  
Thin Films ◽  
Adhesion Strength ◽  
Hold Time ◽  
Peel Strength ◽  
Alloy Layer ◽  
Polyimide Films ◽  
Alloy Films ◽  
Cr Content ◽  
Sputter Deposited

ABSTRACTIn the present work, CuCr alloys with varying Cr content were sputter deposited on polyimide films, and the metal/polyimide thin films were maintained under 85° C/85%R.H. (T/H) conditions for the reliability measurements. Results showed that the peel strength without T/H treatments increased proportionally with the Cr content in the CuCr alloy layer(x) up to 17 at. %, and then saturated. Among the samples studied, the peel strength decreased with hold time under T/H conditions for all the cases, but most drastically for the sample with x=8.5. The very poor peel strength of that sample (x=8.5) was attributed to the occurrence of interfacial failures which were thought to take place along Cr-oxide/polyimide interfaces.

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