Laser high speed single-ply cutting of automotive air-bag material versus multi-ply laser cutting

Author(s):  
Robert Dworkowski
Keyword(s):  
2009 ◽  
Vol 51 (7-8) ◽  
pp. 352-355 ◽  
Author(s):  
L. E. Afanas’eva ◽  
I. A. Barabonova ◽  
N. S. Zubkov ◽  
M. S. Razumov

2021 ◽  
Vol 1135 (1) ◽  
pp. 012014
Author(s):  
Nikita Levichev ◽  
Joost R. Duflou

Abstract Laser cutting is a well-established industrial process for sheet metal applications. However, cutting thick plates is still accompanied by problems because of the characteristic limited process parameter window. Since cutting by means of fiber lasers has become dominant, tailored solutions are required in such systems for industrial applications. The development of a robust real-time monitoring system, which adapts the process parameters according to a specific quality requirement, implies a significant step forward towards automated laser cutting and increases the process robustness and performance. In this work, a coaxial multi-sensor monitoring system is tested for fiber laser cutting of stainless steel thick plates. A high-speed camera and a photodiode sensor have been selected for this investigation. Experiments at different cutting speeds, representing primary cut quality cases, have been conducted and various features of the obtained process zone signals have been examined. Finally, the feasibility of industrial application of the developed setup for high-power fiber laser cutting is discussed, followed by several implementation recommendations.


2017 ◽  
Vol 24 (1) ◽  
pp. 91-101
Author(s):  
Won Yong Choi ◽  
Sung-Hoon Choa
Keyword(s):  

2014 ◽  
Vol 26 (4) ◽  
pp. 042004 ◽  
Author(s):  
Grigory V. Ermolaev ◽  
Petr V. Yudin ◽  
Francis Briand ◽  
Alexandr V. Zaitsev ◽  
Oleg B. Kovalev

2014 ◽  
Vol 881-883 ◽  
pp. 1469-1474 ◽  
Author(s):  
Li Jun Xin ◽  
Zhi Yong Wang

In view of the cutting speed reduced and cutting quality became poor because cutting front changes to flat and amount of lag changes to large, light-gas eccentrically cutting method was proposed. Through the experiment and analysis of the results, the conclusion can be obtained that when laser beam is before gas jet, cutting speed can be improved. While offset distance have impacts to cutting result. If the offset distance is too small, it has no difference with light - gas coaxial cutting; if the offset distance is too large, it weakens the gas jet at the cutting surface, which is not conducive to cutting. It can achieve the best results when the offset distance is 0.3mm.The cutting quality with 1.5mm diameter nozzle is better than that of 2mm. Therefore within the allowable range in the offset distance the nozzle aperture should be reduced.


2020 ◽  
Vol 20 (11) ◽  
pp. 6653-6658
Author(s):  
Jeong Eun Park ◽  
So Mang Park ◽  
Won Seok Choi ◽  
Jae Joon Jang ◽  
Donggun Lim

A shingled module fabricated using electrically conductive adhesive (ECA) can increase the light-receiving area and provide greater power than a conventional module fabricated using solder-coated copper ribbons. However, several issues such as damage from laser cutting and poor contact by the conductive paste may arise. In this study, a 15.675 × 3.1 cm2 c-Si cut cell was fabricated using a nanosecond green laser, and cell bonding was performed using ECA to fabricate shingled modules. If the laser process was performed with high speed and low power, there was insufficient depth for cut cell fabrication. This was because the laser only had a thermal effect on the surface. The cell was processed to a depth of approximately 46 μm by the laser, and it could be seen that the laser cutting proceeded smoothly when the laser process affected more than 25% of the wafer thickness. The cut cell was bonded by ECA, and the process conditions were changed. The highest efficiency of 20.27% was obtained for a cell bonded under the conditions of a curing time of 60 s and curing temperature of 150°C. As a result, the efficiency of the bonded cell was increased by approximately 2.67% compared to the efficiency of the conventional cut cell. This was because the shadow loss due to the busbar was reduced, increasing the active area of the module by eliminating the busbar from the illuminated area.


2006 ◽  
Author(s):  
Karl L. Boehlen ◽  
Phil T. Rumsby ◽  
Neil Sykes ◽  
Céline Lefevre

2017 ◽  
Vol 94 ◽  
pp. 244-247 ◽  
Author(s):  
Jae Sung Shin ◽  
Seong Yong Oh ◽  
Hyunmin Park ◽  
Chin-Man Chung ◽  
Sangwoo Seon ◽  
...  

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