Sintered Ag joints on copper lead frame TO220 by pressure sintering process with improved reliability and bonding strength

2017 ◽  
Author(s):  
Ly May Chew ◽  
Wolfgang Schmitt ◽  
Jens Nachreiner ◽  
Daniel Schnee
Keyword(s):  
Bonding Strength ◽  
Lead Frame ◽  
Sintering Process ◽  
Sintered Ag ◽  
Copper Lead

Backside Mechanical Preparation Methodology for Effective Failure Analysis on Small and Non-Exposed Die Paddle Package

2018 ◽  
Author(s):  
Ong Pei Hoon ◽  
Ng Kiong Kay ◽  
Gwee Hoon Yen
Keyword(s):  
Failure Analysis ◽  
Chemical Etching ◽  
Chemical Resistance ◽  
Etching Time ◽  
Lead Frame ◽  
Front Side ◽  
Electrical Measurements ◽  
Mechanical Preparation ◽  
Die Surface ◽  
Copper Lead

Abstract Chemical etching is commonly used in exposing the die surface from die front-side and die backside because of its quick etching time, burr-free and stress-free. However, this technique is risky when performing copper lead frame etching during backside preparation on small and non-exposed die paddle package. The drawback of this technique is that the copper leads will be over etched by 65% Acid Nitric Fuming even though the device’s leads are protected by chemical resistance tape. Consequently, the device is not able to proceed to any other further electrical measurements. Therefore, we introduced mechanical preparation as an alternative solution to replace the existing procedure. With the new method, we are able to ensure the copper leads are intact for the electrical measurements to improve the effectiveness and accuracy of physical failure analysis.

Development of moisture-proof thin and large QFP with copper lead frame

2002 ◽  
Author(s):  
T. Mino ◽  
K. Sawada ◽  
A. Kurosu ◽  
M. Otsuka ◽  
N. Kawamura ◽  
...  
Keyword(s):  
Lead Frame ◽  
Copper Lead

Copper lead frame: an ultimate solution to the reliability of BLP package

2000 ◽  
Vol 23 (1) ◽  
pp. 32-38 ◽  
Author(s):  
Kwang-Seong Choi ◽  
Teck-Gyu Kang ◽  
Ik-Seong Park ◽  
Jong-Hyun Lee ◽  
Ki-Bon Cha
Keyword(s):  
Lead Frame ◽  
Copper Lead

Adhesion improvement of epoxy resin/copper lead frame j oints by azole compounds

1998 ◽  
Vol 12 (5) ◽  
pp. 541-561 ◽  
Author(s):  
S.M. Song ◽  
C.E. Park ◽  
H.K. Yun ◽  
C.S. Hwang ◽  
S.Y. Oh ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Lead Frame ◽  
Copper Lead

Effect of CU Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

2020 ◽  
Author(s):  
Yang Liu ◽  
Zhao Li ◽  
Min Zhou ◽  
Xianghua Zeng ◽  
Fenglian Sun
Keyword(s):  
Shear Strength ◽  
Mechanical Behavior ◽  
Bonding Strength ◽  
Experimental Results ◽  
Bonding Quality ◽  
Deformation Ratio ◽  
Coated Layer ◽  
Ag Paste ◽  
Sintered Ag ◽  
Cu Foam

Abstract Cu foam (Cu-F) and Ag-coated Cu-F were added into nano-Ag paste to obtain Cu-F@nano-Ag composite sintered joint. The microstructure, hardness, and shear behavior of the sintered joints were investigated. Experimental results indicated that the addition of Cu-F and Ag-coated Cu-F suppressed the generation and propagation of cracks at the interface of the sintered joint. As the thickness of the Cu-F increased from 0.1mm to 0.2mm, the deformation ratio of the Cu-F sheet raised from 12 % to 50 %. Thereby, the hardness and bonding strength of the sintered joint was improved due to the microstructural densification. The bonding quality between Cu-F and sintered Ag is enhanced by the Ag-coating treatment. Therefore, the Ag-coated composite joints show higher shear strength than the others.

Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering

2009 ◽  
Author(s):  
Kisho Ashida ◽  
Kenya Kawano ◽  
Naotaka Tanaka ◽  
Atsushi Nishikizawa ◽  
Nobuya Koike
Keyword(s):  
Fracture Strength ◽  
Bending Test ◽  
Lead Frame ◽  
Reflow Soldering ◽  
Strength Evaluation ◽  
Silver Paste ◽  
Three Point Bending ◽  
Soldering Process ◽  
Die Bonding ◽  
Copper Lead

Evaluating silver paste strength for die bonding during the reflow soldering process is important, as silver paste fracturing is one of the main causes of package failure. First, we assumed that the fracturing was caused by thermal stress and vapor pressure at the interface between the resin and the copper lead frame. Next, we measured the silver paste fracture strength using a three-point bending test and a bonded specimen with silver paste. Finally, we predicted the occurrence of silver paste fracturing by calculating the silver paste stress during reflow soldering process and comparing it with the measured fracture strength. Results obtained in strength evaluation analysis were consistent with those obtained in package reflow tests, indicating that this method can be used to predict the occurrence of silver paste fracturing.

Silicone die bond adhesive and clean in-line cure for copper lead frame

1990 ◽  
Vol 13 (4) ◽  
pp. 883-887 ◽  
Author(s):  
K. Suzuki ◽  
T. Higashino ◽  
K. Tsubosaki ◽  
A. Kabashima ◽  
K. Mine ◽  
...  
Keyword(s):  
Lead Frame ◽  
Copper Lead

COPPER ALLOY No. C15100

Alloy Digest ◽  
1994 ◽  
Vol 43 (10) ◽  
Keyword(s):  
Physical Properties ◽  
Tensile Properties ◽  
Copper Alloy ◽  
Heat Treating ◽  
Lead Frame ◽  
Zirconium Copper ◽  
Copper Lead

Abstract Copper Alloy No. C15100 is an age-hardenable zirconium-copper lead frame alloy. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as fatigue. It also includes information on forming, heat treating, machining, and joining. Filing Code: CU-552. Producer or source: Copper and copper alloy mills. Originally published April 1990, revised October 1994.

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