Stencil Printing and Flip-Chip Bonding for Assembly of Pixelated X-ray Detectors using PCB-type Interposer and Flexible Printed Circuit Boards
Keyword(s):
X Ray
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2009 ◽
Vol 85
(6)
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pp. 341-350
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Keyword(s):
2008 ◽
Vol 47
(5)
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pp. 4300-4304
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Keyword(s):
2008 ◽
Vol 21
(1)
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pp. 107-112
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Keyword(s):
2007 ◽
Vol 18
(1)
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pp. 017001
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Keyword(s):
2017 ◽
Vol 96
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pp. 393-402
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Keyword(s):
2013 ◽
Vol 655-657
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pp. 88-93
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1996 ◽
Vol 19
(3)
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pp. 644-660
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Keyword(s):