Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates

IEEE Transactions on Components Packaging and Manufacturing Technology Part B ◽

10.1109/96.533908 ◽

1996 ◽

Vol 19 (3) ◽

pp. 644-660 ◽

Author(s):

Zonghe Lai ◽

Johan Liu

Keyword(s):

Flip Chip ◽

Conductive Adhesive ◽

Printed Circuit ◽

Flip Chip Bonding ◽

Flexible Printed Circuit

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Stencil Printing and Flip-Chip Bonding for Assembly of Pixelated X-ray Detectors using PCB-type Interposer and Flexible Printed Circuit Boards

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ◽

10.23919/empc44848.2019.8951835 ◽

2019 ◽

Author(s):

Andreas Schneider ◽

Simon P. Cross ◽

Matthew D. Wilson ◽

Matthew C. Veale ◽

Matthew Hart ◽

...

Keyword(s):

Flip Chip ◽

Printed Circuit Boards ◽

Circuit Boards ◽

Stencil Printing ◽

X Ray ◽

Printed Circuit ◽

Flip Chip Bonding ◽

Flexible Printed Circuit

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Development of ultrasonic flip chip bonding for flexible printed circuit

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) ◽

10.1109/hpd.2004.1346717 ◽

2004 ◽

Author(s):

H. Maruo ◽

Y. Seki ◽

Y. Unami

Keyword(s):

Flip Chip ◽

Printed Circuit ◽

Flip Chip Bonding ◽

Flexible Printed Circuit

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Thermoelectric Power-Generation Characteristics of a Thin-Film Device Processed by the Flip-Chip Bonding of Bi2Te3 and Sb2Te3 Thin-Film Legs Using an Anisotropic Conductive Adhesive

MATERIALS TRANSACTIONS ◽

10.2320/matertrans.m2015236 ◽

2015 ◽

Vol 56 (10) ◽

pp. 1719-1724

Author(s):

Kang-Je Shin ◽

Tae-Sung Oh

Keyword(s):

Thin Film ◽

Power Generation ◽

Thermoelectric Power ◽

Flip Chip ◽

Conductive Adhesive ◽

Thermoelectric Power Generation ◽

Thin Film Device ◽

Anisotropic Conductive Adhesive ◽

Flip Chip Bonding

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Bismuth-filled anisotropically conductive adhesive for flip chip bonding

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) ◽

10.1109/adhes.2000.860589 ◽

2002 ◽

Author(s):

M. Vuorela ◽

M. Holloway ◽

S. Fuchs ◽

F. Stam ◽

J. Kivilahti

Keyword(s):

Flip Chip ◽

Conductive Adhesive ◽

Flip Chip Bonding

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High performance ball grid array utilizing flip chip bonding on buildup printed circuit board

Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium IEMT-97 ◽

10.1109/iemt.1997.626947 ◽

2002 ◽

Author(s):

K. Yamanaka ◽

H. Mori ◽

Y. Tsukada

Keyword(s):

High Performance ◽

Flip Chip ◽

Printed Circuit Board ◽

Ball Grid Array ◽

Circuit Board ◽

Printed Circuit ◽

Flip Chip Bonding

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Ultrasonic bonding of fine-pitch Au stud flip chip bump with flexible printed circuit board

10.3728/icultrasonics.2007.vienna.1632_koo ◽

2007 ◽

Author(s):

Ja-Myeong Koo ◽

Yu-Na Kim ◽

Jong-Bum Lee ◽

Jung-Lae Jo ◽

Jeong-Won Yoon ◽

...

Keyword(s):

Flip Chip ◽

Printed Circuit Board ◽

Circuit Board ◽

Printed Circuit ◽

Ultrasonic Bonding ◽

Flexible Printed Circuit

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Adhesive and conductive adhesive flip chip bonding

Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces ◽

10.1109/isapm.1997.581272 ◽

2002 ◽

Author(s):

R.L.D. Zenner ◽

G. Connell ◽

J.A. Gerber

Keyword(s):

Flip Chip ◽

Conductive Adhesive ◽

Flip Chip Bonding

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Plasma cleaning of the flex substrate for flip-chip bonding with anisotropic conductive adhesive film

Journal of Electronic Materials ◽

10.1007/s11664-003-0097-z ◽

2003 ◽

Vol 32 (10) ◽

pp. 1117-1124 ◽

Author(s):

M. A. Uddin ◽

M. O. Alam ◽

Y. C. Chan ◽

H. P. Chan

Keyword(s):

Flip Chip ◽

Conductive Adhesive ◽

Plasma Cleaning ◽

Adhesive Film ◽

Anisotropic Conductive Adhesive ◽

Flip Chip Bonding

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Flip Chip Bonding on Epoxy Base Printed Circuit Board.

Journal of SHM ◽

10.5104/jiep1993.13.12 ◽

1997 ◽

Vol 13 (1) ◽

pp. 12-18

Author(s):

Yutaka Tsukada

Keyword(s):

Flip Chip ◽

Printed Circuit Board ◽

Circuit Board ◽

Printed Circuit ◽

Flip Chip Bonding

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Conductive adhesive flip-chip bonding for bumped and unbumped die

1997 Proceedings 47th Electronic Components and Technology Conference ◽

10.1109/ectc.1997.606181 ◽

2002 ◽

Author(s):

G. Connell ◽

R.L.D. Zenner ◽

J.A. Gerber

Keyword(s):

Flip Chip ◽

Conductive Adhesive ◽

Flip Chip Bonding

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