Design, Fabrication, and Testing of a Variable Conductance Heat Pipe for Equipment Thermal Control

Keyword(s):  
Author(s):  
Alejandro Torres ◽  
Donatas Mishkinis ◽  
Andrei Kulakov ◽  
Francisco Romera ◽  
Carmen Gregori

Author(s):  
Randeep Singh ◽  
Aliakbar Akbarzadeh ◽  
Masataka Mochizuki ◽  
Thang Nguyen ◽  
Vijit Wuttijumnong

Loop heat pipe (LHP) is a very versatile heat transfer device that uses capillary forces developed in the wick structure and latent heat of evaporation of the working fluid to carry high heat loads over considerable distances. Robust behaviour and temperature control capabilities of this device has enable it to score an edge over the traditional heat pipes. In the past, LHPs has been invariably assessed for electronic cooling at large scale. As the size of the thermal footprint and available space is going down drastically, miniature size of the LHP has to be developed. In this paper, results of the investigation on the miniature LHP (mLHP) for thermal control of electronic devices with heat dissipation capacity of up to 70 W have been discussed. Copper mLHP with disk-shaped flat evaporator 30 mm in diameter and 10 mm thickness was developed. Flat evaporators are easy to attach to the heat source without any need of cylinder-plane-reducer saddle that creates additional thermal resistance in the case of cylindrical evaporators. Wick structure made from sintered nickel powder with pore size of 3–5 μm was able to provide adequate capillary forces for the continuos circulation of the working fluid, and successfully transport heat load at the required distance of 60 mm. Heat was transferred using 3 mm ID copper tube with vapour and liquid lines of 60 mm and 200 mm length respectively. mLHP showed very reliable start up at different heat loads and was able to achieve steady state without any symptoms of wick dry-out. Tests were conducted on the mLHP with evaporator and condenser at the same level. Total thermal resistance, R total of the mLHP came out to be in the range of 1–4°C/W. It is concluded from the outcomes of the investigation that mLHP with flat evaporator can be effectively used for the thermal control of the electronic equipments with restricted space and high heat flux chipsets.


2009 ◽  
Author(s):  
Leonid Vasiliev ◽  
Leonard Vasiliev ◽  
Vladimir Romanenkovand ◽  
Mikchail Rabetsky ◽  
Jean Claude Legros

2006 ◽  
Vol 5 (2) ◽  
pp. 72
Author(s):  
H. A. Machado

In capillary and micro heat pipes the internal porous media is replaced by acapillary groove, yielding a meniscus formed by the liquid phase. The meniscus height varies along the groove length, from the condenser section to the evaporator section, and the difference between the pressures in each extremity is responsible for pumping the liquid. Such devices have been employed in electronic cooling, due its small dimensions. This system provides excellent thermal control, assuring uniform temperature distribution. In previous works related to capillary heat pipe simulation, empirical or simple 1-D models have been used, but not taking into account the complete unsteady phenomena. In this work, the 3-D unsteady simulation of a flat micro heat pipe is presented, where the meniscus radius is considered constant along the transversal section. The phase change problem of a heated liquid meniscus in a groove is simulated via an interface tracking method, which is an hybrid Lagrangean-Eulerian method for moving boundary problems. A variation of the one-dimensional Stephan problem is used to validate the numerical code.


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